Join leading electronics industry experts from Mouser, XTG, and MacroFab as we discuss the state of the supply chain, the hottest trends in business and technology, where we are headed, and how we can all work together more efficiently.
November 22, 2022 by Daniel Bogdanoff
Designing PCBs and enclosures in parallel is the best way to ensure high-quality system designs. Learn how to use Fusion 360 to marry the 2D domain of PCB design with the 3D domain of mechanical enclosure design.
November 03, 2022 by Edwin Robledo, Fusion 360 Electronics
Today's advanced chips need power DC-DC sources right at the point-of-load (POL). This article discusses the need for distributed power networks and the role of POL power devices. We introduce a class of POL DC-DC converters from TDK that use advanced packaging techniques to meet performance needs.
In partnership with Digi-Key Electronics
One effective solution to the requirements of 5G technology is the use of HLC (High-layer Count) PCB boards that integrate key features such as skip vias, POVF manufacturing, advanced raw materials, and impedance control.
November 11, 2021 by Sarah Kuang, Kinwong
Learn how to use single-ended amplifiers in low-side current sensing, including PCB layout tips and considerations, as well as a layout example based on an op-amp in the SOT23 package.
August 10, 2021 by Dr. Steve Arar
In this second installment of the "Protect Your Ports! Top Design Tips to Keep Your Communications Connected" series, we explore what protecting high-speed interfaces looks like, including USB, HDMI, DisplayPort, and eSATA.
June 29, 2021 by Todd Phillips, Littelfuse