At Computex 2026, the company is expanding its Edge AI ecosystem by introducing the Snapdragon C Platform for entry-level laptops, and the Dragonwing IQ10…
At Computex 2026, the company is expanding its Edge AI ecosystem by introducing the Snapdragon C Platform for entry-level laptops, and the Dragonwing IQ10 Reference Design for robotics.
Broadcom’s high-integration Wi-Fi 8 & NPU-accelerated 50G PON gateway SoCs aim to build a cohesive, 50 Gbps broadband…
Broadcom’s high-integration Wi-Fi 8 & NPU-accelerated 50G PON gateway SoCs aim to build a cohesive, 50 Gbps broadband access ecosystem for the AI-infused home.
Edge AI success is limited by memory and power. Fragmented tools cause failures. Learn how a cohesive, full-lifecycle…
Edge AI success is limited by memory and power. Fragmented tools cause failures. Learn how a cohesive, full-lifecycle approach unifying design and deployment is essential for scalable systems.
Three new chips pair a cost-optimized fiber gateway processor with single-die dual-band Wi-Fi 8 radios, aiming to bring…
Three new chips pair a cost-optimized fiber gateway processor with single-die dual-band Wi-Fi 8 radios, aiming to bring the latest wireless standard to price-sensitive service provider markets.
An audit finds that the European Chips Act is "very unlikely" to hit the 20% global market target by 2030, citing…
An audit finds that the European Chips Act is "very unlikely" to hit the 20% global market target by 2030, citing fragmented funding, slow progress on FOAKs, and fierce international competition.
Learn how SoC integration impacts SMT assembly yield, from fine-pitch BGA challenges and package warpage to reflow…
Learn how SoC integration impacts SMT assembly yield, from fine-pitch BGA challenges and package warpage to reflow profiling and inspection strategies.
SpaceX’s proposed Terafab and Apple's preliminary discussions indicate escalating pressure to expand domestic…
SpaceX’s proposed Terafab and Apple's preliminary discussions indicate escalating pressure to expand domestic semiconductor production.
Neuromorphic Edge AI chips mark a fundamental departure from traditional silicon, utilizing brain-inspired, event-driven…
Neuromorphic Edge AI chips mark a fundamental departure from traditional silicon, utilizing brain-inspired, event-driven architectures to enable real-time inference within milliwatt-level power budgets.
Learn how Korean AI technology company Rebellions uses proprietary dataflow NPUs, chiplets, and HBM to deliver…
Learn how Korean AI technology company Rebellions uses proprietary dataflow NPUs, chiplets, and HBM to deliver high-efficiency, scalable AI inference for modern data centers.
Modern SoC Evaluation Boards demand high-performance design, SI/PI, and system validation. Faraday offers 3 flexible…
Modern SoC Evaluation Boards demand high-performance design, SI/PI, and system validation. Faraday offers 3 flexible service levels to meet these complexities.
The new ESP32-S31 combines high-performance dual-core processing with multi-protocol wireless support.
The new ESP32-S31 combines high-performance dual-core processing with multi-protocol wireless support.
Learn how LM Semi's Mesh AI platform delivers autonomous, secure, node-level intelligence via non-cellular NR+ mesh…
Learn how LM Semi's Mesh AI platform delivers autonomous, secure, node-level intelligence via non-cellular NR+ mesh networks, addressing AI scalability for billions of devices.
Integration and efficiency are reshaping modern system design, from rad-hard ICs in NASA’s Artemis II mission to SoCs…
Integration and efficiency are reshaping modern system design, from rad-hard ICs in NASA’s Artemis II mission to SoCs turning ID badges into wireless systems.
Altera Agilex™ 5 FPGAs and SoCs deliver a powerful balance of high performance, low power, and compact design for…
Altera Agilex™ 5 FPGAs and SoCs deliver a powerful balance of high performance, low power, and compact design for modern embedded and edge computing applications. Watch and learn all about their features, specs, applications, and more!
At the shows, Nordic debuted new cellular platforms, entry-level Bluetooth LE SoCs, and an edge-AI-enabled wireless chip.
At the shows, Nordic debuted new cellular platforms, entry-level Bluetooth LE SoCs, and an edge-AI-enabled wireless chip.
Announced at Embedded World, the new IEEE 802.15.4ab-compliant SoC extends wireless ranging to hundreds of meters.
Announced at Embedded World, the new IEEE 802.15.4ab-compliant SoC extends wireless ranging to hundreds of meters.
Announced at Embedded World, the new Genio lineup spans value to flagship tiers, with on-device GenAI acceleration…
Announced at Embedded World, the new Genio lineup spans value to flagship tiers, with on-device GenAI acceleration ranging from 6 TOPS to over 50 TOPS.
Announced today at Embedded World, Synaptics claims the SYN765x as the first industry's first AI Native Wi-Fi 7 solution…
Announced today at Embedded World, Synaptics claims the SYN765x as the first industry's first AI Native Wi-Fi 7 solution developed specifically for the IoT. It provides Wi-Fi 7, Bluetooth 6.0, and 802.15.4 connectivity and features a Cortex-M52 and Ethos-U55 NPU.
The shift to 3D ICs and chiplets demands automated, hierarchical design planning to manage exploding pin counts. Learn…
The shift to 3D ICs and chiplets demands automated, hierarchical design planning to manage exploding pin counts. Learn how Siemens EDA's Innovator3D IC addresses these challenges.
The company attended ISSCC with some big automotive announcements: a new approach to chiplet-based processing and a…
The company attended ISSCC with some big automotive announcements: a new approach to chiplet-based processing and a configurable 3-nm memory architecture.