Angstrom-scale ICs will require innovation across the entire semiconductor ecosystem: This will include advances in both the hardware (transistors, power distribution, and connection of multi-die systems) and tools (EDA tools with AI/ML and silicon life-cycle management).
August 31, 2023 by Rob Aitken, Synopsys
There are several effective ways to manage the high temperatures of today’s discrete semiconductors in your design. Simulation techniques are vital for measuring how well each approach is working.
December 08, 2022 by Toshiaki Hosoya, Toshiba
This article explores using PSpice for TI to simulate potential causes for parasitic effects in a motor-drive design and offers design tips to mitigate the negative effects common with high-power motor-drive systems.
February 04, 2021 by Matt Hein, Texas Instruments
In this article, Octopart's Director of Operations for Part Data Geof Lipman explores how traditional CAD modeling needs to change in order for electrical engineers to keep up with product design deadlines.
March 10, 2020 by Geof Lipman, Octopart
With the adoption of artificial intelligence and machine learning in a wide variety of applications, reliability verification of AI/ML processors is critical since failures can have major consequences for the validity and legitimacy of AI/ML technology.
January 21, 2020 by Neel Natekar, Mentor
This article describes a methodology that automates set up, constraints, and results analysis as designs move from static CDC analysis to formal verification to simulation and avoid manual scripting efforts, thus reducing setup effort and errors.
November 14, 2019 by Kurt Takara, Mentor
