The USC-run service that pioneered multi-project wafers in 1981 now offers a path from shared shuttle runs to full production on GlobalFoundries' FinFET and…
The USC-run service that pioneered multi-project wafers in 1981 now offers a path from shared shuttle runs to full production on GlobalFoundries' FinFET and FD-SOI processes.
The 60 V and 100 V parts pair low on-resistance with small footprints as industrial systems migrate from 12 V and 24V…
The 60 V and 100 V parts pair low on-resistance with small footprints as industrial systems migrate from 12 V and 24V rails toward 48 V distribution.
The OECD is analyzing the semiconductor industry, focusing on supply chain resilience, global value chain mapping, and…
The OECD is analyzing the semiconductor industry, focusing on supply chain resilience, global value chain mapping, and the impact of rising industrial subsidies on global market competition.
Learn how AI-powered compliance replaces manual, fragmented regulatory workflows with structured, automated data,…
Learn how AI-powered compliance replaces manual, fragmented regulatory workflows with structured, automated data, dramatically lowering the cost of EU market entry for SMEs and manufacturers.
The new Elite Pairing Studio is an interactive cloud-based simulation tool designed to give power electronics engineers…
The new Elite Pairing Studio is an interactive cloud-based simulation tool designed to give power electronics engineers deep visibility into device-level switching behavior and component trade-offs.
France’s Électronique 2030 program commits €5B+ to revitalize its semiconductor industry. Learn the details of this…
France’s Électronique 2030 program commits €5B+ to revitalize its semiconductor industry. Learn the details of this ambitious effort, and the market challenges it’s facing.
Kate Sokolnicki, Global Business Director for Sensing & Safety at Rockwell Automation, discusses the evolution of…
Kate Sokolnicki, Global Business Director for Sensing & Safety at Rockwell Automation, discusses the evolution of industrial sensing and the shift toward data-driven manufacturing.
An audit finds that the European Chips Act is "very unlikely" to hit the 20% global market target by 2030, citing…
An audit finds that the European Chips Act is "very unlikely" to hit the 20% global market target by 2030, citing fragmented funding, slow progress on FOAKs, and fierce international competition.
SpaceX’s proposed Terafab and Apple's preliminary discussions indicate escalating pressure to expand domestic…
SpaceX’s proposed Terafab and Apple's preliminary discussions indicate escalating pressure to expand domestic semiconductor production.
The device technology co-optimization (DTCO) methodology requires generating large numbers of layouts. This article…
The device technology co-optimization (DTCO) methodology requires generating large numbers of layouts. This article introduces a few ways of speeding up this time-consuming process using automation.
Singulation (wafer dicing) is critical for IC wafer manufacturing. Laser/plasma dicing is replacing mechanical methods.…
Singulation (wafer dicing) is critical for IC wafer manufacturing. Laser/plasma dicing is replacing mechanical methods. Lidrotec's laser-liquid technology offers virtually zero-damage cuts.
In this article, we'll walk through the steps of generating a Process Design Kit (PDK) for digital standard cell libraries.
In this article, we'll walk through the steps of generating a Process Design Kit (PDK) for digital standard cell libraries.
Announced today at CES, Digid has qualified its nanoscale sensing technology for volume deployment.
Announced today at CES, Digid has qualified its nanoscale sensing technology for volume deployment.
The new Arm Cortex-M33 based GD32F503/505 family emphasizes memory flexibility, reliability, and security.
The new Arm Cortex-M33 based GD32F503/505 family emphasizes memory flexibility, reliability, and security.
The Evergreen Vento FCM33 delivers modular 33 kW shelves with over 95% efficiency for semiconductor and industrial DC…
The Evergreen Vento FCM33 delivers modular 33 kW shelves with over 95% efficiency for semiconductor and industrial DC power systems.
The LP2 series delivers programmable control, compact form factor, and high configurability.
The LP2 series delivers programmable control, compact form factor, and high configurability.
These new compute modules build off industry-proven compute platforms to bring AI performance to the industrial edge.
These new compute modules build off industry-proven compute platforms to bring AI performance to the industrial edge.
The new RZ/G3E MPU with quad CPU and NPU powers next-generation HMI devices with advanced processing.
The new RZ/G3E MPU with quad CPU and NPU powers next-generation HMI devices with advanced processing.
In today's rapidly evolving aerospace and defense landscape, component engineers face an unprecedented challenge:…
In today's rapidly evolving aerospace and defense landscape, component engineers face an unprecedented challenge: ensuring every part they specify meets stringent compliance requirements while maintaining mission readiness and program viability.
From thermal annealing to atomic-level lift-off, researchers are rethinking fabrication bottlenecks to unlock new…
From thermal annealing to atomic-level lift-off, researchers are rethinking fabrication bottlenecks to unlock new performance ceilings in semiconductors.
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