Intel has unveiled new glass substrate technology for large chiplet based system-in-package chips. Glass substrates allow for denser packing of chiplets—an important for applications like AI and others.
September 25, 2023 by Duane Benson
Angstrom-scale ICs will require innovation across the entire semiconductor ecosystem: This will include advances in both the hardware (transistors, power distribution, and connection of multi-die systems) and tools (EDA tools with AI/ML and silicon life-cycle management).
August 31, 2023 by Rob Aitken, Synopsys
Chris Padwick learned to code on a Commodore 64 as a farm kid in Saskatchewan. He now leads development of 300 teraflop AI/ML and computer vision solutions that are revolutionizing precision agriculture for Blue River Technology, a John Deere subsidiary.
June 13, 2023 by Daniel Bogdanoff
Stelios Diamantidis, a Distinguished Architect at Synopsys, is leading efforts to apply artificial intelligence to integrated circuit design and optimization of the next generation of CPUs, GPUs, and memories.
April 04, 2023 by Daniel Bogdanoff