Leveraging board-level cameras offer a variety of benefits. To help identify the right mix of features and design elements, here are some factors to consider when selecting and designing in an embedded machine vision camera.
February 11, 2021 by Brian Cha, FLIR
Market analysts have reported that TSMC is to begin making Intel’s Core i3 chips on a 5nm process later this year, marking the latest in a series of struggles for Intel with its leading-edge process technology at both 10nm and 7nm.
January 30, 2021 by Luke James
Machine learning had a powerful impact on 2020 when it came to processing the mass amounts of COVID-19 data. To progress ML in 2021, developers are doubling down on features like on-device AI, low-power architecture, and framework compatibility.
January 28, 2021 by Maya Jeyendran
Learn about the widely used methods for filtering and processing data samples in the time domain while taking a closer look at the Dual Biquad IIR engine of the PowerQuad unit in the LPC55S69 MCU.
December 03, 2020 by Eli Hughes, NXP Semiconductors
This article explores the IEC 60730 Class B standard for functional safety to address both mechanical and electrical design in appliances. Learn what the standard entails and controllers to help meet these standards.
December 01, 2020 by Chad Solomon, Microchip Technology