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Intel Outfits New Xeon Processors, Networking, and GPUs for Agentic AI

Intel Outfits New Xeon Processors, Networking, and GPUs for Agentic AI

At Computex, Intel described the CPU as the control plane for agentic workloads, pairing new processors and network controllers with fresh details on its inference GPU.


News Jun 05, 2026 by Luke James
Siemens Intros AI-Powered Library Characterizer to Speed IC Design

Siemens Intros AI-Powered Library Characterizer to Speed IC Design

New characterization software delivers 7x throughput gains by combining a predictive AI engine with a purpose-built SPICE simulator.


News Jun 02, 2026 by Luke James
Europe’s Chip Ambitions: Why the EU’s Semi Strategy May Fall Short

Europe’s Chip Ambitions: Why the EU’s Semi Strategy May Fall Short

An audit finds that the European Chips Act is "very unlikely" to hit the 20% global market target by 2030, citing fragmented funding, slow progress on FOAKs, and fierce international competition.


News May 12, 2026 by Gordon Feller
Intel and US Semi Fabrication Gets Huge Boost on Rumors from SpaceX, Apple

Intel and US Semi Fabrication Gets Huge Boost on Rumors from SpaceX, Apple

SpaceX’s proposed Terafab and Apple's preliminary discussions indicate escalating pressure to expand domestic semiconductor production.


News May 11, 2026 by Jake Hertz
Understanding the Hogge Detector and the Triwave Solution

Understanding the Hogge Detector and the Triwave Solution

The Hogge phase detector plays multiple roles in CDR circuits. In this article, we'll explore the Hogge detector's behavior, highlight its main drawbacks, and introduce a different configuration that addresses them.


Operation of a Linear Phase Detector for Clock and Data Recovery

Operation of a Linear Phase Detector for Clock and Data Recovery

Learn how the Hogge detector addresses the challenges of clock and data recovery (CDR) for data signals with limited clock information.


Decisions Ahead for the Next Generation of Advanced Packaging

Decisions Ahead for the Next Generation of Advanced Packaging

Advanced packaging is at a crossroads due to AI demand. Learn the four emerging paths—CoWoS, CoPoS, glass-core, and CoWoP—and how to choose the right one for your multi-die system design.


Preventing Runt Pulses in Phase/Frequency Detectors

Preventing Runt Pulses in Phase/Frequency Detectors

This article explains the importance of incorporating delay into the feedback path of a phase/frequency detector (PFD) and examines its effect on performance.


Introduction to Phase/Frequency Detectors

Introduction to Phase/Frequency Detectors

Learn how using a phase/frequency detector (PFD) in place of a phase detector improves the acquisition range of a PLL.


Introduction to the RS Flip-Flop Phase Detector

Introduction to the RS Flip-Flop Phase Detector

Learn about this simple sequential phase detector and how it compares to the XOR gate. We'll also examine some key limitations and circuit implementations.


Understanding the Exclusive-OR Phase Detector

Understanding the Exclusive-OR Phase Detector

This article explores the operation of the simplest digital phase detector: the exclusive-OR (XOR) gate.


Breaking Down 50 Million Pins: A Smarter Way to Design 3D IC Packages

Breaking Down 50 Million Pins: A Smarter Way to Design 3D IC Packages

The shift to 3D ICs and chiplets demands automated, hierarchical design planning to manage exploding pin counts. Learn how Siemens EDA's Innovator3D IC addresses these challenges.


Three Ways to Accelerate Cell Layout in DTCO

Three Ways to Accelerate Cell Layout in DTCO

The device technology co-optimization (DTCO) methodology requires generating large numbers of layouts. This article introduces a few ways of speeding up this time-consuming process using automation.


Cadence Unwraps Agentic AI Super Agent for Chip Design and Verification

Cadence Unwraps Agentic AI Super Agent for Chip Design and Verification

Announced today, the new ChipStack AI Super Agent from Cadence automates front end silicon design and verification, delivering a 10X productivity increase.


News Feb 10, 2026 by Duane Benson
Singulation—Literally Cutting Edge—Is Gaining More Importance for Wafer Fabs

Singulation—Literally Cutting Edge—Is Gaining More Importance for Wafer Fabs

Singulation (wafer dicing) is critical for IC wafer manufacturing. Laser/plasma dicing is replacing mechanical methods. Lidrotec's laser-liquid technology offers virtually zero-damage cuts.


News Feb 06, 2026 by Gordon Feller
Understanding the PDK Generation Process

Understanding the PDK Generation Process

In this article, we'll walk through the steps of generating a Process Design Kit (PDK) for digital standard cell libraries.


Our Top 2025 Research Stories: Rubber CMOS, Washable Electronics, and More

Our Top 2025 Research Stories: Rubber CMOS, Washable Electronics, and More

Enjoy this roundup of our favorite All About Circuits research news articles of 2025!


News Dec 26, 2025 by Jeff Child
FM Demodulation Using a Phase-Locked Loop

FM Demodulation Using a Phase-Locked Loop

PLL demodulators are popular, easy to implement, and offer superior noise performance compared to many other FM demodulator circuits. Learn how they operate in this article.


Upbeat Technology’s RISC-V MCU Takes Flight With Near-Threshold Computing

Upbeat Technology’s RISC-V MCU Takes Flight With Near-Threshold Computing

Developed with SiFive, the dual-core SoC uses patented error correction to achieve a record 16.8 µW/MHz/DMIPS, targeting next-gen wearables, drones, and IoT sensors.


News Oct 17, 2025 by Dale Wilson
Your 2025 Back-to-School Guide to All About Circuits’ Educational Resources

Your 2025 Back-to-School Guide to All About Circuits’ Educational Resources

Are you a first year electronics engineering student? Or maybe working on a second or third degree in this field? All About Circuits has the resources you need: comprehensive textbooks, technical articles, calculators, videos, and more for your EE studies.


News Sep 19, 2025 by Jeff Child