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Altera Intros Upgrade of FPGA AI Suite Enabling Determinism for Physical AI

Altera Intros Upgrade of FPGA AI Suite Enabling Determinism for Physical AI

The new version of FPGA AI Suite is designed to accelerate trained AI models into FPGAs


News May 13, 2026 by Duane Benson
Microchip Unveils Plug-In Timing Module for AI-Burdened Data Centers

Microchip Unveils Plug-In Timing Module for AI-Burdened Data Centers

The new plug-in module is designed to meet the timing and synchronization requirements of distributed computing, AI data centers, and upcoming 5G networks.


News May 06, 2026 by Duane Benson
The Hidden Cooling Bottleneck Inside Liquid-Cooled AI Data Centers

The Hidden Cooling Bottleneck Inside Liquid-Cooled AI Data Centers

Learn how liquid cooling eliminates system airflow, creating a hidden thermal bottleneck for 'left-behind' components like memory and SSDs. Targeted micro-cooling is required to restore system balance.


Rebellions: The Korean Company to Watch in 2026?

Rebellions: The Korean Company to Watch in 2026?

Learn how Korean AI technology company Rebellions uses proprietary dataflow NPUs, chiplets, and HBM to deliver high-efficiency, scalable AI inference for modern data centers.


News Apr 27, 2026 by Gordon Feller
More Control, Less Chaos With Microchip’s New All-in-One DSCs

More Control, Less Chaos With Microchip’s New All-in-One DSCs

Microchip’s new digital signal controllers integrate high-resolution control, high-speed analog, and post-quantum cryptography.


News Apr 24, 2026 by Joshua Tidwell
Piezoelectric Chip Out of UCSD Rethinks DC-DC Conversion for GPUs

Piezoelectric Chip Out of UCSD Rethinks DC-DC Conversion for GPUs

A prototype converter achieves 96.2% peak efficiency, stepping 48 V down to 4.8 V, delivering four times the output current of previous piezoelectric designs.


News Apr 23, 2026 by Luke James
Infineon Reveals End-to-End Upgrades of Its Power and Sensing Portfolio

Infineon Reveals End-to-End Upgrades of Its Power and Sensing Portfolio

The company’s latest silicon, silicon carbide, and gallium nitride solutions offer a complete power conversion chain from the grid to the processor for AI data centers.


News Apr 16, 2026 by Jake Hertz
Indie Semiconductor Releases First Commercial UV DFB Laser at 399 nm

Indie Semiconductor Releases First Commercial UV DFB Laser at 399 nm

Geared for quantum systems, Indie engineered the narrow-linewidth laser engineered for ytterbium atom cooling, which eliminates the need for external optical stacks.


News Apr 14, 2026 by Luke James
For the Netherlands, Photonics Initiatives Secure Global Leadership—Part 2

For the Netherlands, Photonics Initiatives Secure Global Leadership—Part 2

Learn how The Netherlands is leveraging billion-euro investments and European partnerships to scale integrated photonics from research into a world-leading, industrially mature production ecosystem.


News Apr 10, 2026 by Gordon Feller
Navitas Skips 48 V Bus in 800 V-to-6 V GaN PDB for AI Racks

Navitas Skips 48 V Bus in 800 V-to-6 V GaN PDB for AI Racks

GaN-based power delivery board targets 96.5% efficiency and 2,100 W/in3 for NVIDIA's next-generation 800 VDC data center architecture.


News Apr 09, 2026 by Luke James
High-Speed Server and Data Center Connectivity with Stewart Connector QSFP-DD Solutions | Tech Guide

High-Speed Server and Data Center Connectivity with Stewart Connector QSFP-DD Solutions | Tech Guide

In this Tech Guide, learn how Stewart Connector QSFP-DD solutions enable 400G data center connectivity, covering signal integrity, thermal management, EMI control, and integration tips for high-speed servers, switches, and HPC systems. Watch now to get started!


Arm Releases First-Ever Silicon Product to Solve Agentic AI Challenges

Arm Releases First-Ever Silicon Product to Solve Agentic AI Challenges

In a landmark moment in its 35-year history, Arm has debuted its own silicon product, the AGI CPU, built on the Arm Neoverse platform.


News Apr 02, 2026 by Jake Hertz
5 Light-Based Technologies Reshaping Computing and Sensing

5 Light-Based Technologies Reshaping Computing and Sensing

Researchers push the boundaries of photonic devices, opening new frontiers in AR, structural monitoring, and quantum applications.


News Mar 31, 2026 by Luke James
ElastixAI Emerges From Stealth With FPGA Approach to Gen AI Supercomputing

ElastixAI Emerges From Stealth With FPGA Approach to Gen AI Supercomputing

In this exclusive interview, the Seattle startup says its software-ML-hardware co-design—announced today—converts off-the-shelf FPGA servers into high-efficiency AI inference engines.


News Feb 25, 2026 by Luke James
Microsoft Rolls Out Next Inference Accelerator to Boost AI in Azure

Microsoft Rolls Out Next Inference Accelerator to Boost AI in Azure

The company devised the new Maia 200 inference accelerator to improve cost and performance for AI inference processing in Azure Cloud Services.


News Feb 05, 2026 by Duane Benson
Breaking the Thermal Wall Using Monolithic Ceramic Cooling for Power Electronics

Breaking the Thermal Wall Using Monolithic Ceramic Cooling for Power Electronics

Learn how monolithic ceramic cooling using Selective Laser Reaction Sintering (SLRS) eliminates the "thermal wall" in high-density power electronics by creating single-piece, reliable heat exchangers.


IBM & Ansys Detail Results From DARPA Thermonat Thermal Modeling Program

IBM & Ansys Detail Results From DARPA Thermonat Thermal Modeling Program

The research program aims to improve heat-prediction accuracy at the nanoscale while reducing simulation time for advanced semiconductor design.


News Feb 04, 2026 by Luke James
Case Study: A Low-Cost, Low-Profile 6kW, 800 V to 12.5 V DC-DC for AI Power

Case Study: A Low-Cost, Low-Profile 6kW, 800 V to 12.5 V DC-DC for AI Power

Learn how GaN technology enables a low-cost, low-profile 6 kW, 800 VDC to 12.5 VDC converter using an ISOP LLC topology. This meets the design needs of next-gen, MW-scale AI server infrastructure.


CES Memory Roundup: Companies Tackle Bandwidth, Power, and Reliability

CES Memory Roundup: Companies Tackle Bandwidth, Power, and Reliability

Gen5 QLC client SSDs, enterprise LPDDR5X with RAIDDR ECC, and HBM4-era AI memory concepts anchor a week of announcements.


News Jan 21, 2026 by Luke James
Exclusive Interview: Weebit Nano, TI, and the Future of Resistive RAM

Exclusive Interview: Weebit Nano, TI, and the Future of Resistive RAM

Look out, flash! With a resounding vote of confidence from Texas Instruments and Onsemi, ReRAM may be here to stay.


News Jan 13, 2026 by Jake Hertz