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A Peek Inside the Electronics on the Nancy Grace Roman Space Telescope

A Peek Inside the Electronics on the Nancy Grace Roman Space Telescope

The Nancy Grace Roman Space Telescope’s mirror may get the headlines, but its detector chips, photon-counting cameras, and downlink amplifier tell the electronics story.


News 6 hours ago by Robert Martin
Microchip Reveals One of Its Lowest Power Atomic Clocks Yet

Microchip Reveals One of Its Lowest Power Atomic Clocks Yet

Drawing less than 120 mW and tolerating 30 krad of total ionizing dose, the chip-scale atomic clock keeps LEO satellites synchronized when GNSS timing is unavailable.


News Aug 27, 2026 by Luke James
Three Research Teams Take Different Routes to Control Light

Three Research Teams Take Different Routes to Control Light

Papers from École Polytechnique, Seoul National University, and Harvard tackle optical gain, on-chip buffering, and component footprint.


News Aug 20, 2026 by Luke James
What’s Next in Wireless Communication? An Insider’s Perspective

What’s Next in Wireless Communication? An Insider’s Perspective

Joaquin Torrecilla, Keysight’s VP of Software Transformation, joins the show to discuss the evolution of wireless tech—from early Bluetooth to LEO satellite lasers, RedCap, and AI-native 6G.


SNR Analysis of FM Modulation with Arbitrary Message Signals

SNR Analysis of FM Modulation with Arbitrary Message Signals

Deriving a general signal-to-noise expression for frequency modulation with any message signal reveals a core trade-off: more deviation buys better noise performance, but only by using more bandwidth.


Infineon Designs Rad-Hard GaN Gate Driver for Satellite Power Systems

Infineon Designs Rad-Hard GaN Gate Driver for Satellite Power Systems

The new gate driver pairs a truly differential input with onboard regulation and Miller Clamp protection to support both GaN HEMTs and logic-level silicon FETs.


News Aug 07, 2026 by Austin Futrell
Hirose Electric IT18 COM-HPC® Low-Profile BGA Mezzanine Connectors | New Product Brief

Hirose Electric IT18 COM-HPC® Low-Profile BGA Mezzanine Connectors | New Product Brief

Hirose Electric IT18 COM-HPC® Low-Profile BGA Mezzanine Connectors provide high-speed, high-density interconnect solutions for next-generation embedded computing platforms. Watch and learn all about their features, specs, applications, and more!


Why Supply Chain Visibility Is Becoming an Engineering Requirement

Why Supply Chain Visibility Is Becoming an Engineering Requirement

Hidden upstream dependencies can turn great product designs into costly delays. Discover why component sourcing risk must now be factored into early product decisions.


New Demands on RF Interconnects—How 5G and AI are Redefining RF Designs

New Demands on RF Interconnects—How 5G and AI are Redefining RF Designs

5G, AI, and quantum computing are pushing RF interconnects to their limits. Learn how engineers are evolving connector designs to ensure signal integrity in compact, high-speed systems.


YAGEO AEC-Q200 Hybrid Polymer Capacitors | Featured Product Spotlight

YAGEO AEC-Q200 Hybrid Polymer Capacitors | Featured Product Spotlight

YAGEO AEC-Q200 Hybrid Polymer Capacitors deliver reliable, high-performance energy storage for demanding automotive and industrial applications. Watch and learn all about their features, specs, applications, and more!


A Four-Channel RS-422 Differential Line Receiver Module

A Four-Channel RS-422 Differential Line Receiver Module

This project brief describes how to build and use a four-channel differential line receiver module for balanced RS-422 and RS-485 data links.


A Four-Channel RS-422 Differential Line Driver Module

A Four-Channel RS-422 Differential Line Driver Module

This project brief describes how to implement a four-channel differential line driver module for reliable long-distance data transmission over balanced twisted-pair lines.


Why Your PCB Design Review Process is Obsolete and How to Fix It

Why Your PCB Design Review Process is Obsolete and How to Fix It

Sending static PDFs and Gerbers for feedback is killing your project timelines and leading to costly PCB rework. Learn how to break down engineering silos and modernize your PCB design reviews.


The Isolated Half-Bridge: An IGBT Gate Driver Module with Current Sense

The Isolated Half-Bridge: An IGBT Gate Driver Module with Current Sense

This project brief describes how to assemble an isolated half-bridge IGBT gate driver module built around the NCD57085DR2G. It features onboard current sensing and overcurrent protection.


Understanding the Characteristics of Narrowband Noise in Communication Systems

Understanding the Characteristics of Narrowband Noise in Communication Systems

In this article, we analyze how bandpass filtering affects the power spectral density (PSD) of noise and explore how noise can be described by in-phase and quadrature components.


Paragraf Unwraps Graphene-Based FET Made at New Graphene Foundry

Paragraf Unwraps Graphene-Based FET Made at New Graphene Foundry

Paragraf recently introduced a new GFET, a next-generation graphene transistor platform designed for scalable molecular sensing and research applications.


News May 29, 2026 by Joshua Tidwell
Microchip Ruggedizes Evacuated Miniature Crystal Oscillators

Microchip Ruggedizes Evacuated Miniature Crystal Oscillators

The EX-423 adds four-point crystal mounting, ultra-high vacuum housing, and MIL-STD-202 to Microchip's EX-421 EMXO lineup.


News May 28, 2026 by Jake Hertz
The Shift to Edge AI Requires Connector Choices to be Re-Examined

The Shift to Edge AI Requires Connector Choices to be Re-Examined

Edge AI moves is moving processing to harsh environments like UAVs and robotics. Connectors must be rugged, compact, and high-power to meet SWaP-C constraints and ensure safety/reliability.


From Tracking Filters to Demodulation: Exploring the Applications of PLLs

From Tracking Filters to Demodulation: Exploring the Applications of PLLs

In this article, we'll learn about several key applications of PLLs in communication systems, including tracking filters, frequency and phase modulation, and FM and AM demodulation.


Class AB vs. Class D: Understanding the Trade-Offs for Piezo Driver Design

Class AB vs. Class D: Understanding the Trade-Offs for Piezo Driver Design

In this article, we explore when to choose a Class AB or Class D output stage for your piezo amplifier design. We'll also examine the Class D stage's power supply requirements.