This article discusses some concepts for ensuring motion detector designs will be robust to external disturbances by presenting an infrared detector assembly that can significantly reduce the parts count and improve product performance and reliability.
2 days ago by Ryan Sheahen, Littelfuse
Leveraging board-level cameras offer a variety of benefits. To help identify the right mix of features and design elements, here are some factors to consider when selecting and designing in an embedded machine vision camera.
February 11, 2021 by Brian Cha, FLIR
Learn about the benefits of time-sensitive networking (TSN) and how engineers use it to ensure that an industrial system is ready for the future. This article focuses on three members of the set of TSN standards.
January 19, 2021 by Jeff Steinheider, NXP Semiconductors
Learn about the widely used methods for filtering and processing data samples in the time domain while taking a closer look at the Dual Biquad IIR engine of the PowerQuad unit in the LPC55S69 MCU.
December 03, 2020 by Eli Hughes, NXP Semiconductors
This article explores the IEC 60730 Class B standard for functional safety to address both mechanical and electrical design in appliances. Learn what the standard entails and controllers to help meet these standards.
December 01, 2020 by Chad Solomon, Microchip Technology
NXP’s i.MX 8M Plus applications processor enables machine learning and intelligent vision for consumer applications and the industrial edge. Learn about the features of this processor and how it can be used in embedded vision systems.
October 22, 2020 by Jeff Steinheider, NXP Semiconductors
This article looks at digit detection and recognition using MNIST eIQ as an example, which consists of several parts — the digit recognition is performed by a TensorFlow Lite model, and a GUI is used to increase the usability of the i.MX RT1060 device.
September 22, 2020 by David Piskula, NXP Semiconductors
In this article, we discuss some key security threats to be aware of when designing for the IoT, important security functions, and how protecting these designs is becoming easier with advances in security ICs.
September 15, 2020 by Scott Jones, Maxim Integrated
In this article, learn how to enable I2C by allowing the LPC55S69 MCU on the E1 board to communicate with a Bosch BME280 environmental sensor present on the Microe Weather click module.
September 10, 2020 by Mark Dunnett, on Behalf of NXP
Intel Enpirion PowerSoC modules are DC-DC step-down converters that integrate nearly all the components needed to build a power supply without sacrificing performance or efficiency. These solutions are designed to meet strict FPGA, ASIC, and processor power requirements.
August 25, 2020 by Tamara Lin, Intel
The OKdo E1 development board is only as wide as a coin but contains the LPC55S69 microcontroller, making it suitable for a variety of small production runs and prototypes. Here, get more familiar with the dev board and see how to use its evaluation kit.
August 20, 2020 by Mark Dunnett, on Behalf of NXP
Explore the LPC55S16, an MCU well-suited for industrial and professional applications, thanks to its fast clock speed of 150 MHz, out-of-the-box support for communicating over a CAN-FD bus network, and low current consumption.
August 06, 2020 by Mark Dunnett, on Behalf of NXP