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Qualcomm Splits One IoT Quad-Core Die Across Consumer and Industrial Lines

Qualcomm Splits One IoT Quad-Core Die Across Consumer and Industrial Lines

The Q-2390 and IQ-2390 share a Cortex-A78/A55 complex, an Adreno 704 GPU, and an optional RISC-V real-time core, with the industrial part introducing the IQ2 Series.


News About 14 hours ago by Luke James
Alif Semiconductor Unveils $49 StartKit Platform for Edge AI Development

Alif Semiconductor Unveils $49 StartKit Platform for Edge AI Development

The new evaluation kits aim to lower the barrier for on-device AI development with Alif’s AI/ML hardware-accelerated Ensemble and Balletto MCUs.


News Sep 09, 2026 by Jeff Child
xMEMS Launches ‘World’s Smallest Active Micro Fan’ for Smart Glasses

xMEMS Launches ‘World’s Smallest Active Micro Fan’ for Smart Glasses

The XMC-1200 is a 1-mm-thin piezoMEMS cooling chip designed to keep heat away from temple arms.


News Aug 05, 2026 by Luke James
The New Era of Retail Begins at the Edge Leveraging On-Device AI

The New Era of Retail Begins at the Edge Leveraging On-Device AI

On-device AI enhances retail by enabling real-time processing for robotics, kiosks, and more, offering low latency, improved privacy, and operational efficiency for a better customer experience.


Infineon Serves up Security IC Supporting USB and NFC Connectivity

Infineon Serves up Security IC Supporting USB and NFC Connectivity

The new SECORA ID Key S USB security solution supports FIDO2 and PKI through hardware and near field interfaces.


News Jul 20, 2026 by Duane Benson
Qualcomm Unveils Mixed-Reality Platform for AI-Driven Spatial Computing

Qualcomm Unveils Mixed-Reality Platform for AI-Driven Spatial Computing

The next-generation XR chipset delivers up to 48 TOPS of on-device AI and 4.4K-per-eye visuals. The device will debut this fall in XREAL's Project Aura glasses.


News Jun 25, 2026 by Luke James
Why Your PCB Design Review Process is Obsolete and How to Fix It

Why Your PCB Design Review Process is Obsolete and How to Fix It

Sending static PDFs and Gerbers for feedback is killing your project timelines and leading to costly PCB rework. Learn how to break down engineering silos and modernize your PCB design reviews.


ST Unveils 2.3K-Zone dToF 3D Lidar Module for Resource-Limited Edge AI

ST Unveils 2.3K-Zone dToF 3D Lidar Module for Resource-Limited Edge AI

Announced today, the all-in-one VL53L9CX combines stacked BSI SPAD technology, metasurface optics, and on-chip processing to deliver dense spatial awareness directly to small microcontrollers.


News Jun 22, 2026 by Jeff Child
Rohm Announces Compact Wireless Charging Chipset for Wearables

Rohm Announces Compact Wireless Charging Chipset for Wearables

The new NFC wireless charging chipset uses 13.56-MHz technology and an MCU-free architecture to simplify wireless power integration in ultra-compact wearable devices, such as smart rings.


News May 18, 2026 by Austin Futrell
STMicro Unwraps Low-Power Image Sensors for Always-On Designs

STMicro Unwraps Low-Power Image Sensors for Always-On Designs

New BrightSense global-shutter sensors reduce power consumption by 10x for continuous sensing in battery-constrained wearables.


News May 07, 2026 by Jake Hertz
TDK Unwraps Software Tools for Sensor Data and IMU Evaluation

TDK Unwraps Software Tools for Sensor Data and IMU Evaluation

Today, the company released two new AI software products at Sensors Converge, SensorGPT, for creating sensor data at scale, and SensorStage to accelerate development workflow for the company’s latest IMUs.


News May 05, 2026 by Duane Benson
Kingbright APGF0607G32B33R23-05 LED | New Product Brief

Kingbright APGF0607G32B33R23-05 LED | New Product Brief

Kingbright APGF0607G32B33R23-05 LED delivers high-performance, full-color illumination in an ultra-compact SMD package. Watch and learn all about their features, specs, applications, and more!


Design Wins Roundup: From Real-Time Medical Imaging to Artemis II

Design Wins Roundup: From Real-Time Medical Imaging to Artemis II

Integration and efficiency are reshaping modern system design, from rad-hard ICs in NASA’s Artemis II mission to SoCs turning ID badges into wireless systems.


News Apr 15, 2026 by Joshua Tidwell
Amphenol Commercial D-Sub Cable Assemblies | New Product Brief

Amphenol Commercial D-Sub Cable Assemblies | New Product Brief

Amphenol Commercial D-Sub Cable Assemblies provide rugged, high-integrity connectivity for industrial and electronic systems requiring reliable signal transmission and EMI/RFI protection. Watch and learn all about their features, specs, applications, and more!


Nuvoton Unveils MCU With Cortex-M33 Core Aimed at Smart Devices

Nuvoton Unveils MCU With Cortex-M33 Core Aimed at Smart Devices

The NuMicro M3331 series runs at up to 180 MHz and integrates hardware security, CAN FD, and LED control interfaces across packages as small as 4 × 4 mm.


News Apr 03, 2026 by Luke James
For the Netherlands, Photonics Initiatives Secure Global Leadership—Part 1

For the Netherlands, Photonics Initiatives Secure Global Leadership—Part 1

The Netherlands is securing global leadership in integrated photonics, a technology using light instead of electricity for faster, more energy-efficient data processing, essential for AI, healthcare, and mobility.


News Apr 02, 2026 by Gordon Feller
pSemi Unveils Multi-Level Buck Converter for Direct Charging Designs

pSemi Unveils Multi-Level Buck Converter for Direct Charging Designs

Claimed as the “world’s first” 4-level buck converter, the device enables high-efficiency 6 A fast charging for mobile and portable electronics.


News Mar 31, 2026 by Jake Hertz
U-blox’s New GNSS Platform Reportedly Cuts Power Consumption 40%

U-blox’s New GNSS Platform Reportedly Cuts Power Consumption 40%

The new L1/L5 platform selectively engages its second frequency band only when conditions demand it, targeting wearables, fleet trackers, and drones.


News Mar 26, 2026 by Luke James
Ambient Scientific Lends AI Processor to Women’s Safety Wearable

Ambient Scientific Lends AI Processor to Women’s Safety Wearable

The MAI device from Dimension NXG runs AI models continuously on a 180-mAh battery for up to 14 days, using analog in-memory compute to keep power consumption at microwatt levels.


News Mar 25, 2026 by Luke James
Same Sky Pogo Pins & PCB Pins | Featured Product Spotlight

Same Sky Pogo Pins & PCB Pins | Featured Product Spotlight

Same Sky Pogo Pins & PCB Pins offer a high-reliability interconnect solution featuring gold-plated contacts designed to withstand up to 100,000 mating cycles. Watch and learn all about their features, specs, applications, and more!