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Developing Thermal Design Guidelines for Power MOSFETs in a Chassis

Detailed simulations of the thermal behavior of MOSFETs in a closed chassis allow the development of guidelines for improving system design for MOSFET placement in conjunction with the use of fans, grills, and heatsinks.

August 24, 2023 by Toshiaki Hosoya, Toshiba

Understanding and Minimizing Switching Noise Jitter (SNJ)

Switching noise jitter (SNJ) is an important concept to digest and a tricky problem to manage. Learn the background of SNJ and how employing innovative filtering technology can smooth the way.

August 17, 2023 by Steve Taranovich, TransSIP

PCB Stackup Basics and Using Fusion 360’s Stackup Manager

The way your PCB’s layers are arranged has huge implications for the board’s efficiency. Learn the basics of PCB stackups, and how Fusion 360’s stackup tool helps manage your PCB’s layering strategy.

March 09, 2023 by Edwin Robledo, Fusion 360 Electronics

Improve Signal Integrity by Reducing PCB Trace Impedance Variation

Achieving better signal integrity in a PCB design can be a challenge. Learn how PCB trace impedance variation plays a role, and how advanced tools can help smooth the way.

February 09, 2023 by Edwin Robledo, Fusion 360 Electronics

Learn the Fundamentals of CAM: Manufacturing Your PCB

Computer-aided manufacturing (CAM) is a critical part of modern electronics production. It’s helpful to understand the process and how advanced CAM processing tools enable a smooth transition to the production phase.

January 26, 2023 by Edwin Robledo, Fusion 360 Electronics

Thermal Management for Designs Using Discrete Semiconductor Devices

There are several effective ways to manage the high temperatures of today’s discrete semiconductors in your design. Simulation techniques are vital for measuring how well each approach is working.

December 08, 2022 by Toshiaki Hosoya, Toshiba

Using 3D Electronic Component Models to Synch PCB and Enclosure Designs

Designing PCBs and enclosures in parallel is the best way to ensure high-quality system designs. Learn how to use Fusion 360 to marry the 2D domain of PCB design with the 3D domain of mechanical enclosure design.

November 03, 2022 by Edwin Robledo, Fusion 360 Electronics

Silicon Lifecycle Management: Enabling Silicon Visibility Through Intelligent Analysis

Learn about silicon lifecycle management (SLM), what it is, the EDA challenges involved, how it relates to SoC systems, and its overall benefits.

June 09, 2022 by Stephen Crosher and Steve Pateras, Synopsys

The Need for High-Accuracy Ultra-Low Pressure Sensors

Learn about the benefits of board-mounted pressure sensors and the considerations when selecting them.

November 23, 2021 by Craig Sanderson, Sager Electronics

Considerations for Including a Board Mount Pressure Sensor

In this article, find out what board mount pressure sensors are, how they work, their benefits, applications, and how to choose one for a design.

November 19, 2021 by Craig Sanderson, Sager Electronics

High-layer Count (HLC) PCB Technology for the 5G Era

One effective solution to the requirements of 5G technology is the use of HLC (High-layer Count) PCB boards that integrate key features such as skip vias, POVF manufacturing, advanced raw materials, and impedance control.

November 11, 2021 by Sarah Kuang, Kinwong

Design Tips for Protecting High-Speed Interfaces

In this second installment of the "Protect Your Ports! Top Design Tips to Keep Your Communications Connected" series, we explore what protecting high-speed interfaces looks like, including USB, HDMI, DisplayPort, and eSATA.

June 29, 2021 by Todd Phillips, Littelfuse

Protecting Power Over Ethernet (PoE / PoE++) Communications

This article is the first in the "Protect Your Ports! Top Design Tips to Keep Your Communications Connected" series from Littelfuse.

April 14, 2021 by Todd Phillips, Littelfuse

Simplifying EV Power Design by Overcoming the Gate Driver Power Challenge

Power conversion systems in EVs follow the half-bridge configuration. This article explores the IGBT half-bridge design of a high-voltage side (output stage) of the gate driver.

February 16, 2021 by Charlie Ice, Silicon Labs

Nine Factors to Consider for Board-Level Machine Vision Camera Integration

Leveraging board-level cameras offer a variety of benefits. To help identify the right mix of features and design elements, here are some factors to consider when selecting and designing in an embedded machine vision camera.

February 11, 2021 by Brian Cha, FLIR

Understanding and Mitigating Motor Driver Board Parasitics through Simulation

This article explores using PSpice for TI to simulate potential causes for parasitic effects in a motor-drive design and offers design tips to mitigate the negative effects common with high-power motor-drive systems.

February 04, 2021 by Matt Hein, Texas Instruments

Choosing the Right Redriver or Retimer Device to Extend PCIe Protocol Signal Range

Redriver or retimer devices can extend the Peripheral Component Interface Express (PCIe®) protocol signal range. This article discusses how to select the best one for compute system and NVMe™ storage applications today and into the future.  

January 12, 2021 by Tam Do, Microchip

Understanding Multi-Faceted Modeling Within Fusion 360

Documentation within the project pipeline is essential and design modeling is no different. In this article, learn about how to leverage the different modeling methods in Fusion 360.

November 24, 2020 by Sam Sattel, Autodesk

How to Draw, Render, and Animate with Fusion 360

Learn how to use Fusion 360 to develop digital drawings, 3D renderings, and animations to help in the creations of complex designs.

November 12, 2020 by Sam Sattel, Autodesk

Processing Solutions for High-Density PCBs

Designers must consider processing temperatures, producibility, and solder joint integrity of every component as well as higher I/O connectors. This article looks at ways to enable smaller component footprints for high-density PCBs.

November 03, 2020 by Brian Niehoff, Samtec