The new wideband shunts and the high-voltage differential probe are designed to enable engineers to extend measurement coverage from precision low-current…
The new wideband shunts and the high-voltage differential probe are designed to enable engineers to extend measurement coverage from precision low-current analysis to high voltage power validation.
Research teams at EPFL, Harvard, and UC San Diego each reported photonic devices that shrink or repurpose light-based hardware.
Research teams at EPFL, Harvard, and UC San Diego each reported photonic devices that shrink or repurpose light-based hardware.
Announced today, the all-in-one VL53L9CX combines stacked BSI SPAD technology, metasurface optics, and on-chip processing…
Announced today, the all-in-one VL53L9CX combines stacked BSI SPAD technology, metasurface optics, and on-chip processing to deliver dense spatial awareness directly to small microcontrollers.
In this article, we'll learn how to calculate the noise power and signal-to-noise ratio (SNR) of a double-sideband…
In this article, we'll learn how to calculate the noise power and signal-to-noise ratio (SNR) of a double-sideband suppressed-carrier communication system.
In this Tech Guide, explore how Microchip’s PIC32CM MCUs deliver low power performance, integrated security with…
In this Tech Guide, explore how Microchip’s PIC32CM MCUs deliver low power performance, integrated security with TrustZone, and advanced analog and touch features, enabling efficient, secure, and responsive embedded designs across industrial, IoT, and consumer applications. Watch now to get started!
TE Connectivity Measurement Specialties 8XH High-Accuracy Media-Isolated Pressure Sensors deliver precise and reliable…
TE Connectivity Measurement Specialties 8XH High-Accuracy Media-Isolated Pressure Sensors deliver precise and reliable pressure measurement through the integration of a MEMS sensing die, ASIC signal conditioning, and oil-filled media isolation technology. Watch and learn all about their features, specs, applications, and more!
This project brief describes how to assemble an isolated half-bridge IGBT gate driver module built around the…
This project brief describes how to assemble an isolated half-bridge IGBT gate driver module built around the NCD57085DR2G. It features onboard current sensing and overcurrent protection.
The new Elite Pairing Studio is an interactive cloud-based simulation tool designed to give power electronics engineers…
The new Elite Pairing Studio is an interactive cloud-based simulation tool designed to give power electronics engineers deep visibility into device-level switching behavior and component trade-offs.
France’s Électronique 2030 program commits €5B+ to revitalize its semiconductor industry. Learn the details of this…
France’s Électronique 2030 program commits €5B+ to revitalize its semiconductor industry. Learn the details of this ambitious effort, and the market challenges it’s facing.
The new gate drivers combine ultra-low standby power, integrated analog functions, and SPI-based configuration to…
The new gate drivers combine ultra-low standby power, integrated analog functions, and SPI-based configuration to simplify brushless motor designs in battery-powered equipment.
TE Connectivity Measurement Specialties 85UHP Pressure Sensor is a compact, high-precision sensing solution designed for…
TE Connectivity Measurement Specialties 85UHP Pressure Sensor is a compact, high-precision sensing solution designed for ultra-high purity semiconductor manufacturing environments. Watch and learn all about their features, specs, applications, and more!
At Computex 2026, the company is expanding its Edge AI ecosystem by introducing the Snapdragon C Platform for entry-level…
At Computex 2026, the company is expanding its Edge AI ecosystem by introducing the Snapdragon C Platform for entry-level laptops, and the Dragonwing IQ10 Reference Design for robotics.
Paragraf recently introduced a new GFET, a next-generation graphene transistor platform designed for scalable molecular…
Paragraf recently introduced a new GFET, a next-generation graphene transistor platform designed for scalable molecular sensing and research applications.
In this Tech Guide, learn how the Vishay ISO-AC-VSAO Reference Design enables accurate, isolated high-voltage AC…
In this Tech Guide, learn how the Vishay ISO-AC-VSAO Reference Design enables accurate, isolated high-voltage AC measurement. Watch now to get started!
Edge AI moves is moving processing to harsh environments like UAVs and robotics. Connectors must be rugged, compact, and…
Edge AI moves is moving processing to harsh environments like UAVs and robotics. Connectors must be rugged, compact, and high-power to meet SWaP-C constraints and ensure safety/reliability.
The new 100/1000BASE-T1 transceiver families integrate IEEE 802.1AE-2018 frame security and TSN, targeting ADAS, zonal…
The new 100/1000BASE-T1 transceiver families integrate IEEE 802.1AE-2018 frame security and TSN, targeting ADAS, zonal architectures, and industrial automation.
Kate Sokolnicki, Global Business Director for Sensing & Safety at Rockwell Automation, discusses the evolution of…
Kate Sokolnicki, Global Business Director for Sensing & Safety at Rockwell Automation, discusses the evolution of industrial sensing and the shift toward data-driven manufacturing.
In this Tech Guide, explore how the TMC5241 smart stepper driver enables ultra-smooth, precise, and quiet motion control.…
In this Tech Guide, explore how the TMC5241 smart stepper driver enables ultra-smooth, precise, and quiet motion control. Watch now to get started!
Edge AI success is limited by memory and power. Fragmented tools cause failures. Learn how a cohesive, full-lifecycle…
Edge AI success is limited by memory and power. Fragmented tools cause failures. Learn how a cohesive, full-lifecycle approach unifying design and deployment is essential for scalable systems.
Attend, Samtec, and Same Sky have recently introduced new connectors that target modular AI memory integration, compact…
Attend, Samtec, and Same Sky have recently introduced new connectors that target modular AI memory integration, compact high-current interconnects, and environmentally sealed USB Type-C connectivity.