Latest IC Design Articles and Videos

Categories

At ISSCC, IMEC Unveils Charge-pump PLL Design for Short Range Radars

At this week’s 70th annual ISSCC event, research firm IMEC is presenting a phase-locked loop (PLL) IC design aimed at automotive and industry radar systems.

February 20, 2023 by Jeff Child

Power ICs Debut as High-side and Low-side Smart Switch Solutions

A slew of high-side and low-side smart switch chips have emerged, offering interesting alternatives for a variety of automotive and industrial use cases.

February 10, 2023 by Jake Hertz

Fabless FPGA/eFPGA Players Ramp up Their Innovations—a Roundup

With products built on some of the most advanced semiconductor fab processes—like TSMC’s 7 nm node—fabless FPGA/eFPGA providers are rolling out new updated open-source tools, new devices, and new IP.

February 08, 2023 by Jeff Child

Rambus Spins 6.4 GT/s DDR5 Registering Clock Driver for Speedier Servers

The latest chip from Rambus raises the speed limit for DDR5, giving memory-hungry applications, such as data center servers, more room to run.

February 06, 2023 by Aaron Carman

Introduction to Double Date Rate (DDR) Memory

Learn about double date rate (DDR) memory key concepts and applications surrounding this digital communication technique, where two data words are transferred during one clock cycle.

February 03, 2023 by Robert Keim

Siemens Rolls Out IC Design Tool for Data-driven Verification

Seeking to leverage today’s data-rich engineering world, Siemens has released Questa Verification IQ, a software platform enabling data-driven IC verification.

February 03, 2023 by Jeff Child

IEEE RWW Keynotes: Future of RF Looks Rocky and That’s a Good Thing

At IEEE Radio and Wireless Week (RWW), keynote speakers highlighted the trends in RF and wireless technology, and how design engineers must adapt to meet the new challenges head on.

February 02, 2023 by Aaron Carman

Researchers Tap Origami as Basis for Reconfigurable Antenna Design

Aimed at improving sensing and imaging systems, Princeton University researchers have developed a reconfigurable antenna based on origami.

February 01, 2023 by Darshil Patel

IEEE Radio and Wireless Week Panel: Getting to D-Band is a Group Effort

At IEEE Radio and Wireless Week 2023, industry leaders in chip fabrication and measurement engaged in a panel discussion to give engineers their opinions on the future of D-band technology.

January 30, 2023 by Aaron Carman

Investigating Lossless Transmission Line Phase Constant and Infinite Bandwidth

Learn how to derive the wave equations for a lossless transmission line and look at its infinite bandwidth and phase constant.

January 27, 2023 by Dr. Steve Arar

Vertical Transistor Prototype Shows Promise for Biomedical Wearables

With the ability to operate in both blood and water, the organic electrochemical transistor is proven useful for onsite signal processing.

January 24, 2023 by Jake Hertz

Getting the Most Out of USB-C/PD System Designs

USB-C/PD brings significant improvements to the USB connectivity world. In this article, learn how this technology simplifies system designs and the solutions available to implement USB-C/PD.

January 24, 2023 by George Hariman, ROHM Semiconductor

Bluespec Teams Up with Synopsys for RISC-V Core Verification Effort

With their collaboration, the firms hope to enable faster and improved functional verification testing for Bluespec’s RISC-V cores.

January 24, 2023 by Jake Hertz

Exclusive—IBM Shares Details of Its 400+ Qubit Quantum Processor

All About Circuits spoke with IBM physicist and chief quantum hardware architect Oliver Dial to get exclusive details on IBM's 400+ qubit quantum processor: Osprey.

January 23, 2023 by Ingrid Fadelli

A Primer on Digital Pulse Amplitude Modulation

An encoding technique used for digital communication, pulse amplitude modulation (PAM) converts a discrete-time signal into a variable-amplitude continuous-time signal that is suitable for high-speed wired communication systems.

January 22, 2023 by Robert Keim

Texas Instruments Announces First Ultrasonic Lens Cleaning Chipset

Texas Instruments has developed two ultrasonic lens cleaning ICs to enable self-cleaning cameras and sensors.

January 19, 2023 by Jake Hertz

From Parallel to Serial and Back Again: Understanding SerDes

Serialization/deserialization circuitry, known collectively as SerDes, provides important benefits for digital communication systems, especially when high data rates are required.

January 15, 2023 by Robert Keim

Research Efforts Signal Next Steps for Quantum Processor Evolution

A trio of research papers offers new ideas that may solve some of the biggest hurdles to quantum processing technology.

January 14, 2023 by Kristijan Nelkovski

RF Design Basics—Introduction to Transmission Lines

Learn about voltage waves and how they relate to an important basic concept of radio frequency (RF) circuit design: transmission lines.

January 13, 2023 by Dr. Steve Arar

AMD Claims First x86 Processor with Dedicated AI Hardware

Aiming to enable efficient AI computing in the mobile space, AMD at CES rolled out its Ryzen AI engine, along with processors that embed the new AI engine.

January 05, 2023 by Jeff Child