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Flexible Processors? Arm and PragmatIC Push Flexible Electronics Up A Level

Flexible electronics have been a dream for many researchers; however, could the creation of a flexible processor be the key to pushing this technology to the next level?

4 days ago by Jake Hertz

Renesas Kicks-up CPU Speeds with SoCs for Entry/Mid-range Automotive Systems

The demand for cost-advantaged advanced cockpit technology for mid-range and entry-level automobiles is on the rise, which prompts Renesas to release a new R-Car series: the Gen3e.

5 days ago by Adrian Gibbons

Higher Memory, Compute, and Security: Xilinx’s Versal HBM Platform Speeds Past DDR5

Fast on the heels of the AI Edge series, Xilinx releases the Versal HBM Advanced Compute Acceleration Platform (ACAP), claiming 800% more memory bandwidth at 63% lower power over DDR5.

July 14, 2021 by Adrian Gibbons

From Safety to Design Simplification: IoT Design Takes Another Leap Forward

Recently IoT has been at the forefront of everyone's mind, especially for Renesas, Silicon Labs, and Nordic Semiconductor. What IoT innovations have they come up with lately?

July 09, 2021 by Jake Hertz

Optimizing Power Management with NXP’s i.MX RT500 Crossover MCU

This article provides an introduction to microcontroller power management concepts. The NXP i.MX RT500 family of crossover MCUs will be used to provide examples of how these power management concepts can be employed by embedded developers in their applications.

July 08, 2021 by Alejandra Guzman, NXP Semiconductors

Marvell’s OCTEON 10: The First DPU To Use Neoverse N2 ARMv9 Architecture

Marvell’s newest 5 nm data processing unit (DPU), the OCTEON 10, offers 3x improvement over the previous generation along with the newest ARMv9 Core.

July 07, 2021 by Adrian Gibbons

u-blox’s New Kits Help Designers Explore Bluetooth Direction Finding

Two new hardware kits from u-blox use Bluetooth Direction Finding APIs for indoor positioning applications. Are they using angle-of-arrival or angle-of-departure for direction finding?

July 01, 2021 by Adrian Gibbons

From Schottky Diodes to MOSFETS: 3 Team-ups Lower Power with SiC Technology

The world of SiC technology is about to boom with three different team-ups, from research to large tech companies. Who is teaming up, how are they advancing with SiC, and why?

June 26, 2021 by Ikimi .O

A RISC-V Future? SiFive and Andes Aim to Shake Up the Processor Industry

RISC-V, the open-source instruction set architecture, is making inroads against industry giants, with the support of the RISC-V Foundation.

June 25, 2021 by Adrian Gibbons

Understanding DSP Enablement Using NXP’s i.MX RT500 Crossover MCU

Learn about multi-threaded programs, developing applications using the XOS real-time operating system, resource sharing with semaphores, and how NXP's i.MX RT500 family of microcontrollers help engineers design DSP-enabled smart devices.

June 24, 2021 by Jason Tseng, NXP Semiconductors

Xilinx’s Versal AI Edge Blends the Border Between Programming and EEs

Wrapping up a two-part series on the new Versal AI Edge series ACAP from Xilinx, AAC talks about the intersection of engineering disciplines and ACAP applications.

June 15, 2021 by Adrian Gibbons

RF-based Wireless Charging from 2 Meters? New Team-up Combines RF Energy Harvesting and RF WPT

Could we be charging our devices from two meters away? Atmosic and Energous Corporation claim we can—and that the key is RF.

June 09, 2021 by Kate Smith

Xilinx Opens a New Door to Edge AI with Newest Adaptable Compute Platform

Recently, AAC had the chance to talk to Xilinx about its newest family member in the Versal series of adaptive compute acceleration platforms, the Versal AI Edge series.

June 09, 2021 by Adrian Gibbons

Roundup: Tracking Technology is Paving the Way to New Places

A trend that is gaining momentum is asset tracking. From smart fabrics to the ‘island of lost keys,’ the IoT-based asset tracking technologies pave the way for new commercial markets. 

June 07, 2021 by Adrian Gibbons

“Smart” Power Lines? ST’s SoC and RF Chipset Get Industry-first Certification

The G3-PLC hybrid standard ensures interoperability and is key to STMicroelectronics delivering competitive market solutions for power line communications.

June 03, 2021 by Adrian Gibbons

Simplifying IoT: Nordic Launches Its “First” PMIC for nRF SoCs

Nordic Semiconductor has taken its next step towards being a one-stop solution to IoT design by introducing its first PMIC, the nPM1100.

June 01, 2021 by Adrian Gibbons

Arm’s Total Compute: Dive Deeper Into Its New CPU Offerings

Recently, Arm released its Total Compute solutions which included three new CPU offerings. Here is a deeper look into what each one is offering.

May 28, 2021 by Jake Hertz

Arm’s Largest Release Yet: Total Compute Brings 3 CPUs and 4 GPUs to the Table

Arm's new suite for its Total Compute solutions platform includes three new CPUs and four new GPUs and promises improvements in performance, security, and developer access.

May 27, 2021 by Jake Hertz

Xilinx Aims to Speed Up System Design with Gen3 RF SoM

One method of accelerating system design is with a system-on-module (SoM). The newest XRF16-Gen3 Xilinx-based SoM from AVNET has improvements worth evaluating.

May 24, 2021 by Adrian Gibbons

NVIDIA Makes Waves in the Industry with ADLINK

ADLink has tapped into NVIDIA’s resources for two new products this month, sealing its impact in the electronics industry.

May 17, 2021 by Jake Hertz