The Seattle startup has reached a $1.6 billion valuation by turning Bluetooth LE chips into globally trackable assets—all the way from space.
The Seattle startup has reached a $1.6 billion valuation by turning Bluetooth LE chips into globally trackable assets—all the way from space.
Rambus' CryptoManager Root of Trust solution for Caliptra-based SoCs adds hardware security, attack protection, and…
Rambus' CryptoManager Root of Trust solution for Caliptra-based SoCs adds hardware security, attack protection, and lifecycle management for data center and AI chips.
The Snapdragon 8 Elite Extreme Gen 6 and 8 Elite Gen 6 are the first mobile SoCs to break the 5 GHz barrier, while…
The Snapdragon 8 Elite Extreme Gen 6 and 8 Elite Gen 6 are the first mobile SoCs to break the 5 GHz barrier, while Snapdragon Sound Elite Gen 2 targets camera-equipped AI wearables.
In this interview article, Renesas VP Peter Jenkins discusses how the company is leveraging its automotive sensor…
In this interview article, Renesas VP Peter Jenkins discusses how the company is leveraging its automotive sensor heritage and mixed-signal ICs to power the future of edge AI and humanoid robotics.
Nordic Semiconductor's nRF54LC10A combines Bluetooth LE, Thread, Zigbee, and Matter support with low power consumption…
Nordic Semiconductor's nRF54LC10A combines Bluetooth LE, Thread, Zigbee, and Matter support with low power consumption and advanced security in a compact package for IoT devices.
This project brief describes how to build and use an Arduino-compatible interface board that reads an on-board pressure…
This project brief describes how to build and use an Arduino-compatible interface board that reads an on-board pressure sensor and reports the measurement over an RS-485 network.
A new addition to Nvidia's CUDA-Q quantum computing platform adds logical qubit error correction and abstraction to…
A new addition to Nvidia's CUDA-Q quantum computing platform adds logical qubit error correction and abstraction to significantly speed reliable quantum application development.
The SY757xx family translates clock inputs from 1.2 to 3.3 V down to 1.2 V LVCMOS outputs at frequencies up to 250 MHz,
The SY757xx family translates clock inputs from 1.2 to 3.3 V down to 1.2 V LVCMOS outputs at frequencies up to 250 MHz,
The new PSOC Control C3 product line focuses on secure, high-performance power conversion and motor control applications.
The new PSOC Control C3 product line focuses on secure, high-performance power conversion and motor control applications.
In this Retro Register, we look back at the first EEPROM-based microcontroller and how a cheap chip with a simple…
In this Retro Register, we look back at the first EEPROM-based microcontroller and how a cheap chip with a simple programming interface created the hobbyist MCU scene.
This project brief describes how to build and use an Arduino-compatible interface board that reads a 2-axis thumb…
This project brief describes how to build and use an Arduino-compatible interface board that reads a 2-axis thumb joystick and transmits its position over an RS-485 network.
John Koeter, former SVP of IP at Synopsys (retired), joins the podcast to discuss how pre-designed silicon blocks are…
John Koeter, former SVP of IP at Synopsys (retired), joins the podcast to discuss how pre-designed silicon blocks are accelerating chip development in the age of AI and 3D ICs.
Announced today, MediaTek's new 3 nm Dimensity CX C10 Max SoC features an all-big-core Arm CPU and NPU 890 to bring…
Announced today, MediaTek's new 3 nm Dimensity CX C10 Max SoC features an all-big-core Arm CPU and NPU 890 to bring flagship AI performance to fanless Googlebooks.
Nexperia NSF0x0120 N-Channel SiC MOSFETs deliver high-voltage switching performance for demanding power conversion…
Nexperia NSF0x0120 N-Channel SiC MOSFETs deliver high-voltage switching performance for demanding power conversion applications. Watch and learn all about their features, specs, applications, and more!
Toshiba’s M4V Group MCUs combine an Arm Cortex-M4 core, layered security, integrated memory, motor control support, and…
Toshiba’s M4V Group MCUs combine an Arm Cortex-M4 core, layered security, integrated memory, motor control support, and built-in peripherals for secure IoT and industrial system control.
The Compact Vision 5 HMI and SBC-Dragonwing-IQ-2390 give industrial OEMs two ways to deploy edge AI, real-time control,…
The Compact Vision 5 HMI and SBC-Dragonwing-IQ-2390 give industrial OEMs two ways to deploy edge AI, real-time control, and modern connectivity on a unified Qualcomm platform.
By embedding heterogeneous Si, SiC, and GaN die directly into 12-inch silicon wafers with precision RDLs, Onsemi's EPP…
By embedding heterogeneous Si, SiC, and GaN die directly into 12-inch silicon wafers with precision RDLs, Onsemi's EPP replaces wire bonds and mold compounds to deliver up to 5x power density.
This project brief describes how to build and use an Arduino-compatible relay interface board that switches a 10 A load…
This project brief describes how to build and use an Arduino-compatible relay interface board that switches a 10 A load over an RS-485 network.
The flagship system-on-chip pairs a 4th-generation All Big Core CPU and dual neural processing units to drive high-end…
The flagship system-on-chip pairs a 4th-generation All Big Core CPU and dual neural processing units to drive high-end compute and proactive mobile intelligence.
Launched today, Delos Data’s Nonstop AI portfolio intros Apollo Data Interface silicon, the Morpheus development…
Launched today, Delos Data’s Nonstop AI portfolio intros Apollo Data Interface silicon, the Morpheus development platform, and a system-level reference architecture to eliminate tail latency, maximize power efficiency, and scale agentic AI clusters.
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