In this second installment of the "Protect Your Ports! Top Design Tips to Keep Your Communications Connected" series, we explore what protecting high-speed interfaces looks like, including USB, HDMI, DisplayPort, and eSATA.
June 29, 2021 by Todd Phillips
Leveraging board-level cameras offer a variety of benefits. To help identify the right mix of features and design elements, here are some factors to consider when selecting and designing in an embedded machine vision camera.
February 11, 2021 by Brian Cha, FLIR
This article explores using PSpice for TI to simulate potential causes for parasitic effects in a motor-drive design and offers design tips to mitigate the negative effects common with high-power motor-drive systems.
February 04, 2021 by Matt Hein, Texas Instruments
Redriver or retimer devices can extend the Peripheral Component Interface Express (PCIe®) protocol signal range. This article discusses how to select the best one for compute system and NVMe™ storage applications today and into the future.
January 12, 2021 by Tam Do, Microchip
Designers must consider processing temperatures, producibility, and solder joint integrity of every component as well as higher I/O connectors. This article looks at ways to enable smaller component footprints for high-density PCBs.
November 03, 2020 by Brian Niehoff, Samtec
In this article, learn how to enable I2C by allowing the LPC55S69 MCU on the E1 board to communicate with a Bosch BME280 environmental sensor present on the Microe Weather click module.
September 10, 2020 by Mark Dunnett, on Behalf of NXP
MCAD and ECAD have inserted themselves into most design engineers' day-to-day work. Although familiar, both programs have come a long way and are continuing to evolve. In this article, learn the past and future of these design tools.
August 27, 2020 by Sam Sattel, Autodesk
Intel Enpirion PowerSoC modules are DC-DC step-down converters that integrate nearly all the components needed to build a power supply without sacrificing performance or efficiency. These solutions are designed to meet strict FPGA, ASIC, and processor power requirements.
August 25, 2020 by Tamara Lin, Intel
The OKdo E1 development board is only as wide as a coin but contains the LPC55S69 microcontroller, making it suitable for a variety of small production runs and prototypes. Here, get more familiar with the dev board and see how to use its evaluation kit.
August 20, 2020 by Mark Dunnett, on Behalf of NXP
The FixturFab DEV260 development fixture allows designers to debug or configure PCBAs during the development phase. See how it works in this example using the Sparkfun Power Delivery Board.
August 04, 2020 by Duncan Lowder, FixturFab
Intermediate Bus Architecture is an emerging method that power designers are using to conserve PCB space. This article discusses the solution benefits and tradeoffs of adopting this technique, and how it may be scaled to address application-specific requirements.
July 07, 2020 by Tamara Lin, Intel
This article aims to simplify the DC power connector selection process with an overview of types, key specifications, and commonly accepted nomenclature, while also looking at audio and USB connectors in power applications.
June 23, 2020 by Ryan Smoot, CUI Devices
Semiconductor manufacturing is a complex industry and small improvements anywhere in the process can make a big difference to the bottom line. This article discusses the benefits of continually optimizing manufacturing for the semiconductor industry by introducing smart manufacturing solutions.
May 19, 2020 by Tim Hewitt, Siemens Digital Industries Software
In this article, Octopart's Director of Operations for Part Data Geof Lipman explores how traditional CAD modeling needs to change in order for electrical engineers to keep up with product design deadlines.
March 10, 2020 by Geof Lipman, Octopart
OT (operational technology) and IT (informational technology) may have different real-time needs, but they're merged in the TSN (time-sensitive networking) Ethernet-based standards. Learn about the theory and hardware involved in implementing TSN in industrial network design.
August 12, 2021 by Christian Castel, NXP
Connector manufacturers and end-users are rapidly moving away from cadmium plating because it is no longer RoHS and REACH compliant. The health and environmental issues cadmium plating presents have led to revised standards and increasing demand for connector plating solutions that offer harsh environment performance comparable to cadmium but without its environmental side effects.
August 05, 2021 by Achim Raad, ITT Cannon
In this installation of the "Protect Your Ports! Top Design Tips to Keep Your Communications Connected" series, we'll discuss low-speed interfaces and power supply circuits—including audio/video ports, DC power supplies, and more—as well as various methods of how to protect them.
July 11, 2021 by Todd Phillips
This article provides an introduction to microcontroller power management concepts. The NXP i.MX RT500 family of crossover MCUs will be used to provide examples of how these power management concepts can be employed by embedded developers in their applications.
July 08, 2021 by Alejandra Guzman, NXP Semiconductors
In this second installment of the "Protect Your Ports! Top Design Tips to Keep Your Communications Connected" series, we explore what protecting high-speed interfaces looks like, including USB, HDMI, DisplayPort, and eSATA.
June 29, 2021 by Todd Phillips
Learn about multi-threaded programs, developing applications using the XOS real-time operating system, resource sharing with semaphores, and how NXP's i.MX RT500 family of microcontrollers help engineers design DSP-enabled smart devices.
June 24, 2021 by Jason Tseng, NXP Semiconductors
This article discusses the use of an encoder to ensure accurate ongoing tracking of a motor's rotor shaft and the key factors that will help in the selection of the encoder based on different parameters.
March 16, 2021 by Jason Kelly, CUI Devices
