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MaxLinear Unveils Control-Plane Portfolio for Next-Gen AI Infrastructure

MaxLinear Unveils Control-Plane Portfolio for Next-Gen AI Infrastructure

RackCommander groups MaxLinear's USB UARTs, RS-485 transceivers, GPIO expanders, and power devices for rack-level management.


News About 14 hours ago by Jake Hertz
Build an Instrumentation Amplifier with Picoamp-Level Input Bias Current

Build an Instrumentation Amplifier with Picoamp-Level Input Bias Current

Discover how the LT1079 quad op-amp minimizes sensor loading in battery-powered designs. Active cancellation and an onboard bridge network ensure maximum precision for resistive sensors.


NXP Launches MCUs Blending 10BASE-T1S Ethernet and Post-Quantum Security

NXP Launches MCUs Blending 10BASE-T1S Ethernet and Post-Quantum Security

The new MCX A5 MCUs integrate 10BASE-T1S Ethernet, topology discovery, and post-quantum security to streamline and protect industrial edge networks.


News Aug 25, 2026 by Jeff Child
Microchip Debuts Rev 2 of Its PolarFire FPGA Ethernet Sensor Bridge

Microchip Debuts Rev 2 of Its PolarFire FPGA Ethernet Sensor Bridge

The new PolarFire FPGA-powered board from Microchip brings multiple sensors to Nvidia edge AI platforms.


News Aug 24, 2026 by Duane Benson
Espressif Unwraps Open-Source Device-to-Cloud-to-Phone IoT Platform

Espressif Unwraps Open-Source Device-to-Cloud-to-Phone IoT Platform

The rebuilt platform puts the previously closed cloud backend under an Apache 2.0 license and runs on AWS serverless services in a customer's own account.


News Aug 24, 2026 by Luke James
Rethinking Storage Architecture for Software-Defined Embedded Systems

Rethinking Storage Architecture for Software-Defined Embedded Systems

As software-defined embedded systems evolve, dynamic storage architectures replace static partitioning to optimize flash efficiency, support long-term updates, and control rising hardware costs.


Arduino-Compatible RS-485 Linear Hall Sensor Board for Magnetic Field Sensing

Arduino-Compatible RS-485 Linear Hall Sensor Board for Magnetic Field Sensing

This project brief describes how to build and use an Arduino-compatible board that reads a linear Hall-effect sensor and reports the measurement over an RS-485 bus.


What’s Next in Wireless Communication? An Insider’s Perspective

What’s Next in Wireless Communication? An Insider’s Perspective

Joaquin Torrecilla, Keysight’s VP of Software Transformation, joins the show to discuss the evolution of wireless tech—from early Bluetooth to LEO satellite lasers, RedCap, and AI-native 6G.


Securing AI from Edge to Cloud with Infineon OPTIGA™ TPM and OPTIGA™ Trust M | Tech Guide

Securing AI from Edge to Cloud with Infineon OPTIGA™ TPM and OPTIGA™ Trust M | Tech Guide

In this Tech Guide, explore how Infineon OPTIGA™ TPM and Trust M secure AI from edge to cloud, protecting data, models, and device identity with hardware-based trust, secure boot, and scalable cloud connectivity. Watch now to get started!


Ceva and Actions Show Off Strengths of Bluetooth HDT in New Audio Chips

Ceva and Actions Show Off Strengths of Bluetooth HDT in New Audio Chips

The ATS296X series from Actions Technology combines Ceva's High Data Throughput radio IP with Actions' own dual-RF design, targeting links of roughly 7.5 Mbps.


News Aug 17, 2026 by Luke James
Silicon Labs Unwraps Its ‘Lowest Power’ BLE SoC Targeting IoT Devices

Silicon Labs Unwraps Its ‘Lowest Power’ BLE SoC Targeting IoT Devices

The EFR32BG2B SoC family supports Bluetooth 6 and is the lowest power Bluetooth LE chip with channel sounding from Silicon Labs.


News Aug 14, 2026 by Duane Benson
Fast, Clear, Low-Power Vision with onsemi AR0145CS Hyperlux™ SG | Tech Guide

Fast, Clear, Low-Power Vision with onsemi AR0145CS Hyperlux™ SG | Tech Guide

In this Tech Guide, explore how the onsemi AR0145CS Hyperlux™ SG Image Sensors deliver fast, clear, low-power vision with global shutter technology, 120 fps performance, and compact design for industrial automation, robotics, drones, AR/VR, and embedded imaging systems. Watch now to get started!


Ambiq Rolls Out Two SoC Series Targeting Edge AI Applications

Ambiq Rolls Out Two SoC Series Targeting Edge AI Applications

The six new chips offer a wide range of connectivity and graphics options for wearables, hearables, AR devices, health monitors, industrial sensors, and beyond.


News Aug 12, 2026 by Duane Benson
Quectel Debuts Wi-Fi 7 Modules With Bluetooth 6.0 for Streaming and Gaming

Quectel Debuts Wi-Fi 7 Modules With Bluetooth 6.0 for Streaming and Gaming

The FCE870X and FME170X share the same high-end feature set across two package formats, giving product teams a choice between embedded and modular designs.


News Aug 10, 2026 by Dale Wilson
SNR Analysis of FM Modulation with Arbitrary Message Signals

SNR Analysis of FM Modulation with Arbitrary Message Signals

Deriving a general signal-to-noise expression for frequency modulation with any message signal reveals a core trade-off: more deviation buys better noise performance, but only by using more bandwidth.


How Electromechanical Switches Deliver Where Digital Interfaces Fall Short

How Electromechanical Switches Deliver Where Digital Interfaces Fall Short

Beyond touchscreens: Learn how physical feedback drives reliability in automotive, consumer, medical, and industrial electronics applications.


Siemens Upgrades Its AI Agent to Enable Self-Verifying Agentic AI EDA Workflows

Siemens Upgrades Its AI Agent to Enable Self-Verifying Agentic AI EDA Workflows

Siemens’ updated Fuse EDA AI Agent validates its own decisions against deterministic, physics-based EDA engines.


News Aug 03, 2026 by Jake Hertz
Business Shorts: Partnerships Advancing AI Factories, Physical AI, and More

Business Shorts: Partnerships Advancing AI Factories, Physical AI, and More

In this edition of Business Shorts, SK Group and Nvidia plan $500 billion in AI infrastructure, TDK and LG Innotek team up on robotic sensing, and Micron locks in automotive memory supply.


News Aug 03, 2026 by Luke James
Hirose Electric IT18 COM-HPC® Low-Profile BGA Mezzanine Connectors | New Product Brief

Hirose Electric IT18 COM-HPC® Low-Profile BGA Mezzanine Connectors | New Product Brief

Hirose Electric IT18 COM-HPC® Low-Profile BGA Mezzanine Connectors provide high-speed, high-density interconnect solutions for next-generation embedded computing platforms. Watch and learn all about their features, specs, applications, and more!


Understanding Noise in FM Systems: The Tone-Modulated Scenario, Part 2

Understanding Noise in FM Systems: The Tone-Modulated Scenario, Part 2

This article explores how combining signal and noise power reveals how the FM system’s output SNR scales with carrier amplitude and modulation index.