Asian Development Bank (ADB) is advancing Asia's semiconductor sector by expanding workforce training in Thailand and offering financial de-risking tools to…
Asian Development Bank (ADB) is advancing Asia's semiconductor sector by expanding workforce training in Thailand and offering financial de-risking tools to strengthen supply chain resilience.
Timing failures rarely announce themselves. They usually surface as system instability. Join us for a look at how…
Timing failures rarely announce themselves. They usually surface as system instability. Join us for a look at how SiTime's precision timing solutions keep that dependency silent for decades.
Announced today at OCP Summit, Cisco and Nvidia have partnered on the open USFP optical spec, alongside new Cisco Silicon…
Announced today at OCP Summit, Cisco and Nvidia have partnered on the open USFP optical spec, alongside new Cisco Silicon One ASICs and runtime security to scale next-generation Ethernet AI fabrics.
The OAX7700 ASIC adds an NPU and pre-roll video capture to cut parking surveillance power consumption by 97%.
The OAX7700 ASIC adds an NPU and pre-roll video capture to cut parking surveillance power consumption by 97%.
After building a $10B+ smartphone business, Yenchi Lee is standing up MediaTek's Datacenter BU from scratch to tackle…
After building a $10B+ smartphone business, Yenchi Lee is standing up MediaTek's Datacenter BU from scratch to tackle full-stack AI silicon, 2.5D packaging, and co-packaged optics.
John Koeter, former SVP of IP at Synopsys (retired), joins the podcast to discuss how pre-designed silicon blocks are…
John Koeter, former SVP of IP at Synopsys (retired), joins the podcast to discuss how pre-designed silicon blocks are accelerating chip development in the age of AI and 3D ICs.
Touted as the first commercial CAN XL transceiver, the device offers 20 Mbps data rates, larger payloads, and CAN FD…
Touted as the first commercial CAN XL transceiver, the device offers 20 Mbps data rates, larger payloads, and CAN FD compatibility for industrial and robotic networks.
The Nancy Grace Roman Space Telescope’s mirror may get the headlines, but its detector chips, photon-counting cameras,…
The Nancy Grace Roman Space Telescope’s mirror may get the headlines, but its detector chips, photon-counting cameras, and downlink amplifier tell the electronics story.
Skyrocketing SoC costs mean traditional testing can't catch every sub-7nm escape. Early formal verification, unified…
Skyrocketing SoC costs mean traditional testing can't catch every sub-7nm escape. Early formal verification, unified workflows, and strict gated signoffs are key to avoiding costly respins.
The FCE870X and FME170X share the same high-end feature set across two package formats, giving product teams a choice…
The FCE870X and FME170X share the same high-end feature set across two package formats, giving product teams a choice between embedded and modular designs.
The new XpressConnect PCIe 6.0 and CXL 3.1 Retimers reign in signal integrity challenges in AI data centers and other…
The new XpressConnect PCIe 6.0 and CXL 3.1 Retimers reign in signal integrity challenges in AI data centers and other high-bandwidth installations.
France’s Électronique 2030 program commits €5B+ to revitalize its semiconductor industry. Learn the details of this…
France’s Électronique 2030 program commits €5B+ to revitalize its semiconductor industry. Learn the details of this ambitious effort, and the market challenges it’s facing.
Broadcom’s high-integration Wi-Fi 8 & NPU-accelerated 50G PON gateway SoCs aim to build a cohesive, 50 Gbps broadband…
Broadcom’s high-integration Wi-Fi 8 & NPU-accelerated 50G PON gateway SoCs aim to build a cohesive, 50 Gbps broadband access ecosystem for the AI-infused home.
An audit finds that the European Chips Act is "very unlikely" to hit the 20% global market target by 2030, citing…
An audit finds that the European Chips Act is "very unlikely" to hit the 20% global market target by 2030, citing fragmented funding, slow progress on FOAKs, and fierce international competition.
Advanced packaging is at a crossroads due to AI demand. Learn the four emerging paths—CoWoS, CoPoS, glass-core, and…
Advanced packaging is at a crossroads due to AI demand. Learn the four emerging paths—CoWoS, CoPoS, glass-core, and CoWoP—and how to choose the right one for your multi-die system design.
Learn how the EU's premier lending institution is deploying billions in loans, equity, and blended finance to build a…
Learn how the EU's premier lending institution is deploying billions in loans, equity, and blended finance to build a sovereign European chip ecosystem.
Singulation (wafer dicing) is critical for IC wafer manufacturing. Laser/plasma dicing is replacing mechanical methods.…
Singulation (wafer dicing) is critical for IC wafer manufacturing. Laser/plasma dicing is replacing mechanical methods. Lidrotec's laser-liquid technology offers virtually zero-damage cuts.
The expanded maXTouch M1 family delivers reliable capacitive sensing from compact automotive displays to ultra-wide…
The expanded maXTouch M1 family delivers reliable capacitive sensing from compact automotive displays to ultra-wide free-form screens.
In this article, we'll walk through the steps of generating a Process Design Kit (PDK) for digital standard cell libraries.
In this article, we'll walk through the steps of generating a Process Design Kit (PDK) for digital standard cell libraries.
Announced today, Cadence's new Tensilica HiFi iQ DSP doubles compute, octuples AI performance, and cuts power by 25% over…
Announced today, Cadence's new Tensilica HiFi iQ DSP doubles compute, octuples AI performance, and cuts power by 25% over its predecessor, targeting next-gen AI-voice and immersive automotive audio.
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