The push for autonomous vehicles has seen a lot of momentum for 2021. Aiming to keep it going is a new AI chip from Kneron that claims to bring the capacity for autonomous driving capabilities to any vehicle.
November 08, 2021 by Jake Hertz
A new codec, LC3, included in Cadence's HiFi 1 DSP, is set to bring new features for designers to exploit in their Bluetooth Audio (LE Audio) profile applications, including Multi-Stream and Broadcast audio.
November 01, 2021 by Adrian Gibbons
A new software solution from Siemens is helping designers combat power integrity issues caused by electromigration and voltage drops. Let's dive into the issues the new tool called "mPower" is hoping to solve.
September 28, 2021 by Jake Hertz
As part of its recent roadmap, Intel teased RibbonFET and PowerVia, two new technologies that it hopes will change the IC industry through backside power delivery and a gate-all-around architecture.
July 30, 2021 by Jake Hertz
Direct physical interfaces between sensor and processor over long distances is a major challenge in automotive design. The IEEE 2977-2021 MIPI A-PHY specification might be the key to this challenge.
July 15, 2021 by Adrian Gibbons