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Episode 28 | How DARPA Stops IC Hardware Hackers in Their Tracks: Insights from Serge Leef

There are millions of unsecured devices on the market today. Whose responsibility is it to design secure silicon, anyway?

August 24, 2021 by Daniel Bogdanoff

Scaling Down: Intel Boasts RibbonFET and PowerVia as Next IC Design Solution

As part of its recent roadmap, Intel teased RibbonFET and PowerVia, two new technologies that it hopes will change the IC industry through backside power delivery and a gate-all-around architecture.

July 30, 2021 by Jake Hertz

Physically Unclonable Functions: Classification, Evaluation, and Tradeoffs in PUFs

In this article, we’ll take a deeper look at how PUFs are classified, the attributes that make a “good” PUF, and design tradeoffs.

July 18, 2021 by Jake Hertz

New IEEE Standard Takes Aim at Easing Long-Reach SerDes Automotive Design

Direct physical interfaces between sensor and processor over long distances is a major challenge in automotive design. The IEEE 2977-2021 MIPI A-PHY specification might be the key to this challenge.

July 15, 2021 by Adrian Gibbons

A RISC-V Future? SiFive and Andes Aim to Shake Up the Processor Industry

RISC-V, the open-source instruction set architecture, is making inroads against industry giants, with the support of the RISC-V Foundation.

June 25, 2021 by Adrian Gibbons

Entering the Era of AI IC Design: Where Do EEs Fit In?

As AI automated design becomes more and more prevalent in IC design, what are the impacts on the everyday EE?

June 25, 2021 by Jake Hertz

An Introduction to Physically Unclonable Functions

In this article, we’ll discuss the PUF or physically unclonable function and how it boosts hardware security in ICs.

June 14, 2021 by Jake Hertz

From CMOS to Batteries: Past Space Tech Improved Earth Applications

Pushing technological limitations to extremes can cause benefits beyond its original scope. Looking back at past space technology, it is clear the effects they have had here on Earth.

May 19, 2021 by Tyler Charboneau

Samsung Shoots for High-performance Computing with 2.5D High-bandwidth Memory

Die stacking is becoming more commonplace with Samsung Electronics' next-generation 2.5D advanced package technology.

May 10, 2021 by Adrian Gibbons

IBM’s 2 nm Chip Dazzles with 50 Billion Transistors in Tiny Package

In an announcement clearly intended to draw in engineers and laymen alike, IBM heralds the arrival of tiny 2 nm chips with 50 billion transistors apiece and the heir apparent to the age of FinFETs.

May 06, 2021 by Kate Smith

Mega Chip Packs 2.6 Trillion Transistors on One Huge Piece of Silicon

Two years after releasing the "world's largest computer chip," AI computing startup Cerebras Systems is upping the transistor punch from 1.2 trillion to 2.6 trillion.

April 22, 2021 by Jake Hertz

An Introduction to Switched-capacitor Circuits

In this series of articles, we’ll discuss one of the fundamental building blocks of analog IC design: the switched-capacitor circuit.

April 21, 2021 by Jake Hertz

Cadence’s Recent Acquisitions Reveal Focus on Computational Fluid Dynamics

This year alone, Cadence has acquired both Pointwise and NUMECA, two companies specializing in multi-physics simulations and specifically computational fluid dynamics. How might this focus reflect Cadence's EDA strategy?

April 18, 2021 by Jake Hertz

x86, Arm, and the Reach for Computing Supremacy

Intel has released a new processor for data center applications. How does this new x86 processor look compared to other processor advancements?

April 16, 2021 by Rushi Patel

Why Physical Verification Is Only Getting Tougher With Advanced Nodes

In the nanometer era, IC complexity grows faster than die areas. EDA companies are stepping up with tools to streamline physical verification.

April 14, 2021 by Antonio Anzaldua Jr.

Tech Giants Enter Their Chips in the Race for Self-driving Cars

ADAS innovation happens at the chip level. Here are the big-name players honing in on autonomous SoCs to advance the possibility of self-driving cars.

April 08, 2021 by Luke James

New Fabs Crop Up Globally in 2021 as Chip Crisis Continues

GlobalFoundries, SK Hynix, and Intel have all announced plans to either break ground on new manufacturing plants or expand existing operations.

April 04, 2021 by Luke James

“The Space Race of Our Time:” EU Follows U.S. and China’s Dash for Domestic Chips

The European Commission has set an ambitious target: to double last year's production of computer chips in the European Union by 2030.

March 30, 2021 by Luke James

It’s All About the Timing: 5G Brings Timing Synchronization Burdens

Renesas has released three new ICs in its communication timing portfolio to help alleviate the burden of 5G timing constraints.

March 25, 2021 by Jake Hertz

Google Hires Intel CPU Expert, Doubles Down on SoCs as the “New Motherboard”

Intel veteran Uri Frank has been hired by Google as its new VP of engineering for server chip design. What does this mean for Google's custom silicon?

March 24, 2021 by Jake Hertz