There are several effective ways to manage the high temperatures of today’s discrete semiconductors in your design. Simulation techniques are vital for measuring how well each approach is working.
December 08, 2022 by Toshiaki Hosoya, Toshiba
Heat dissipation is one of the biggest obstacles in semiconductor reduction. A team at the University of California has developed nanowires that can significantly improve heat dissipation characteristics and shape the future of silicon chip design.
November 23, 2016 by Robin Mitchell