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System Challenges of Generative AI Inference Acceleration

When you look under the hood of generative AI processing, the system design challenges are many. Learn how efficiency, power consumption, and memory issues all come into play.

15 hours ago by Lauro Rizzatti, VSORA

LITTELFUSE EBU - 51955 & 51956 Flange Mounts | Featured Product Spotlight

Littelfuse 59155 and 59156 subminiature flange mounting reed sensors stand out as the smallest of their kind on the market, tailored for industrial, appliances, and IoT proximity sensing applications. Watch and learn all about their features, specs, applications, and more!

19 hours ago by Mouser Electronics

Intel Develops Glass Substrate for Next Gen Advanced Chip Packaging Needs

Intel has unveiled new glass substrate technology for large chiplet based system-in-package chips. Glass substrates allow for denser packing of chiplets—an important for applications like AI and others.

one day ago by Duane Benson

To Accelerate Edge Design, Cadence Introduces New NPUs and SDK to AI IP

The new NPUs offload from any host processor to facilitate on-device edge computing.

September 18, 2023 by Aaron Carman

AI Networking Chip Startup, Enfabrica, Receives $125 Million in Series B Funding

With Nvidia now added to its list of strategic investors, Enfabrica has opened pre-orders on systems using its AI era fabric switch IC

September 15, 2023 by Duane Benson

Generative AI Startup Shows Off Digital In-Memory Computing Platform

Offering improved performance and lower operating costs, D-Matrix’s newest platform presents a clear path forward to scale data center AI.

September 14, 2023 by Aaron Carman

Behind Saildrone: The Company Sending Autonomous Sailboats Into the Eye of Hurricanes

Driven by wind and solar power, storm-chasing Saildrone vessels are autonomously collecting valuable scientific data for up to a year at a time.

September 12, 2023 by Aaron Carman

From Synopsys to Google, New EDA Tools Apply Advanced AI to IC Design

EDA tools now employ the newest advances in AI to help designers accelerate the IC development process.

September 11, 2023 by Jake Hertz

Zuken Releases Host of Upgrades to Flagship PCB Design Software

The latest CR-8000 release expands the design software's spectrum of signal integrity, power integrity, and electromagnetic compatibility analysis tools.

September 05, 2023 by Aaron Carman

Intel Reveals Two New Xeon Processor Lines at Hot Chips 2023

Intel’s newest Xeon processors are based on either performance cores (P-cores) or efficiency cores (E-cores), giving designers more flexibility to prioritize speed or power efficiency.

August 30, 2023 by Aaron Carman

Two Companies Use MEMS to Cool the ‘World’s Fastest Compact SSD’

At this year's Flash Memory Summit, two companies combined their respective cooling technology and SSD controllers to unlock unprecedented storage performance.

August 29, 2023 by Aaron Carman

Semiconductor Industry News: Recent IPOs, Acquisitions, and Fallen Deals

Amid the Chips Act, labor shortages, and international trade tension, the semiconductor industry is anything but predictable.

August 28, 2023 by Duane Benson

Flash Memory Summit Presenters Pitch Solutions to Hiking Memory Demands

Here are three announcements from the 2023 Flash Memory Summit that reflect some of the biggest trends in memory and storage technology.

August 18, 2023 by Jake Hertz

Understanding the Compute Hardware Behind Generative AI

Generative AI tools like ChatGPT have had a huge impact in numerous sectors of society. As engineers, it’s helpful for us to understand the computing technology that makes it possible.

August 10, 2023 by Steven Woo, Rambus

Renesas MCUs/MPUs Can Now Be Programmed With Visual Studio Code

By adding support for a familiar text editor, Renesas hopes to reach a new market of firmware designers.

August 07, 2023 by Aaron Carman

Take Our 2023 EETech Global Engineering Survey

We’d like you to join your engineering community peers and take our EETech 2023 Global Engineering Survey. You’ll get a summary of the results once they’re released. Do it, and you’ll be entered for a chance to win an Amazon card prize!

August 01, 2023 by Jeff Child

New Temperature Sensor May Simplify Thermal Monitoring for Circuits

Researchers at the University of Tokyo recently developed a new type of thermal sensor on a lightweight rolled-plastic base.

July 27, 2023 by Duane Benson

At DAC 2023, EDA Tools Roll Aimed at Next-gen IC Design and Verification

A slew of new electronic design automation (EDA) tools and resources for IC design and verification were debuted at last week’s DAC 2023 event. Here’s a sampling.

July 17, 2023 by Darshil Patel

Vulnerabilities and Attacks on Bluetooth LE Devices—Reviewing Recent Info

To understand known vulnerabilities and attacks on Bluetooth LE devices, we review some studies from the past 4+ years.

July 16, 2023 by Nthatisi Hlapisi

Rambus Serves up Quantum-safe IP Solutions To Fend off Attacks

The new Root of Trust IP from Rambus offers post-quantum cryptography hardware solutions.

July 12, 2023 by Jake Hertz