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Qualcomm Unwraps Products Bringing AI to Entry–Level Laptops and Robotics

Qualcomm Unwraps Products Bringing AI to Entry–Level Laptops and Robotics

At Computex 2026, the company is expanding its Edge AI ecosystem by introducing the Snapdragon C Platform for entry-level laptops, and the Dragonwing IQ10 Reference Design for robotics.


News Jun 01, 2026 by Jeff Child
Broadcom Unveils Integrated Wi-Fi 8- and 50G PON Gateway-ICs for the AI Era

Broadcom Unveils Integrated Wi-Fi 8- and 50G PON Gateway-ICs for the AI Era

Broadcom’s high-integration Wi-Fi 8 & NPU-accelerated 50G PON gateway SoCs aim to build a cohesive, 50 Gbps broadband access ecosystem for the AI-infused home.


News May 27, 2026 by Jeff Child
Edge AI Development Is a Lifecycle Problem

Edge AI Development Is a Lifecycle Problem

Edge AI success is limited by memory and power. Fragmented tools cause failures. Learn how a cohesive, full-lifecycle approach unifying design and deployment is essential for scalable systems.


Broadcom Targets Mass-Market Broadband With 10G PON and Wi-Fi 8 SoCs

Broadcom Targets Mass-Market Broadband With 10G PON and Wi-Fi 8 SoCs

Three new chips pair a cost-optimized fiber gateway processor with single-die dual-band Wi-Fi 8 radios, aiming to bring the latest wireless standard to price-sensitive service provider markets.


News May 12, 2026 by Luke James
Europe’s Chip Ambitions: Why the EU’s Semi Strategy May Fall Short

Europe’s Chip Ambitions: Why the EU’s Semi Strategy May Fall Short

An audit finds that the European Chips Act is "very unlikely" to hit the 20% global market target by 2030, citing fragmented funding, slow progress on FOAKs, and fierce international competition.


News May 12, 2026 by Gordon Feller
How SoC Integration Impacts SMT Assembly Yield

How SoC Integration Impacts SMT Assembly Yield

Learn how SoC integration impacts SMT assembly yield, from fine-pitch BGA challenges and package warpage to reflow profiling and inspection strategies.


Intel and US Semi Fabrication Gets Huge Boost on Rumors from SpaceX, Apple

Intel and US Semi Fabrication Gets Huge Boost on Rumors from SpaceX, Apple

SpaceX’s proposed Terafab and Apple's preliminary discussions indicate escalating pressure to expand domestic semiconductor production.


News May 11, 2026 by Jake Hertz
How Neuromorphic Chips are Revolutionizing the Edge

How Neuromorphic Chips are Revolutionizing the Edge

Neuromorphic Edge AI chips mark a fundamental departure from traditional silicon, utilizing brain-inspired, event-driven architectures to enable real-time inference within milliwatt-level power budgets.


Rebellions: The Korean Company to Watch in 2026?

Rebellions: The Korean Company to Watch in 2026?

Learn how Korean AI technology company Rebellions uses proprietary dataflow NPUs, chiplets, and HBM to deliver high-efficiency, scalable AI inference for modern data centers.


News Apr 27, 2026 by Gordon Feller
SoC Evaluation Boards Evolve to Meet New Design Complexities

SoC Evaluation Boards Evolve to Meet New Design Complexities

Modern SoC Evaluation Boards demand high-performance design, SI/PI, and system validation. Faraday offers 3 flexible service levels to meet these complexities.


Espressif Bundles Wi-Fi 6, Bluetooth 5.4, and HMI Into RISC-V SoC

Espressif Bundles Wi-Fi 6, Bluetooth 5.4, and HMI Into RISC-V SoC

The new ESP32-S31 combines high-performance dual-core processing with multi-protocol wireless support.


News Apr 20, 2026 by Jake Hertz
Mesh AI: Node-Level Intelligence with Non-Cellular 5G/6G Connectivity

Mesh AI: Node-Level Intelligence with Non-Cellular 5G/6G Connectivity

Learn how LM Semi's Mesh AI platform delivers autonomous, secure, node-level intelligence via non-cellular NR+ mesh networks, addressing AI scalability for billions of devices.


News Apr 17, 2026 by Gordon Feller
Design Wins Roundup: From Real-Time Medical Imaging to Artemis II

Design Wins Roundup: From Real-Time Medical Imaging to Artemis II

Integration and efficiency are reshaping modern system design, from rad-hard ICs in NASA’s Artemis II mission to SoCs turning ID badges into wireless systems.


News Apr 15, 2026 by Joshua Tidwell
Altera Agilex™ 5 FPGAs & SoCs | Digital Datasheet

Altera Agilex™ 5 FPGAs & SoCs | Digital Datasheet

Altera Agilex™ 5 FPGAs and SoCs deliver a powerful balance of high performance, low power, and compact design for modern embedded and edge computing applications. Watch and learn all about their features, specs, applications, and more!


Nordic Rains IoT Products at Embedded World and MWC 2026

Nordic Rains IoT Products at Embedded World and MWC 2026

At the shows, Nordic debuted new cellular platforms, entry-level Bluetooth LE SoCs, and an edge-AI-enabled wireless chip.


News Mar 27, 2026 by Joshua Tidwell
STMicro Launches UWB IC Family Aimed at Next-Gen Ranging and Sensing

STMicro Launches UWB IC Family Aimed at Next-Gen Ranging and Sensing

Announced at Embedded World, the new IEEE 802.15.4ab-compliant SoC extends wireless ranging to hundreds of meters.


News Mar 23, 2026 by Jake Hertz
MediaTek Expands Genio SoC Line to Target AI to IoT, Robotics, and More

MediaTek Expands Genio SoC Line to Target AI to IoT, Robotics, and More

Announced at Embedded World, the new Genio lineup spans value to flagship tiers, with on-device GenAI acceleration ranging from 6 TOPS to over 50 TOPS.


News Mar 16, 2026 by Luke James
Synaptics Redefines Edge IoT with ‘First AI-Native Wi-Fi 7 Connectivity Solution for IoT’

Synaptics Redefines Edge IoT with ‘First AI-Native Wi-Fi 7 Connectivity Solution for IoT’

Announced today at Embedded World, Synaptics claims the SYN765x as the first industry's first AI Native Wi-Fi 7 solution developed specifically for the IoT. It provides Wi-Fi 7, Bluetooth 6.0, and 802.15.4 connectivity and features a Cortex-M52 and Ethos-U55 NPU.


News Mar 10, 2026 by Jake Hertz
Breaking Down 50 Million Pins: A Smarter Way to Design 3D IC Packages

Breaking Down 50 Million Pins: A Smarter Way to Design 3D IC Packages

The shift to 3D ICs and chiplets demands automated, hierarchical design planning to manage exploding pin counts. Learn how Siemens EDA's Innovator3D IC addresses these challenges.


Renesas Looks to the Future of Automotive With New Memory and SoC Tech

Renesas Looks to the Future of Automotive With New Memory and SoC Tech

The company attended ISSCC with some big automotive announcements: a new approach to chiplet-based processing and a configurable 3-nm memory architecture.


News Feb 24, 2026 by Jake Hertz