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Breaking the Thermal Wall Using Monolithic Ceramic Cooling for Power Electronics

Breaking the Thermal Wall Using Monolithic Ceramic Cooling for Power Electronics

Learn how monolithic ceramic cooling using Selective Laser Reaction Sintering (SLRS) eliminates the "thermal wall" in high-density power electronics by creating single-piece, reliable heat exchangers.


Onsemi Intros 7th Gen IGBT-based Intelligent Power Modules

Onsemi Intros 7th Gen IGBT-based Intelligent Power Modules

Announced today at APEC 2024, the new, highly integrated family of devices, reduces package size and increases power density for designers.


News Feb 26, 2024 by Jake Hertz
Developing Thermal Design Guidelines for Power MOSFETs in a Chassis

Developing Thermal Design Guidelines for Power MOSFETs in a Chassis

Detailed simulations of the thermal behavior of MOSFETs in a closed chassis allow the development of guidelines for improving system design for MOSFET placement in conjunction with the use of fans, grills, and heatsinks.


Thermal Management for Designs Using Discrete Semiconductor Devices

Thermal Management for Designs Using Discrete Semiconductor Devices

There are several effective ways to manage the high temperatures of today’s discrete semiconductors in your design. Simulation techniques are vital for measuring how well each approach is working.


Battery Storage Schemes Employ Freeze-Thaw Approach and More

Battery Storage Schemes Employ Freeze-Thaw Approach and More

Offering novel approaches to battery energy storage, a trio of research efforts are using electronic technologies and materials science to tackle energy storage challenges.


News Oct 22, 2022 by Nicholas St. John
What is Cold Junction Compensation in Thermocouples?

What is Cold Junction Compensation in Thermocouples?

Learn about the theory behind cold junction compensation in thermocouples using the Seebeck voltage, reference tables, and by finding the hot junction temperature.


Designing with a Heat Sink for Junction-to-Case Thermal Resistance

Designing with a Heat Sink for Junction-to-Case Thermal Resistance

Watch the thermal measurement, junction-to-case thermal resistance, in action as we use it to calculate the thermal considerations for a given system.


Using Hydrogel to Cool Down Electronics and Convert Waste Into Electricity

Using Hydrogel to Cool Down Electronics and Convert Waste Into Electricity

The thin polymer-based hydrogel film can be strapped to batteries to convert heat to electricity. It works by transferring electrons when heated to generate power.


News Apr 30, 2020 by Luke James
Characterizing LED Performance with a Frequency Response Analyzer and Line Injector

Characterizing LED Performance with a Frequency Response Analyzer and Line Injector

This application note series explores the measurement of the dynamic resistance of an LED and how to create a usable SPICE model from the data.


How to Select the Right Aluminum Electrolytic Capacitor

How to Select the Right Aluminum Electrolytic Capacitor

Learn the characteristics of aluminum electrolytic capacitors and tips on how to properly select one for use in electrical designs.


PCB Thermal Management Techniques

PCB Thermal Management Techniques

This article will discuss design practices that ensure better thermal management, including some common methods for removing excess heat from a PCB.


Major Causes of High Temperatures on PCBs

Major Causes of High Temperatures on PCBs

This article discusses the major causes of high temperatures on PCBs that cause failure and damage to the board itself.


What Is Joule Heating? Producing Heat with Electric Current

What Is Joule Heating? Producing Heat with Electric Current

Joule heating, also known as ohmic heating, is used to directly heat water with electric current.


Graphene Nano-Chimneys Could Cool Future Circuits

Graphene Nano-Chimneys Could Cool Future Circuits

Rice University students have determined that chimney-like structures made of carbon nanotubes could be the key to the future of heat dissipation.


News Feb 15, 2017 by Robin Mitchell
Transceivers, Heat Dissipation, and Wearables: Are Diamonds the Future of Microelectronics?

Transceivers, Heat Dissipation, and Wearables: Are Diamonds the Future of Microelectronics?

Due to their resilient structure, synthetic diamonds are being used to create the next generation of microelectronics.


News Jan 25, 2017 by Chantelle Dubois
Could Nanowires Change the Way We Manage Heat Dissipation in ICs?

Could Nanowires Change the Way We Manage Heat Dissipation in ICs?

Heat dissipation is one of the biggest obstacles in semiconductor reduction. A team at the University of California has developed nanowires that can significantly improve heat dissipation characteristics and shape the future of silicon chip design.


News Nov 23, 2016 by Robin Mitchell
Why the Future of Data Centers Could Be in the Oceans

Why the Future of Data Centers Could Be in the Oceans

Researchers at the National Institute of Informatics are closing in on a solution to keep computers cool by submerging them under water.


News Nov 11, 2016 by Robin Mitchell
How to Keep a Power Transistor Cool Using a Heat Sink

How to Keep a Power Transistor Cool Using a Heat Sink

Handling heat in electronics. Which components create heat, which components suffer from heat. Basics of heatsinking.