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Maxim Integrated 6-Channel High-Brightness LED Driver | New Product Brief

This New Product Brief (NPB) is part of a video series highlighting the features, applications, and technical specs of newly-released products.

2 days ago by Mouser Electronics

Analog Design Trade-Offs in Applying Linearization Techniques Using Example CMOS Circuits

This article will look at the trade-offs we face when trying to improve the linearity of a circuit.

4 days ago by Steve Arar

CEVA Debuts Integrated Hardware and Software Platform for Contextually-aware IoT Devices

SenslinQ combines integrated software with sensors, Arm- or RISC-V-based MCUs, Ceva's DSP units, and other connected technologies for contextually-aware IoT devices.

January 09, 2020 by Tyler Charboneau

ST Announces “First LoRa SoC,” Including Advanced Semtech Radio

The new SoC expedites the design of smart devices with LoRa and other types of LPWAN IoT connectivity.

January 08, 2020 by Gary Elinoff

OmniVision Brands 4K Video Processor as Lowest Power Consuming SoC of Its Kind

Omnivision aims to make the High-Efficiency Video Coding (HEVC) standard a practical choice for battery-powered home security devices.

January 06, 2020 by Gary Elinoff

UltraSense Systems’ “Smallest Ultrasound SoC” Designed to Turn Any Surface Into a User Interface

The TouchPoint ultrasound sensor utilizes sound waves to turn any surface into a touchscreen, eliminating the need for physical buttons.

January 03, 2020 by Cabe Atwell

Quantum Teleportation? Researchers Develop Photonic Chips that Encode Quantum Information in Circuits

Recently, scientists have successfully paired quantum particle technology with nano-scale circuitry.

January 01, 2020 by Tyler Charboneau

Maxim Integrated ChipDNA Secure ARM Cortex-M4 MCU | New Product Brief

This New Product Brief (NPB) is part of a video series highlighting the features, applications, and technical specs of newly-released products.

December 20, 2019 by Mouser Electronics

Dialog Semiconductor Licenses Flex Logix’s Embedded FPGA Technology for High-volume ICs

Flex Logix’s eFPGA is a low-power FPGA that can be integrated into SoCs, microcontrollers, and ICs.

December 18, 2019 by Cabe Atwell

Nordic Semiconductor nRF52 Series SoCs | New Product Brief

This New Product Brief (NPB) is part of a video series highlighting the features, applications, and technical specs of newly-released products.

December 16, 2019 by Mouser Electronics

OpenHW Group Announces Multi-core Evaluation SoC Based on the NXP iMX Platform

The Core-V Chassis evaluation SoC will feature a CV64A 64-bit core and a CV32E 32-bit coprocessor core as well as 3D and 2D GPUs.

December 13, 2019 by Cabe Atwell

Microchip Announces First RISC-V-based SoC FPGA to Use Half the Power of Other FPGAs

Microchip's new RISC-V-based PolarFire SoC family is said to provide 50% lower power than competing mid-range FPGAs.

December 10, 2019 by Lisa Boneta

Cadence to Acquire AWR for $160 Million to Simplify RF IC Design

Cadence and National Instruments are ramping up their collaborations to a strategic alliance to facilitate the design process of RF integrated circuits.

December 09, 2019 by Gary Elinoff

AI Hardware Built from a Software-first Perspective: Groq’s Flexible Silicon Architecture

Groq, a semiconductor startup with software roots, has developed a new processing unit with a unique architecture that offers inference solutions for AI acceleration.

December 03, 2019 by Majeed Ahmad

MediaTek Releases “World’s Fastest” Sub-6GHz 5G SoC for Smartphones

The new 7nm SoC is the first device in a chipset family offering integrated 5G modems.

December 03, 2019 by Gary Elinoff

Microchip High-Speed Synchronous Buck Controllers | New Product Brief

This New Product Brief (NPB) is part of a video series highlighting the features, applications, and technical specs of newly-released products.

November 28, 2019 by Mouser Electronics

AXI Interconnects Tutorial: Multiple AXI Masters and Slaves in Digital Logic

This article will explore AXI interconnects, the digital logic that allows multiple AXI masters and AXI slaves to communicate.

November 28, 2019 by Stephen St. Michael

Recent FPGAs Designed for C++ and Python, Harsh Environments, and ASIC Prototyping

These recently-released FPGAs aim to use accessible programming languages, withstand harsh environments, and support ASIC prototyping.

November 23, 2019 by Robin Mitchell

Dialog Semi Releases “World’s Smallest and Most Power Efficient” Bluetooth 5.1 SoC Module for IoT Applications

Dialog Semiconductor today announced a new BLE SoC—one it claims is the smallest and least power-hungry on the market.

November 04, 2019 by Robin Mitchell

Synopsys’ Die-to-Die PHY IP Speeds Up Cloud Computing SoC Designs

The die-to-die PHY IP enables extra-short reach connectivity in multi-chip modules (MCM) for hyper-scale data centers, AI, and networking applications.

November 01, 2019 by Lisa Boneta