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With Data Centers Ever Strained, a New Storage Processor Skyrockets Flash Performance

Pliops has announced its storage processor, which they claim increases flash performance by 10 times and improves cost and performance by 90%.

About 5 days ago by Jake Hertz

An Example of Securing In-Cabin AI using TEE on a Secure FPGA SoC

This article discusses trusted execution environments — already used in a variety of connected devices — by showing how using TEE and an FPGA SoC can work in vehicle in-cabin AI.

July 28, 2020 by Katherine Hsu, Hex-Five Security

Israeli Researchers Find a Way to Stabilize and Control Discrete Magnetic States

The research team says that their achievement could be used towards applications such as data storage, magnetic sensing, and neuromorphic computing.

July 23, 2020 by Luke James

Researchers Develop Graphene Ribbons That Behave Like Semiconductors

A team of researchers has produced what they call the first porous graphene ribbons with properties that make them attractive for electronics applications.

July 19, 2020 by Luke James

AI Chip Strikes Down the von Neumann Bottleneck With In-Memory Neural Net Processing

The von Neumann Architecture, which has been a staple in computer architecture, may soon find itself less useful in the world of artificial intelligence.

July 10, 2020 by Jake Hertz

From Autonomous Cars to Autonomous Satellites, a NN Accelerator Chip Fits Both

What happens when you bring AI initially geared for autonomous vehicles to space?

July 09, 2020 by Jake Hertz

FPGA Roundup: New Contenders Hone in on Memory, Size, Power, and Even AI

Three newly-released FPGAs can tell us a lot about the direction of these devices in the industry.

July 02, 2020 by Steve Arar

Achieving Magnetic Tunnel Junctions With Record High Speeds for MRAM Peak Efficiency

A group of researchers at Japan’s Tohoku University have announced the development of a magnetic tunnel junction with some of the highest speeds seen yet.

June 28, 2020 by Luke James

Quasiparticles Found to Have a Critical Role in Future Applications for Quantum Computing and Memory Storage

Discerning the properties of tiny quasiparticles is a significant step toward developing new types of electronic components.

June 23, 2020 by Gary Elinoff

Qualcomm Puts AI and 5G in the Hands of Robotics Designers

Surging 15 trillion operations per second, Qualcomm’s RB5 platform is bringing AI and deep learning workloads to the edge of robotics.

June 23, 2020 by Nicholas St. John

IC Designers Now Have a Platform to Design Chips in the Cloud

Samsung Electronics, in collaboration with Rescale, has just announced the launch of the Samsung Advanced Foundry Ecosystem (SAFE) Cloud Design Platform (CDP).

June 22, 2020 by Jake Hertz

Intel’s AI Portfolio Shows How Designs Must Gear Up for Real-Time Processing

With processing demands on data centers higher than ever before, designers should be aware of how hardware- (and software-) based AI may have increasing prominence in their designs.

June 22, 2020 by Adrian Gibbons

Microsoft Sends a Data Center to the Ocean Floor to Find a COVID-19 Vaccine

Why underwater? The reason is actually quite practical: cooling.

June 18, 2020 by Gary Elinoff

AI Sensor System Demonstrates New Methods of Collecting Data

A new AI-enabled sensor system for measuring staff comfort levels and workplace concentration could help employers make the most out of flexible, open-plan office spaces and “hot desking”.

June 13, 2020 by Luke James

On-Device People and Object Detection Is on the Rise—But at the Cost of Power

Renesas poses a solution: a low power-consuming image signal processor and a vision-optimized AI accelerator for AI recognition accuracy.

June 10, 2020 by Gary Elinoff

Has the Modern Data Center Outstripped I2C and SMBus? I3C May Be the Answer

An upgrade in serial communication interfaces may be in order. Renesas is stepping up to support the transition.

June 05, 2020 by Gary Elinoff

Researchers Enhance Natural Movement in Robotics Using AI

Those using robotic prosthetics could soon move more naturally following the development and integration of AI-backed technologies by U.S. researchers.

June 04, 2020 by Luke James

Advantech Edge AI Acceleration Module | New Product Brief

This New Product Brief (NPB) is part of a video series highlighting the features, applications, and technical specs of newly-released products.

May 23, 2020 by Mouser Electronics

Developing New Hardware That Meets the Energy Demands of AI Applications

Artificial intelligence is becoming more commonplace in electronic devices, but many of its applications require lots of energy.

May 14, 2020 by Luke James

‘Superfast’ New Ceramic Manufacturing Method Could Lead to AI-Driven Materials Design

Scientists at the University of Maryland are said to have reinvented a 26,000-year-old manufacturing process into an innovative approach to fabricating ceramic materials for applications that include AI-driven materials design.

May 07, 2020 by Luke James