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STMicro Unveils 6-axis IMU with Embedded Sensor Fusion and AI

Aimed at enabling low-power sensing applications such as AR/VR and wearables, ST's IMU serves up sensor fusion blocks and machine learning (ML) cores.

About 2 days ago by Jake Hertz

MOSFET ICs Roll in Small Package Formats—a Roundup

Enabling use in size-constrained system designs, a crop of MOSFET ICs are available that leverage small IC package formats.

About 5 days ago by Antonio Anzaldua Jr.

Archer Materials Takes a Different Approach to Quantum and Biotechnology

Archer Materials is tackling some of the most complex chips in the industry, from quantum processors to graphene-based labs-on-a-chip.

November 19, 2022 by Abdulwaliy Oyekunle

Qualcomm Sets to Redefine Smartphones With Snapdragon 8 Gen 2

Qualcomm's Snapdragon 8 Gen 2 platform hopes to enable unprecedented performance in flagship smartphones, leveraging technology called "Snapdragon Smart" and "Snapdragon Sight."

November 18, 2022 by Jake Hertz

Samsung’s 8th-gen Vertical NAND (V-NAND) Enters Mass Production

The new generation of V-NAND marks a major memory milestone for the industry, with Samsung claiming highest bit-density.

November 10, 2022 by Jake Hertz

Startup Knocks Down Chiplet Hurdles with High-performance Link

Eliyan is emerging from stealth mode, unveiling the successful tapeout of its high-performance UCIe-compliant die-to-die interconnect technology in 5 nm process.

November 08, 2022 by Jake Hertz

Qualcomm and Vodafone Team for Next-gen 5G O-RAN Effort

The two companies will continue to collaborate on efforts to expand 5G Open Radio Access Network (RAN) across Europe.

November 04, 2022 by Chantelle Dubois

Micron Ships its Advanced DRAM 1-beta Node, Targeting Mobile

Claiming it as the industry’s most advanced DRAM technology, Micron Technology has released its advanced 1-beta DRAM node.

November 02, 2022 by Jake Hertz

With its New RISC-V Processors, SiFive Bets on Compute Density

Aiming to usurp Arm processors in size-constrained, compute hungry designs like wearables, SiFive has expanded its RISC-V “Performance” line of processors.

November 01, 2022 by Jeff Child

Beamformer Solutions Muscle Up for 5G mmWave Duties

With 5G mmWave system designs in full swing, a trio of companies are offering chip and system beamformer solutions geared toward a variety of 5G applications.

October 28, 2022 by Ikimi .O

Toshiba Gate Driver + MOSFET for 5-24V Line Power MUX | Featured Product Spotlight

This Featured Product Spotlight is part of a video series exploring the specifications, applications, and market context of new products.

October 25, 2022 by Mouser Electronics

Intel Supports New USB Spec with Next-gen Thunderbolt Connector

Aligned with the release of the USB4 2.0 spec, Intel’s early Thunderbolt prototype demo marks a milestone next-gen USB technology.

October 24, 2022 by Jake Hertz

MediaTek SoC Eyes Performance and Camera Improvements for 5G Phones

MediaTek’s new compute-intensive SoC is aimed at powering the next generation of mid-range Android 5G smartphones.

October 19, 2022 by Jake Hertz

“Eavesdropping” Side-channel Attack Can Spy Through Phone Vibrations

Using mmWave radar technology, Penn State researchers recently discovered how to tap into mobile vibrations to eavesdrop remotely.

October 14, 2022 by Jake Hertz

Shining an LED Light on Historical Engineer Nick Holonyak Jr.

Light-emitting diodes (LEDs) paved the way for the full-spectrum lights and lasers used in a variety of today’s devices, and we have inventor Nick Holonyak to thank.

October 05, 2022 by Biljana Ognenova

Advantech AIW-355 5G WWAN Module | New Product Brief

This New Product Brief (NPB) is part of a video series highlighting the features, applications, and technical specs of newly-released products.

September 29, 2022 by Mouser Electronics

Slew of Touch Controllers May Improve the Safety and Feel of Displays

Some people prefer the tactile experience of buttons over current touchscreens. Chipmakers are designing new touch controllers to change that.

September 24, 2022 by Kristijan Nelkovski

Investigate RF Power Amplifier Linearization Benefits in EDA

This application note is a collaborative work between Cadence and Rohde & Schwarz and focuses on performance enhancements through linearization of non-linear devices as early as possible in the design process. Using an RF power amplifier (PA) as the reference, we discuss benefits which can be achieved with linearization techniques such as digital predistortion (DPD).

In partnership with Rohde & Schwarz

Apple Snags Three New Patents for Virtual and Augmented Reality

Apple recently won three new patents for an AR/VR head-mounted display, a temperature gradient sensor, and a smart ring sensor.

September 16, 2022 by Darshil Patel

NXP Semiconductors EdgeLock® SE050 Plug & Trust Secure Element Family | New Product Brief

This New Product Brief (NPB) is part of a video series highlighting the features, applications, and technical specs of newly-released products.

September 15, 2022 by Mouser Electronics