All About Circuits

Latest IC Design Articles and Videos

Categories

A Peek Inside the Electronics on the Nancy Grace Roman Space Telescope

A Peek Inside the Electronics on the Nancy Grace Roman Space Telescope

The Nancy Grace Roman Space Telescope’s mirror may get the headlines, but its detector chips, photon-counting cameras, and downlink amplifier tell the electronics story.


News Aug 31, 2026 by Robert Martin
Microchip Debuts Rev 2 of Its PolarFire FPGA Ethernet Sensor Bridge

Microchip Debuts Rev 2 of Its PolarFire FPGA Ethernet Sensor Bridge

The new PolarFire FPGA-powered board from Microchip brings multiple sensors to Nvidia edge AI platforms.


News Aug 24, 2026 by Duane Benson
First-Pass Silicon Success at Advanced Nodes: How to De-Risk Tapeout

First-Pass Silicon Success at Advanced Nodes: How to De-Risk Tapeout

Skyrocketing SoC costs mean traditional testing can't catch every sub-7nm escape. Early formal verification, unified workflows, and strict gated signoffs are key to avoiding costly respins.


Ceva and Actions Show Off Strengths of Bluetooth HDT in New Audio Chips

Ceva and Actions Show Off Strengths of Bluetooth HDT in New Audio Chips

The ATS296X series from Actions Technology combines Ceva's High Data Throughput radio IP with Actions' own dual-RF design, targeting links of roughly 7.5 Mbps.


News Aug 17, 2026 by Luke James
Siemens Upgrades Its AI Agent to Enable Self-Verifying Agentic AI EDA Workflows

Siemens Upgrades Its AI Agent to Enable Self-Verifying Agentic AI EDA Workflows

Siemens’ updated Fuse EDA AI Agent validates its own decisions against deterministic, physics-based EDA engines.


News Aug 03, 2026 by Jake Hertz
MOSIS Partners With GlobalFoundries, Extending 40-Year Prototyping Legacy

MOSIS Partners With GlobalFoundries, Extending 40-Year Prototyping Legacy

The USC-run service that pioneered multi-project wafers in 1981 now offers a path from shared shuttle runs to full production on GlobalFoundries' FinFET and FD-SOI processes.


News Jul 22, 2026 by Luke James
Efinix Seeks to Overcome Edge AI Constraints With New FPGA Family

Efinix Seeks to Overcome Edge AI Constraints With New FPGA Family

The Titanium Edge FPGA family targets constrained edge AI with 50% lower power, compact SiP packages, high-speed MIPI I/O, and robust security/reliability features for intelligent systems.


News Jul 14, 2026 by Austin Futrell
IBM Unveils ‘Smallest, Most Powerful Chip in the World’

IBM Unveils ‘Smallest, Most Powerful Chip in the World’

IBM leveraged its nanostack architecture, a technique that "builds a chip like a city," to pack nearly 100 billion transistors on a fingernail-sized chip.


News Jul 13, 2026 by Austin Futrell
OECD Is Putting Supply Chain, Value Chain, and Subsidies in the Spotlight

OECD Is Putting Supply Chain, Value Chain, and Subsidies in the Spotlight

The OECD is analyzing the semiconductor industry, focusing on supply chain resilience, global value chain mapping, and the impact of rising industrial subsidies on global market competition.


News Jul 09, 2026 by Gordon Feller
Nvidia First to Roll Out Full-Stack Safety System for Physical AI in Robotics

Nvidia First to Roll Out Full-Stack Safety System for Physical AI in Robotics

The full-stack platform pairs the IGX Thor compute module with a safety-certified software stack and an accredited inspection lab, with humanoid maker Agility as the first adopter.


News Jul 06, 2026 by Luke James
France’s Drive to Rebuild a Native Semiconductor Industry

France’s Drive to Rebuild a Native Semiconductor Industry

France’s Électronique 2030 program commits €5B+ to revitalize its semiconductor industry. Learn the details of this ambitious effort, and the market challenges it’s facing.


News Jun 11, 2026 by Gordon Feller
Intel Outfits New Xeon Processors, Networking, and GPUs for Agentic AI

Intel Outfits New Xeon Processors, Networking, and GPUs for Agentic AI

At Computex, Intel described the CPU as the control plane for agentic workloads, pairing new processors and network controllers with fresh details on its inference GPU.


News Jun 05, 2026 by Luke James
Siemens Intros AI-Powered Library Characterizer to Speed IC Design

Siemens Intros AI-Powered Library Characterizer to Speed IC Design

New characterization software delivers 7x throughput gains by combining a predictive AI engine with a purpose-built SPICE simulator.


News Jun 02, 2026 by Luke James
Bricking Proof: Designing Safety-Critical RTL for eFuse Controllers

Bricking Proof: Designing Safety-Critical RTL for eFuse Controllers

An RTL glitch in an eFuse controller can permanently brick costly silicon. This article covers defense-in-depth FSM design, redundant watchdogs, and formal SVA verification.


Accurate High-Voltage Measurement with the Vishay ISO-AC-VSAO Reference Design | Tech Guide

Accurate High-Voltage Measurement with the Vishay ISO-AC-VSAO Reference Design | Tech Guide

In this Tech Guide, learn how the Vishay ISO-AC-VSAO Reference Design enables accurate, isolated high-voltage AC measurement. Watch now to get started!


From Tracking Filters to Demodulation: Exploring the Applications of PLLs

From Tracking Filters to Demodulation: Exploring the Applications of PLLs

In this article, we'll learn about several key applications of PLLs in communication systems, including tracking filters, frequency and phase modulation, and FM and AM demodulation.


Europe’s Chip Ambitions: Why the EU’s Semi Strategy May Fall Short

Europe’s Chip Ambitions: Why the EU’s Semi Strategy May Fall Short

An audit finds that the European Chips Act is "very unlikely" to hit the 20% global market target by 2030, citing fragmented funding, slow progress on FOAKs, and fierce international competition.


News May 12, 2026 by Gordon Feller
Intel and US Semi Fabrication Gets Huge Boost on Rumors from SpaceX, Apple

Intel and US Semi Fabrication Gets Huge Boost on Rumors from SpaceX, Apple

SpaceX’s proposed Terafab and Apple's preliminary discussions indicate escalating pressure to expand domestic semiconductor production.


News May 11, 2026 by Jake Hertz
Class AB vs. Class D: Understanding the Trade-Offs for Piezo Driver Design

Class AB vs. Class D: Understanding the Trade-Offs for Piezo Driver Design

In this article, we explore when to choose a Class AB or Class D output stage for your piezo amplifier design. We'll also examine the Class D stage's power supply requirements.


Understanding the Hogge Detector and the Triwave Solution

Understanding the Hogge Detector and the Triwave Solution

The Hogge phase detector plays multiple roles in CDR circuits. In this article, we'll explore the Hogge detector's behavior, highlight its main drawbacks, and introduce a different configuration that addresses them.