Intel has unveiled new glass substrate technology for large chiplet based system-in-package chips. Glass substrates allow for denser packing of chiplets—an important for applications like AI and others.
About 21 hours ago by Duane Benson
A new and improved GaN technology is moving from the cell phone charger market into higher power, high-reliability applications. EE Power spoke with Navitas’ Stephen Oliver to find out how, and we’ve got everything engineers need to know.
one day ago by Barbara Vergetis Lundin
Angstrom-scale ICs will require innovation across the entire semiconductor ecosystem: This will include advances in both the hardware (transistors, power distribution, and connection of multi-die systems) and tools (EDA tools with AI/ML and silicon life-cycle management).
August 31, 2023 by Rob Aitken, Synopsys
Fari Assaderaghi and SiTime are aiming to disrupt the 70-year-old quartz timing industry by replacing crystals with silicon MEMS. After nearly two decades of following “Moore’s Law for timing improvements,” their time may have finally arrived.
July 11, 2023 by Daniel Bogdanoff
Understanding two key Boolean canonical forms, the sum-of-products and the product-of-sums, is important in digital system design and optimization. We will introduce how to generate these forms and provide guidelines on when it is typically best to use each form.
June 30, 2023 by William Bahn
Adil Kidwai, VP and Head of Product Management at EdgeQ, discusses how they are aiming to redefine software-defined radios as they build what they believe is the world’s first base station-on-a-chip, using RISC-V to enable AI and 5G.
June 27, 2023 by Daniel Bogdanoff
