XENSIV™ MEMS transceivers enable smaller, more integrated, and highly scalable sensing solutions. Learn key design considerations and emerging use cases across…
XENSIV™ MEMS transceivers enable smaller, more integrated, and highly scalable sensing solutions. Learn key design considerations and emerging use cases across robotics and automation.
Infineon’s Ted Karlin joins Moore’s Lobby to discuss the transition from BiCMOS to pure CMOS 60 GHz radar,…
Infineon’s Ted Karlin joins Moore’s Lobby to discuss the transition from BiCMOS to pure CMOS 60 GHz radar, antenna-in-package integration, and the future of smart sensing.
Designing compact AI sensor nodes forces signal integrity and thermal management to compete for limited PCB copper,…
Designing compact AI sensor nodes forces signal integrity and thermal management to compete for limited PCB copper, creating severe PDN and thermal bottlenecks.
Learn how MEMS sensor technology brings edge AI and vibration monitoring to smart manufacturing, enabling early defect…
Learn how MEMS sensor technology brings edge AI and vibration monitoring to smart manufacturing, enabling early defect detection and predictive maintenance to prevent downtime.
Melexis has added low-pressure variants with analog, LIN, and SENT output options to its Triphibian pressure sensor family.
Melexis has added low-pressure variants with analog, LIN, and SENT output options to its Triphibian pressure sensor family.
The MEMS-based oscillator delivers less than 1 nanosecond of time synchronization accuracy for AI clusters.
The MEMS-based oscillator delivers less than 1 nanosecond of time synchronization accuracy for AI clusters.
In this article, we explore when to choose a Class AB or Class D output stage for your piezo amplifier design. We'll also…
In this article, we explore when to choose a Class AB or Class D output stage for your piezo amplifier design. We'll also examine the Class D stage's power supply requirements.
Learn how liquid cooling eliminates system airflow, creating a hidden thermal bottleneck for 'left-behind' components…
Learn how liquid cooling eliminates system airflow, creating a hidden thermal bottleneck for 'left-behind' components like memory and SSDs. Targeted micro-cooling is required to restore system balance.
In this article, we explore the operation of a Class D stage with a capacitive load and how it can be used in piezo…
In this article, we explore the operation of a Class D stage with a capacitive load and how it can be used in piezo amplifier design.
We examine the basic requirements of piezoelectric amplifiers and how Class AB operation can meet them.
We examine the basic requirements of piezoelectric amplifiers and how Class AB operation can meet them.
Announced today, the Aurora and Polaris development kits enable designs for the company’s studio-grade optical MEMS microphone.
Announced today, the Aurora and Polaris development kits enable designs for the company’s studio-grade optical MEMS microphone.
Learn how advanced RF MEMS switches with high linearity, low loss, and fast switching speeds are enabling modern cellular…
Learn how advanced RF MEMS switches with high linearity, low loss, and fast switching speeds are enabling modern cellular communication systems.
In this Tech Guide from Mouser Electronics, discover how TDK Memory Solutions with in-house GBDriver technology help…
In this Tech Guide from Mouser Electronics, discover how TDK Memory Solutions with in-house GBDriver technology help engineers design reliable industrial systems. Watch now to get started!
Announced today, SiTime is expanding into a $4 billion resonator market with its Titan platform.
Announced today, SiTime is expanding into a $4 billion resonator market with its Titan platform.
From AI glasses to earbuds to long-range Bluetooth audio, three new product wins highlight how MEMS and RF front-end…
From AI glasses to earbuds to long-range Bluetooth audio, three new product wins highlight how MEMS and RF front-end technologies are reshaping wireless sound.
Learn the hybrid design configurations used in today’s TWS earbuds, along with the engineering challenges that OEMs…
Learn the hybrid design configurations used in today’s TWS earbuds, along with the engineering challenges that OEMs face when designing hybrid models.
MEMS microphones, ToF sensors, and motion-tracking IMUs from TDK deliver responsive, energy-efficient performance across…
MEMS microphones, ToF sensors, and motion-tracking IMUs from TDK deliver responsive, energy-efficient performance across smart home appliances, remotes, speakers, locks, and more.
The new SMP290 sensor integrates Bluetooth Low Energy to simplify vehicle electronics and extend sensor lifespan.
The new SMP290 sensor integrates Bluetooth Low Energy to simplify vehicle electronics and extend sensor lifespan.
Announced today, the new IMU brings a cost-optimized, high-temperature solution to in-cabin automotive applications.
Announced today, the new IMU brings a cost-optimized, high-temperature solution to in-cabin automotive applications.
Analog Devices Inc. ADXL382 3-Axis MEMS Accelerometers delivers industry-leading low noise, low power consumption, and…
Analog Devices Inc. ADXL382 3-Axis MEMS Accelerometers delivers industry-leading low noise, low power consumption, and wide bandwidth, making it ideal for precise measurement applications. Watch and learn all about their features, specs, applications, and more!
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