RackCommander groups MaxLinear's USB UARTs, RS-485 transceivers, GPIO expanders, and power devices for rack-level management.
RackCommander groups MaxLinear's USB UARTs, RS-485 transceivers, GPIO expanders, and power devices for rack-level management.
Learn to decouple application logic from physical routing using a Board Support Package (BSP). This layered architecture…
Learn to decouple application logic from physical routing using a Board Support Package (BSP). This layered architecture accelerates prototyping and minimizes costly respins on custom boards.
In this edition of Business Shorts, we spotlight five announcements that show AI demand is reshaping everything from Wall…
In this edition of Business Shorts, we spotlight five announcements that show AI demand is reshaping everything from Wall Street financing to washing machines.
Discover how the LT1079 quad op-amp minimizes sensor loading in battery-powered designs. Active cancellation and an…
Discover how the LT1079 quad op-amp minimizes sensor loading in battery-powered designs. Active cancellation and an onboard bridge network ensure maximum precision for resistive sensors.
The new MCX A5 MCUs integrate 10BASE-T1S Ethernet, topology discovery, and post-quantum security to streamline and…
The new MCX A5 MCUs integrate 10BASE-T1S Ethernet, topology discovery, and post-quantum security to streamline and protect industrial edge networks.
The new PolarFire FPGA-powered board from Microchip brings multiple sensors to Nvidia edge AI platforms.
The new PolarFire FPGA-powered board from Microchip brings multiple sensors to Nvidia edge AI platforms.
The rebuilt platform puts the previously closed cloud backend under an Apache 2.0 license and runs on AWS serverless…
The rebuilt platform puts the previously closed cloud backend under an Apache 2.0 license and runs on AWS serverless services in a customer's own account.
As software-defined embedded systems evolve, dynamic storage architectures replace static partitioning to optimize flash…
As software-defined embedded systems evolve, dynamic storage architectures replace static partitioning to optimize flash efficiency, support long-term updates, and control rising hardware costs.
This project brief describes how to build and use an Arduino-compatible board that reads a linear Hall-effect sensor and…
This project brief describes how to build and use an Arduino-compatible board that reads a linear Hall-effect sensor and reports the measurement over an RS-485 bus.
The team employed a quantum material and chip architecture that could be key in scaling quantum computers to one million qubits.
The team employed a quantum material and chip architecture that could be key in scaling quantum computers to one million qubits.
Joaquin Torrecilla, Keysight’s VP of Software Transformation, joins the show to discuss the evolution of wireless…
Joaquin Torrecilla, Keysight’s VP of Software Transformation, joins the show to discuss the evolution of wireless tech—from early Bluetooth to LEO satellite lasers, RedCap, and AI-native 6G.
New chip weds advanced technology from Nuvoton and Klippel to create a high-performance audio solution for smart audio devices
New chip weds advanced technology from Nuvoton and Klippel to create a high-performance audio solution for smart audio devices
The ATS296X series from Actions Technology combines Ceva's High Data Throughput radio IP with Actions' own dual-RF…
The ATS296X series from Actions Technology combines Ceva's High Data Throughput radio IP with Actions' own dual-RF design, targeting links of roughly 7.5 Mbps.
The EFR32BG2B SoC family supports Bluetooth 6 and is the lowest power Bluetooth LE chip with channel sounding from Silicon Labs.
The EFR32BG2B SoC family supports Bluetooth 6 and is the lowest power Bluetooth LE chip with channel sounding from Silicon Labs.
The six new chips offer a wide range of connectivity and graphics options for wearables, hearables, AR devices, health…
The six new chips offer a wide range of connectivity and graphics options for wearables, hearables, AR devices, health monitors, industrial sensors, and beyond.
The FCE870X and FME170X share the same high-end feature set across two package formats, giving product teams a choice…
The FCE870X and FME170X share the same high-end feature set across two package formats, giving product teams a choice between embedded and modular designs.
In this edition of Business Shorts, SK Group and Nvidia plan $500 billion in AI infrastructure, TDK and LG Innotek team…
In this edition of Business Shorts, SK Group and Nvidia plan $500 billion in AI infrastructure, TDK and LG Innotek team up on robotic sensing, and Micron locks in automotive memory supply.
Hirose Electric IT18 COM-HPC® Low-Profile BGA Mezzanine Connectors provide high-speed, high-density interconnect…
Hirose Electric IT18 COM-HPC® Low-Profile BGA Mezzanine Connectors provide high-speed, high-density interconnect solutions for next-generation embedded computing platforms. Watch and learn all about their features, specs, applications, and more!
On-device AI enhances retail by enabling real-time processing for robotics, kiosks, and more, offering low latency,…
On-device AI enhances retail by enabling real-time processing for robotics, kiosks, and more, offering low latency, improved privacy, and operational efficiency for a better customer experience.
A new three-phase motor gate driver integrates a bootstrap diode and robust protective mechanisms to streamline designs…
A new three-phase motor gate driver integrates a bootstrap diode and robust protective mechanisms to streamline designs and reduce switching losses in compact motor applications.
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