Per Viklund, Siemens EDA

Per Viklund is Systems Architect Director at Siemens EDA responsible for IC Packaging and RF/Microwave technologies. He has more than 40 years’ experience with electronic design and EDA and has spent the last 30 years in EDA focusing on High Density Advanced Packaging (HDAP) and RF/microwave design. He has published multiple papers on RF, IC packaging, and package co-design.