Detailed simulations of the thermal behavior of MOSFETs in a closed chassis allow the development of guidelines for improving system design for MOSFET placement in conjunction with the use of fans, grills, and heatsinks.
August 24, 2023 by Toshiaki Hosoya, Toshiba
There are several effective ways to manage the high temperatures of today’s discrete semiconductors in your design. Simulation techniques are vital for measuring how well each approach is working.
December 08, 2022 by Toshiaki Hosoya, Toshiba
Heat dissipation is one of the biggest obstacles in semiconductor reduction. A team at the University of California has developed nanowires that can significantly improve heat dissipation characteristics and shape the future of silicon chip design.
November 23, 2016 by Robin Mitchell