The Compact Vision 5 HMI and SBC-Dragonwing-IQ-2390 give industrial OEMs two ways to deploy edge AI, real-time control, and modern connectivity on a unified…
The Compact Vision 5 HMI and SBC-Dragonwing-IQ-2390 give industrial OEMs two ways to deploy edge AI, real-time control, and modern connectivity on a unified Qualcomm platform.
By embedding heterogeneous Si, SiC, and GaN die directly into 12-inch silicon wafers with precision RDLs, Onsemi's EPP…
By embedding heterogeneous Si, SiC, and GaN die directly into 12-inch silicon wafers with precision RDLs, Onsemi's EPP replaces wire bonds and mold compounds to deliver up to 5x power density.
The Q-2390 and IQ-2390 share a Cortex-A78/A55 complex, an Adreno 704 GPU, and an optional RISC-V real-time core, with the…
The Q-2390 and IQ-2390 share a Cortex-A78/A55 complex, an Adreno 704 GPU, and an optional RISC-V real-time core, with the industrial part introducing the IQ2 Series.
Learn how MEMS sensor technology brings edge AI and vibration monitoring to smart manufacturing, enabling early defect…
Learn how MEMS sensor technology brings edge AI and vibration monitoring to smart manufacturing, enabling early defect detection and predictive maintenance to prevent downtime.
The new PolarFire FPGA-powered board from Microchip brings multiple sensors to Nvidia edge AI platforms.
The new PolarFire FPGA-powered board from Microchip brings multiple sensors to Nvidia edge AI platforms.
Beyond touchscreens: Learn how physical feedback drives reliability in automotive, consumer, medical, and industrial…
Beyond touchscreens: Learn how physical feedback drives reliability in automotive, consumer, medical, and industrial electronics applications.
In this edition of Business Shorts, SK Group and Nvidia plan $500 billion in AI infrastructure, TDK and LG Innotek team…
In this edition of Business Shorts, SK Group and Nvidia plan $500 billion in AI infrastructure, TDK and LG Innotek team up on robotic sensing, and Micron locks in automotive memory supply.
The Titanium Edge FPGA family targets constrained edge AI with 50% lower power, compact SiP packages, high-speed MIPI…
The Titanium Edge FPGA family targets constrained edge AI with 50% lower power, compact SiP packages, high-speed MIPI I/O, and robust security/reliability features for intelligent systems.
The 60 V and 100 V parts pair low on-resistance with small footprints as industrial systems migrate from 12 V and 24V…
The 60 V and 100 V parts pair low on-resistance with small footprints as industrial systems migrate from 12 V and 24V rails toward 48 V distribution.
Advantech ADAM-250 16 DI/O Rugged IP67 Remote I/O Module is designed to simplify distributed industrial automation with…
Advantech ADAM-250 16 DI/O Rugged IP67 Remote I/O Module is designed to simplify distributed industrial automation with its compact, plug-and-play, cabinet-free architecture. Watch and learn all about their features, specs, applications, and more!
The new Elite Pairing Studio is an interactive cloud-based simulation tool designed to give power electronics engineers…
The new Elite Pairing Studio is an interactive cloud-based simulation tool designed to give power electronics engineers deep visibility into device-level switching behavior and component trade-offs.
TE Connectivity Measurement Specialties 85UHP Pressure Sensor is a compact, high-precision sensing solution designed for…
TE Connectivity Measurement Specialties 85UHP Pressure Sensor is a compact, high-precision sensing solution designed for ultra-high purity semiconductor manufacturing environments. Watch and learn all about their features, specs, applications, and more!
Kate Sokolnicki, Global Business Director for Sensing & Safety at Rockwell Automation, discusses the evolution of…
Kate Sokolnicki, Global Business Director for Sensing & Safety at Rockwell Automation, discusses the evolution of industrial sensing and the shift toward data-driven manufacturing.
Nils Beckmann, Director of Engineering for Intelligent Automation at Emerson, shares his insights on properly utilizing…
Nils Beckmann, Director of Engineering for Intelligent Automation at Emerson, shares his insights on properly utilizing sensor hardware and application software to meet the challenges of the automation industry.
Learn how LM Semi's Mesh AI platform delivers autonomous, secure, node-level intelligence via non-cellular NR+ mesh…
Learn how LM Semi's Mesh AI platform delivers autonomous, secure, node-level intelligence via non-cellular NR+ mesh networks, addressing AI scalability for billions of devices.
SICK is one of the world’s leading sensor solutions providers in the industrial sector. Salim Dubbous provides expert…
SICK is one of the world’s leading sensor solutions providers in the industrial sector. Salim Dubbous provides expert insights on efficiently deploying and using sensors on the factory floor.
Announced at Embedded World, the new Genio lineup spans value to flagship tiers, with on-device GenAI acceleration…
Announced at Embedded World, the new Genio lineup spans value to flagship tiers, with on-device GenAI acceleration ranging from 6 TOPS to over 50 TOPS.
Toshiba has expanded its lineup with the TC75W71FU dual comparator with a 30-45 ns response and rail‑to‑rail I/O for…
Toshiba has expanded its lineup with the TC75W71FU dual comparator with a 30-45 ns response and rail‑to‑rail I/O for safer overcurrent detection.
The silicon carbide gate drivers and an ultra-low-loss isolated current sensor can improve efficiency and power density…
The silicon carbide gate drivers and an ultra-low-loss isolated current sensor can improve efficiency and power density in high-voltage systems.
Korean semiconductor giants—like Samsung and SK hynix—are shifting focus from traditional memory to AI-driven tech,…
Korean semiconductor giants—like Samsung and SK hynix—are shifting focus from traditional memory to AI-driven tech, such as HBM, amid global competition, US controls, and government support.
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