Latest IC Design Articles and Videos

Categories

Kneron’s RISC-V AI Chip Intends to Bring L1 and L2 Autonomy to “Any Vehicle”

The push for autonomous vehicles has seen a lot of momentum for 2021. Aiming to keep it going is a new AI chip from Kneron that claims to bring the capacity for autonomous driving capabilities to any vehicle.

November 08, 2021 by Jake Hertz

Cadence’s HiFi 1 DSP Leverages New LC3 Codec for Improved Audio Systems

A new codec, LC3, included in Cadence's HiFi 1 DSP, is set to bring new features for designers to exploit in their Bluetooth Audio (LE Audio) profile applications, including Multi-Stream and Broadcast audio.

November 01, 2021 by Adrian Gibbons

National Science Foundation Bankrolls EE Innovation at the University Level

With a multi-billion dollar annual budget, the NSF is moving the needle in electrical engineering by funding research in universities and innovation in corporations.

October 25, 2021 by Lianne Frith

Apple Keeps Growing its System on Chip Design Expertise with M1 Pro and M1 Max

Apple appears to dominate the market again with its newest generation of Apple silicon. Two chips, the M1 Pro & M1 Max, claim more than 2x the performance of the M1.

October 21, 2021 by Adrian Gibbons

Cadence Releases First ECAD Platform Dedicated to 3D System Design

The Cadence Integrity 3D-IC platform brings together a suite of advanced floor planning and validation software to develop 3D-stacked SoC designs.

October 12, 2021 by Adrian Gibbons

Siemens Unleashes mPower: A Power Integrity Toolset for EM and IR Analysis

A new software solution from Siemens is helping designers combat power integrity issues caused by electromigration and voltage drops. Let's dive into the issues the new tool called "mPower" is hoping to solve.

September 28, 2021 by Jake Hertz

EU Pitches Chips Act to Heighten Its Global Semiconductor Status

Ramping up chip R&D and manufacturing will also help industries that have been hard hit by the semiconductor supply shortage.

September 24, 2021 by Tyler Charboneau

Widespread Micro-transfer Printing May Open the Floodgates for 3D ICs

Following a licensing agreement with X-Celeprint, X-FAB Silicon Foundries can now use a fabrication technique that will combine a wide range of semiconductors on a single 3D IC.

September 20, 2021 by Antonio Anzaldua Jr.

RISC-V Gains Traction in the Data Center

RISC-V is often associated with embedded projects. Now, the open-source ISA may be a more common player in higher-end computing markets.

September 07, 2021 by Jake Hertz

AI Accelerator Chip with 1000 RISC-V Cores Shakes Up Data Center Inference

As the need for AI and data center processing keeps rising, a new AI accelerator has risen to the challenge. After years of development, Esperanto has announced its ET-SoC-1 ML inference chip.

August 26, 2021 by Jake Hertz

Highlights of Intel’s 2021 Architecture Day—a Computing-centric Event

At Intel's 2021 Architecture Day, CEO Pat Gelsinger called the company's new computing technology "magic." Here are a few highlights from the event.

August 24, 2021 by Jake Hertz

Episode 28 | How DARPA Stops IC Hardware Hackers in Their Tracks: Insights from Serge Leef

There are millions of unsecured devices on the market today. Whose responsibility is it to design secure silicon, anyway?

August 24, 2021 by Daniel Bogdanoff

Scaling Down: Intel Boasts RibbonFET and PowerVia as Next IC Design Solution

As part of its recent roadmap, Intel teased RibbonFET and PowerVia, two new technologies that it hopes will change the IC industry through backside power delivery and a gate-all-around architecture.

July 30, 2021 by Jake Hertz

Physically Unclonable Functions: Classification, Evaluation, and Tradeoffs in PUFs

In this article, we’ll take a deeper look at how PUFs are classified, the attributes that make a “good” PUF, and design tradeoffs.

July 18, 2021 by Jake Hertz

New IEEE Standard Takes Aim at Easing Long-Reach SerDes Automotive Design

Direct physical interfaces between sensor and processor over long distances is a major challenge in automotive design. The IEEE 2977-2021 MIPI A-PHY specification might be the key to this challenge.

July 15, 2021 by Adrian Gibbons

A RISC-V Future? SiFive and Andes Aim to Shake Up the Processor Industry

RISC-V, the open-source instruction set architecture, is making inroads against industry giants, with the support of the RISC-V Foundation.

June 25, 2021 by Adrian Gibbons

Entering the Era of AI IC Design: Where Do EEs Fit In?

As AI automated design becomes more and more prevalent in IC design, what are the impacts on the everyday EE?

June 25, 2021 by Jake Hertz

An Introduction to Physically Unclonable Functions

In this article, we’ll discuss the PUF or physically unclonable function and how it boosts hardware security in ICs.

June 14, 2021 by Jake Hertz

From CMOS to Batteries: Past Space Tech Improved Earth Applications

Pushing technological limitations to extremes can cause benefits beyond its original scope. Looking back at past space technology, it is clear the effects they have had here on Earth.

May 19, 2021 by Tyler Charboneau

Samsung Shoots for High-performance Computing with 2.5D High-bandwidth Memory

Die stacking is becoming more commonplace with Samsung Electronics' next-generation 2.5D advanced package technology.

May 10, 2021 by Adrian Gibbons