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AI Craze Drives Wave of Semiconductor Deals Toward $1T Chip Era

AI Craze Drives Wave of Semiconductor Deals Toward $1T Chip Era

In this edition of Business Shorts, we spotlight five announcements that show AI demand is reshaping everything from Wall Street financing to washing machines.


News Aug 26, 2026 by Luke James
Espressif Unwraps Open-Source Device-to-Cloud-to-Phone IoT Platform

Espressif Unwraps Open-Source Device-to-Cloud-to-Phone IoT Platform

The rebuilt platform puts the previously closed cloud backend under an Apache 2.0 license and runs on AWS serverless services in a customer's own account.


News Aug 24, 2026 by Luke James
Ceva and Actions Show Off Strengths of Bluetooth HDT in New Audio Chips

Ceva and Actions Show Off Strengths of Bluetooth HDT in New Audio Chips

The ATS296X series from Actions Technology combines Ceva's High Data Throughput radio IP with Actions' own dual-RF design, targeting links of roughly 7.5 Mbps.


News Aug 17, 2026 by Luke James
Silicon Labs Unwraps Its ‘Lowest Power’ BLE SoC Targeting IoT Devices

Silicon Labs Unwraps Its ‘Lowest Power’ BLE SoC Targeting IoT Devices

The EFR32BG2B SoC family supports Bluetooth 6 and is the lowest power Bluetooth LE chip with channel sounding from Silicon Labs.


News Aug 14, 2026 by Duane Benson
Ambiq Rolls Out Two SoC Series Targeting Edge AI Applications

Ambiq Rolls Out Two SoC Series Targeting Edge AI Applications

The six new chips offer a wide range of connectivity and graphics options for wearables, hearables, AR devices, health monitors, industrial sensors, and beyond.


News Aug 12, 2026 by Duane Benson
Quectel Debuts Wi-Fi 7 Modules With Bluetooth 6.0 for Streaming and Gaming

Quectel Debuts Wi-Fi 7 Modules With Bluetooth 6.0 for Streaming and Gaming

The FCE870X and FME170X share the same high-end feature set across two package formats, giving product teams a choice between embedded and modular designs.


News Aug 10, 2026 by Dale Wilson
The New Era of Retail Begins at the Edge Leveraging On-Device AI

The New Era of Retail Begins at the Edge Leveraging On-Device AI

On-device AI enhances retail by enabling real-time processing for robotics, kiosks, and more, offering low latency, improved privacy, and operational efficiency for a better customer experience.


Infineon Serves up Security IC Supporting USB and NFC Connectivity

Infineon Serves up Security IC Supporting USB and NFC Connectivity

The new SECORA ID Key S USB security solution supports FIDO2 and PKI through hardware and near field interfaces.


News Jul 20, 2026 by Duane Benson
STMicro Debuts Single-Die Mobile Chip With Post-Quantum Cryptography

STMicro Debuts Single-Die Mobile Chip With Post-Quantum Cryptography

The ST54M places an NFC controller, secure element, and eSIM on one die and adds a hardware accelerator for NIST's post-quantum algorithms.


News Jul 14, 2026 by Luke James
OECD Is Putting Supply Chain, Value Chain, and Subsidies in the Spotlight

OECD Is Putting Supply Chain, Value Chain, and Subsidies in the Spotlight

The OECD is analyzing the semiconductor industry, focusing on supply chain resilience, global value chain mapping, and the impact of rising industrial subsidies on global market competition.


News Jul 09, 2026 by Gordon Feller
MIT Chip Builds Real-Time 3D Maps for Robots on the Power of One LED

MIT Chip Builds Real-Time 3D Maps for Robots on the Power of One LED

Called Gleanmer, the 16-nm system-on-chip swaps memory-hungry voxels for compact Gaussian “blobs” to map and navigate at roughly 6 mW.


News Jul 07, 2026 by Luke James
AMD Unveils Adaptive SoC With 32 GB of Memory-on-Package Embedded DRAM

AMD Unveils Adaptive SoC With 32 GB of Memory-on-Package Embedded DRAM

Announced today, the new AMD Versal Premium Gen 2 MoP SoCs boost performance by integrating memory on-package. It cuts board space by 60% while gaining 288 GB/s bandwidth and 15-year lifecycle.


News Jun 30, 2026 by Jeff Child
Exclusive—Synopsys Debuts ESUN IP for Breaking AI ‘Slowest Packet’ Bottleneck

Exclusive—Synopsys Debuts ESUN IP for Breaking AI ‘Slowest Packet’ Bottleneck

Launched today, Synopsys’ ESUN IP solution slashes AI tail latency and eliminates networking bottlenecks to enable seamless, scalable performance for modern AI infrastructure.


News Jun 30, 2026 by Jeff Child
Indie Launches Edge AI SoC for Perception Systems in Autos and Robots

Indie Launches Edge AI SoC for Perception Systems in Autos and Robots

The new system-on-chip pairs a heterogeneous AI compute engine with a low-latency multi-camera image signal processor, and can ship pre-integrated with emotion3D perception software.


News Jun 29, 2026 by Luke James
ST Unveils 2.3K-Zone dToF 3D Lidar Module for Resource-Limited Edge AI

ST Unveils 2.3K-Zone dToF 3D Lidar Module for Resource-Limited Edge AI

Announced today, the all-in-one VL53L9CX combines stacked BSI SPAD technology, metasurface optics, and on-chip processing to deliver dense spatial awareness directly to small microcontrollers.


News Jun 22, 2026 by Jeff Child
Thread Group and Broadband Forum Unite for End-to-End IoT Interoperability

Thread Group and Broadband Forum Unite for End-to-End IoT Interoperability

Thread Group and Broadband Forum are partnering to unify IoT mesh with broadband infrastructure. Also, the new Thread Tools app launches to provide real-world network diagnostics for engineers.


News Jun 17, 2026 by Jeff Child
TI Intros 26-Cell Battery Monitor IC With Integrated Smart EIS Engine

TI Intros 26-Cell Battery Monitor IC With Integrated Smart EIS Engine

Unveiled this week at PCIM, TI’s new automotive-grade battery monitor IC increases channel density by 44% and embeds real-time EIS to detect internal cell faults and mitigate thermal runaway.


News Jun 12, 2026 by Jeff Child
Qualcomm Unwraps Products Bringing AI to Entry–Level Laptops and Robotics

Qualcomm Unwraps Products Bringing AI to Entry–Level Laptops and Robotics

At Computex 2026, the company is expanding its Edge AI ecosystem by introducing the Snapdragon C Platform for entry-level laptops, and the Dragonwing IQ10 Reference Design for robotics.


News Jun 01, 2026 by Jeff Child
Broadcom Unveils Integrated Wi-Fi 8- and 50G PON Gateway-ICs for the AI Era

Broadcom Unveils Integrated Wi-Fi 8- and 50G PON Gateway-ICs for the AI Era

Broadcom’s high-integration Wi-Fi 8 & NPU-accelerated 50G PON gateway SoCs aim to build a cohesive, 50 Gbps broadband access ecosystem for the AI-infused home.


News May 27, 2026 by Jeff Child
Edge AI Development Is a Lifecycle Problem

Edge AI Development Is a Lifecycle Problem

Edge AI success is limited by memory and power. Fragmented tools cause failures. Learn how a cohesive, full-lifecycle approach unifying design and deployment is essential for scalable systems.