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Hirose Electric IT18 COM-HPC® Low-Profile BGA Mezzanine Connectors | New Product Brief

Hirose Electric IT18 COM-HPC® Low-Profile BGA Mezzanine Connectors | New Product Brief

Hirose Electric IT18 COM-HPC® Low-Profile BGA Mezzanine Connectors provide high-speed, high-density interconnect solutions for next-generation embedded computing platforms. Watch and learn all about their features, specs, applications, and more!


The New Era of Retail Begins at the Edge Leveraging On-Device AI

The New Era of Retail Begins at the Edge Leveraging On-Device AI

On-device AI enhances retail by enabling real-time processing for robotics, kiosks, and more, offering low latency, improved privacy, and operational efficiency for a better customer experience.


Geehy Intros 200 V Motor Gate Driver for Compact 3-Phase Drive Systems

Geehy Intros 200 V Motor Gate Driver for Compact 3-Phase Drive Systems

A new three-phase motor gate driver integrates a bootstrap diode and robust protective mechanisms to streamline designs and reduce switching losses in compact motor applications.


News Jul 28, 2026 by Jeff Child
Microchip’s Latest SDK Brings Sparse Neural Networks to PolarFire FPGAs

Microchip’s Latest SDK Brings Sparse Neural Networks to PolarFire FPGAs

Sparsity-based model compression from the Neuronix AI Labs acquisition promises up to 2x faster CNN inference on low-power, SEU-immune hardware.


News Jul 24, 2026 by Luke James
AMD Unveils Processors, Boards, and Dev Platform—All Tuned for Physical AI

AMD Unveils Processors, Boards, and Dev Platform—All Tuned for Physical AI

Announced today, the new Ryzen AI Embedded X100 Series and Kria AI platform unify CPU, GPU, and NPU compute to provide the low-latency performance and deterministic control required for advanced physical AI robotics.


News Jul 23, 2026 by Jeff Child
A Precision Multi-Sensor Data Acquisition Module

A Precision Multi-Sensor Data Acquisition Module

Build a low-noise, 32-bit delta-sigma ADC board designed around the ADS1262. This 10-channel design features integrated signal conditioning for RTDs, thermocouples, and strain gauges.


Embedded Intelligence: Insights From An Industry Pioneer

Embedded Intelligence: Insights From An Industry Pioneer

Embedded industry pioneer Christian Eder, co-founder of congatec, joins Daniel Bogdanoff to discuss 30 years of modular design, open standards like COM-HPC, and the future of edge AI.


Infineon Serves up Security IC Supporting USB and NFC Connectivity

Infineon Serves up Security IC Supporting USB and NFC Connectivity

The new SECORA ID Key S USB security solution supports FIDO2 and PKI through hardware and near field interfaces.


News Jul 20, 2026 by Duane Benson
Understanding the Noise Performance of AM Receivers with Envelope Detection

Understanding the Noise Performance of AM Receivers with Envelope Detection

Envelope detection is simple, but that simplicity has a noise-performance cost. Here’s how much SNR conventional AM gives up compared to its coherent counterparts.


Arduino Launches Plug-and-Play Modules for Long-Range Sensor Projects

Arduino Launches Plug-and-Play Modules for Long-Range Sensor Projects

With the three new boards, developers can seamlessly integrate complex I2C sensor networks with motor drive systems without the headaches of chaotic wiring.


News Jul 17, 2026 by Dr. Steve Arar
Nuvoton Rolls MCU Blending 24-bit ADC and Analog Front End

Nuvoton Rolls MCU Blending 24-bit ADC and Analog Front End

The Cortex-M23 microcontroller pairs metrology-grade signal acquisition with an LCD driver and Class-D voice output in a single LQFP128 package.


News Jul 15, 2026 by Luke James
Efinix Seeks to Overcome Edge AI Constraints With New FPGA Family

Efinix Seeks to Overcome Edge AI Constraints With New FPGA Family

The Titanium Edge FPGA family targets constrained edge AI with 50% lower power, compact SiP packages, high-speed MIPI I/O, and robust security/reliability features for intelligent systems.


News Jul 14, 2026 by Austin Futrell
STMicro Debuts Single-Die Mobile Chip With Post-Quantum Cryptography

STMicro Debuts Single-Die Mobile Chip With Post-Quantum Cryptography

The ST54M places an NFC controller, secure element, and eSIM on one die and adds a hardware accelerator for NIST's post-quantum algorithms.


News Jul 14, 2026 by Luke James
NXP Semiconductors i.MX 95 Applications Processors | Featured Product Spotlight

NXP Semiconductors i.MX 95 Applications Processors | Featured Product Spotlight

NXP Semiconductors i.MX 95 Application Processors deliver intelligent, secure, and real-time edge computing for next-generation embedded systems. Watch and learn all about their features, specs, applications, and more!


Analyzing the Noise Performance of Coherent SSB Demodulators

Analyzing the Noise Performance of Coherent SSB Demodulators

Using a graphical approach, we show that coherent SSB demodulation leaves the input and output SNR unchanged, then compare its noise performance to DSB-SC and baseband systems.


OECD Is Putting Supply Chain, Value Chain, and Subsidies in the Spotlight

OECD Is Putting Supply Chain, Value Chain, and Subsidies in the Spotlight

The OECD is analyzing the semiconductor industry, focusing on supply chain resilience, global value chain mapping, and the impact of rising industrial subsidies on global market competition.


News Jul 09, 2026 by Gordon Feller
A Four-Channel RS-422 Differential Line Receiver Module

A Four-Channel RS-422 Differential Line Receiver Module

This project brief describes how to build and use a four-channel differential line receiver module for balanced RS-422 and RS-485 data links.


MIT Chip Builds Real-Time 3D Maps for Robots on the Power of One LED

MIT Chip Builds Real-Time 3D Maps for Robots on the Power of One LED

Called Gleanmer, the 16-nm system-on-chip swaps memory-hungry voxels for compact Gaussian “blobs” to map and navigate at roughly 6 mW.


News Jul 07, 2026 by Luke James
Bourns High-Power Modular Contacts | Featured Product Spotlight

Bourns High-Power Modular Contacts | Featured Product Spotlight

Bourns High-Power Modular Contacts deliver compact, reliable, and scalable interconnect solutions for high-current applications in demanding environments. Watch and learn all about their features, specs, applications, and more!


Nvidia First to Roll Out Full-Stack Safety System for Physical AI in Robotics

Nvidia First to Roll Out Full-Stack Safety System for Physical AI in Robotics

The full-stack platform pairs the IGX Thor compute module with a safety-certified software stack and an accredited inspection lab, with humanoid maker Agility as the first adopter.


News Jul 06, 2026 by Luke James