Intel has unveiled new glass substrate technology for large chiplet based system-in-package chips. Glass substrates allow for denser packing of chiplets—an important for applications like AI and others.
September 25, 2023 by Duane Benson
The University of California researchers implanted 253 electrodes over the patient's speech center of the brain, intercepting signals that, if not for the stroke, would have gone to muscles in her lips, tongue, jaw, and larynx.
September 01, 2023 by Duane Benson
KYOCERA AVX SCC series of high-capacitance cylindrical electrochemical double-layer supercapacitors is designed to offer exceptional pulse power handling capabilities. Watch and learn all about their features, specs, applications, and more!
July 24, 2023 by Mouser Electronics
Laird Connectivity Lyra 24 Series BLUETOOTH® Modules represent cutting-edge seamless BLE connectivity, offering outstanding RF performance and energy efficiency. Watch and learn all about their features, specs, applications, and more!
July 24, 2023 by Mouser Electronics
Ultra-thin, flexible, and low-power displays support wireless, IoT, and energy-harvesting applications that continue to bring intelligence to more products. This article examines two of the most popular low-power reflective display technologies—electrochromic and electrophoretic.
July 02, 2023 by Dale Wilson
The Phoenix Contact FQ universal board-to-board PCB connectors offer exceptional versatility and reliable connections through a double-sided contact system. Watch and learn all about their features, specs, applications, and more!
June 19, 2023 by Mouser Electronics