Thomas S. Tarter, xMEMS

Tom is a distinguished expert in IC packaging and thermal management, currently serving as Principal MTS Thermal Engineer at xMEMS Labs in Santa Clara, California. With over 30 years of experience in heat transfer and semiconductor packaging, he has played a pivotal role in advancing package development, design, analysis, assembly, and manufacturing. His career includes 17 years at AMD as a Senior Member of the Technical Staff, followed by leadership roles as Director of BGA Package Engineering and Design at Advanced Interconnect Technology and Principal Engineer at NeoPhotonics Corporation. There, he specialized in thermal management, temperature control, and package development of silicon-based waveguides for communications. In 2008, Tom founded Package Science Services LLC, providing high-tech industries with expertise in electronic packaging design, analysis, and characterization. After a decade managing the business, he joined Exo Imaging as Principal Thermal Engineer, focusing on ultrasound medical equipment. In 2024, he began work on µCooling at xMEMS, further advancing innovations in thermal engineering. Tom has authored over 30 technical papers, holds multiple patents, and has delivered numerous lectures and short courses worldwide. A respected leader in the field, he is a past General Chair of SEMI-THERM and continues to serve on its executive committee. Additionally, he is a Senior Member of IEEE and a former Chair of the IEEE Santa Clara Valley Chapter of CPMT.