New BrightSense global-shutter sensors reduce power consumption by 10x for continuous sensing in battery-constrained wearables.
New BrightSense global-shutter sensors reduce power consumption by 10x for continuous sensing in battery-constrained wearables.
Claimed as the “world’s first” 4-level buck converter, the device enables high-efficiency 6 A fast charging for…
Claimed as the “world’s first” 4-level buck converter, the device enables high-efficiency 6 A fast charging for mobile and portable electronics.
Announced today at CES, Digid has qualified its nanoscale sensing technology for volume deployment.
Announced today at CES, Digid has qualified its nanoscale sensing technology for volume deployment.
Announced today, SiTime is expanding into a $4 billion resonator market with its Titan platform.
Announced today, SiTime is expanding into a $4 billion resonator market with its Titan platform.
The new power MOSFET offers low ON-resistances combined with a compact 2.0 mm × 2.0 mm package.
The new power MOSFET offers low ON-resistances combined with a compact 2.0 mm × 2.0 mm package.
The compact AI-enabled sensor captures both routine movement and high-g impacts, enabling smarter wearables and IoT devices.
The compact AI-enabled sensor captures both routine movement and high-g impacts, enabling smarter wearables and IoT devices.
ST claims the new two-in-one MEMS accelerometer can measure events ranging from minor movements to intense impacts with…
ST claims the new two-in-one MEMS accelerometer can measure events ranging from minor movements to intense impacts with equal accuracy.
ST’s new solution has a highly integrated analog front end for advanced wearable features.
ST’s new solution has a highly integrated analog front end for advanced wearable features.
MCUs that only do control tasks are one thing. But in today’s AI age, a truly AI-enabled MCU needs to offer more. Learn…
MCUs that only do control tasks are one thing. But in today’s AI age, a truly AI-enabled MCU needs to offer more. Learn the important factors—from optimized neural processing units (NPUs) to power efficient architectures to clever memory topologies.
The new oscillator chip delivers low power consumption and ±20 ppm frequency stability to small IoT devices in a 1.2 mm…
The new oscillator chip delivers low power consumption and ±20 ppm frequency stability to small IoT devices in a 1.2 mm x 1.1 mm QFN package
With Microchip’s newest dual-pad reference design, designers can start developing with the Qi 2.0 standard.
With Microchip’s newest dual-pad reference design, designers can start developing with the Qi 2.0 standard.
The new MEMS devices have a 76% smaller footprint than Bosch’s current generation of acceleration sensors.
The new MEMS devices have a 76% smaller footprint than Bosch’s current generation of acceleration sensors.
The new analog front end integrates a number of major vital sign monitors into a single device for wearable designs.
The new analog front end integrates a number of major vital sign monitors into a single device for wearable designs.
At the 2023 North America RISC-V Summit, dozens of presenters will showcase RISC-V innovations in desktop computing and…
At the 2023 North America RISC-V Summit, dozens of presenters will showcase RISC-V innovations in desktop computing and wearable applications.
u-blox's MIA-M10 Standard Precision GNSS Modules offer outstanding sensitivity and rapid acquisition times across all L1…
u-blox's MIA-M10 Standard Precision GNSS Modules offer outstanding sensitivity and rapid acquisition times across all L1 GNSS systems. Watch and learn all about their features, specs, applications, and more!
Intel has unveiled new glass substrate technology for large chiplet based system-in-package chips. Glass substrates allow…
Intel has unveiled new glass substrate technology for large chiplet based system-in-package chips. Glass substrates allow for denser packing of chiplets—an important for applications like AI and others.
In Bluetooth LE (BLE), security is a multifaceted beast. Learn the three main security modes of BLE, along with five…
In Bluetooth LE (BLE), security is a multifaceted beast. Learn the three main security modes of BLE, along with five critical BLE security procedures.
Pairing is an important concept in Bluetooth LE. Let’s examine the fundamentals of Bluetooth LE pairing, outlining how…
Pairing is an important concept in Bluetooth LE. Let’s examine the fundamentals of Bluetooth LE pairing, outlining how LE devices securely share keys between trusted devices.
Aimed at easing the process of developing devices that require HD haptics, Titan Haptics has unveiled a tiny board…
Aimed at easing the process of developing devices that require HD haptics, Titan Haptics has unveiled a tiny board designed both for development and and for embedding into your design.
Learn how ATT and GATT protocols help Bluetooth LE devices store and manage data, making it easier for connected devices…
Learn how ATT and GATT protocols help Bluetooth LE devices store and manage data, making it easier for connected devices to work together seamlessly.