Ryan Smart is Vice President of Product at Harwin, where he drives innovation and leads new product development. Harwin specializes in high-reliability interconnect devices and PCB hardware, engineered to perform in harsh environments, featuring superior resistance to high vibration, shock, and extreme temperatures.
With over a decade in electronic components, Ryan takes products from concept to launch—equipping engineers with cutting-edge connectivity solutions built for the most demanding applications. He is dedicated to building strong partnerships with distributors and the engineers they serve.