Intel has unveiled new glass substrate technology for large chiplet based system-in-package chips. Glass substrates allow for denser packing of chiplets—an important for applications like AI and others.
2 days ago by Duane Benson
Stelios Diamantidis, a Distinguished Architect at Synopsys, is leading efforts to apply artificial intelligence to integrated circuit design and optimization of the next generation of CPUs, GPUs, and memories.
April 04, 2023 by Daniel Bogdanoff