Latest Smartwatches Articles and Videos

Intel Develops Glass Substrate for Next Gen Advanced Chip Packaging Needs

Intel has unveiled new glass substrate technology for large chiplet based system-in-package chips. Glass substrates allow for denser packing of chiplets—an important for applications like AI and others.

2 days ago by Duane Benson

Bluetooth LE: Security Modes and Procedures Explained

In Bluetooth LE (BLE), security is a multifaceted beast. Learn the three main security modes of BLE, along with five critical BLE security procedures.

3 days ago by Nthatisi Hlapisi

Understanding Bluetooth LE Pairing—Step by Step

Pairing is an important concept in Bluetooth LE. Let’s examine the fundamentals of Bluetooth LE pairing, outlining how LE devices securely share keys between trusted devices.

September 10, 2023 by Nthatisi Hlapisi

Haptics Development Board is Small Enough to Fit Inside Your Lightsaber

Aimed at easing the process of developing devices that require HD haptics, Titan Haptics has unveiled a tiny board designed both for development and and for embedding into your design.

August 02, 2023 by Jeff Child

ATT and GATT—How Bluetooth LE Devices Store Data

Learn how ATT and GATT protocols help Bluetooth LE devices store and manage data, making it easier for connected devices to work together seamlessly.

July 21, 2023 by Nthatisi Hlapisi

BOSCH BMP585 Barometric Pressure Sensor | New Product Brief

The Bosch BMP585 Barometric Pressure Sensor is an innovative and reliable solution for pressure sensing applications. Watch and learn all about their features, specs, applications, and more!

June 28, 2023 by Mouser Electronics

Securing BLE Connections—An Overview of the Security Protocol

Learn about Bluetooth LE's security features and tools, how to use them, and understand how they keep connections secure.

June 23, 2023 by Nthatisi Hlapisi

Exclusive—Titan Haptics Debuts Clustered Array to Serve Non-standard Designs

Launched here today, Titan’s clustered array motor approach enables engineers to combine multiple haptic motors into an array that meets their exact application needs.

June 20, 2023 by Jeff Child

Nordic’s Bluetooth SoC Shines in OxiWear Ear-worn Pulse Oximeter

OxiWear’s new pulse-oximeter solution highlights the potential use cases for Nordic’s nRF52840.

March 21, 2023 by Jake Hertz

Silicon Labs Spins Bluetooth SoC and MCU for Small Form-factor Designs

With a goal of serving the design needs of small form-factor embedded systems, Silicon Labs is rolling out families of MCUs and wireless SoCs in tiny packages.

March 17, 2023 by Jeff Child

NXP Rolls MCU, NFC, and Security Together Into a One-chip Solution

At Embedded World 2023, NXP unveils a chip that integrates a microcontroller, an NFC front end, and security into a single IC.

March 16, 2023 by Jeff Child

PMIC Space Heats up With Design Wins, Acquisitions, and More

Offering compact packaging, BLE functions, and more, today’s power management integrated circuits (PMICs) are meeting the technology needs of a variety of system designs.

February 25, 2023 by Abdulwaliy Oyekunle

SMD LED Considerations for Lighting and Indicator Applications

When developing lighting and indicator devices, surface mounted diode (SMD) LEDs offer a variety of benefits. Learn the options available—including multi-color SMD LEDs—and the advantages they provide.

February 16, 2023 by Mario Davila and Alan Sanchez, VCC

Vertical Transistor Prototype Shows Promise for Biomedical Wearables

With the ability to operate in both blood and water, the organic electrochemical transistor is proven useful for onsite signal processing.

January 24, 2023 by Jake Hertz

STMicro Unveils 6-axis IMU with Embedded Sensor Fusion and AI

Aimed at enabling low-power sensing applications such as AR/VR and wearables, ST's IMU serves up sensor fusion blocks and machine learning (ML) cores.

November 29, 2022 by Jake Hertz

MOSFET ICs Roll in Small Package Formats—a Roundup

Enabling use in size-constrained system designs, a crop of MOSFET ICs are available that leverage small IC package formats.

November 26, 2022 by Antonio Anzaldua Jr.

With its New RISC-V Processors, SiFive Bets on Compute Density

Aiming to usurp Arm processors in size-constrained, compute hungry designs like wearables, SiFive has expanded its RISC-V “Performance” line of processors.

November 01, 2022 by Jeff Child