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Even Without AR, Size Remains the Achilles Heel of Smart Glasses

While integrating AR into smart glasses requires many size-consuming components, even normal wearable features take up precious PCB real estate. Now, Facebook says it has re-engineered components to fit in a lightweight frame.

18 hours ago by Dr. Steve Arar

A Closer Look at the Stars of Apple Event 2021: The A15 Bionic and iPhone13

At this year's Apple Event 2021, the company announced details about the newest Apple A-series cellular SoC—the A15 Bionic—and the iPhone13.

one day ago by Adrian Gibbons

Ultra-Low Power Wi-Fi Unleashes The Potential for Cloud-Connected IoT Products

This session will highlight the key capabilities of how Wi-Fi-connected IoT sensors and products that are battery-based and cloud-connected will exceed consumers' expectations for battery lifetime and ease of use.

In partnership with InnoPhase

The Swiftly Changing Landscape of Semiconductor Companies: 2021 Acquisitions Update

With large mergers like Renesas acquiring Dialog and Analog acquiring Maxim Integrated recently taking place, let's take a look at the effects of consolidating the semiconductor industry.

September 11, 2021 by Jake Hertz

Knock on Wood: Researchers Turn to Wood as a Surprising Electronic Substrate

Wood and electronics seem an unlikely duo. But researchers are finding promise in cellulose substrates in energy-harvesting wooden floors and even "Woodsat" satellites.

September 10, 2021 by Ikimi .O

Microchip Faces Connectivity Issues for PAM4 with “Most Compact” Ethernet PHY

The demand for better connectivity has prompted the shift to 112G PAM4, though there are many challenges like signal integrity. Taking on these challenges, Microchip unveils its latest solution.

September 09, 2021 by Jake Hertz

Alif Semiconductor Hopes to Push IoT Applications Further with New MCU Families

As the IoT market heats up, new devices are coming out to keep up with the momentum. One latest development comes from Alif Semiconductor with two new MCU families the "Ensemble" and "Crescendo."

September 08, 2021 by Jake Hertz

TI Lowers the Acoustics with BLDC Motor Drivers Leveraging Two Control Schemes

Distracted by the noise caused by the many appliances in your home? TI’s newest BLDC motor drivers claim to quiet appliances by up to 3.3 dBA using trapezoidal and field-oriented control.

September 08, 2021 by Adrian Gibbons

RISC-V Gains Traction in the Data Center

RISC-V is often associated with embedded projects. Now, the open-source ISA may be a more common player in higher-end computing markets.

September 07, 2021 by Jake Hertz

Researchers Speed Up Quantum Computing with Advances from Algorithms to Sensors

As the push for better quantum computing heats up, researchers hope to tackle the issues with developments in quantum sensors, algorithms, and quibits.

September 06, 2021 by Kristijan Nelkovski

ST Expands MasterGaN Portfolio to Simplify 45W and 150W Designs

MasterGaN integrates GaN transistors and half-bridge gate drivers on a single chip. Now, the family has grown to support higher-efficiency technology.

September 04, 2021 by Ikimi .O

Beyond HBM: Samsung Breaks Processing-in-memory Into AI Applications

AI applications bring with them many challenges, including data processing and memory. Samsung hopes to take on these issues by combining processing-in-memory with high bandwidth memory.

August 30, 2021 by Antonio Anzaldua Jr.

Wearable Sensors Monitor Biometrics Underwater—and in Deep Tissue

Health wearables are one of the most in-demand consumer electronics. Here's a roundup of a few recent sensor-level innovations.

August 29, 2021 by Ikimi .O

From Home to the Quantum Realm: 3 Companies Push Processor Limitations

As the need for better, faster, and safer processing continues to grow, companies like Intel, Cadence, and QuantWare are bringing their A-game to the workplace, vehicles, and quantum computing.

August 28, 2021 by Ikimi .O

Achronix’s Speedster7t FPGA Launches to the Next Level Thanks to Synopsys’ IP

Designing on silicon is expensive, which is why it's important to get it right on your first pass. Achieving just that is Achronix's Speedster7t FPGA for AI applications, with Synopsys' help.

August 27, 2021 by Jake Hertz

Update HDL Code in Space From Earth? ST and Xilinx Team Up for Rad-hard FPGAs

The race for space has created a flood of innovations in space-rated tech. Hoping to strike gold with updatable FPGAs, Xilinx and STMicroelectronics have teamed up for a rad-hard solution.

August 26, 2021 by Jake Hertz

AI Accelerator Chip with 1000 RISC-V Cores Shakes Up Data Center Inference

As the need for AI and data center processing keeps rising, a new AI accelerator has risen to the challenge. After years of development, Esperanto has announced its ET-SoC-1 ML inference chip.

August 26, 2021 by Jake Hertz

Toasty Textiles: Researchers Weave Thermoelectric Generators Into Cotton

Researchers are now diving into textile-based thermoelectric generators—a niche subfield of wearables.

August 25, 2021 by Abdulwaliy Oyekunle

Intel Strikes Back: How CEO Pat Gelsinger Plans to Revive a Microchip Goliath

Despite many challenges, like companies moving to in-house chip fabrication and delays in processing node technology, Intel hopes to forge ahead with a new CEO and roadmap.

August 25, 2021 by Tyler Charboneau

Highlights of Intel’s 2021 Architecture Day—a Computing-centric Event

At Intel's 2021 Architecture Day, CEO Pat Gelsinger called the company's new computing technology "magic." Here are a few highlights from the event.

August 24, 2021 by Jake Hertz