3GPP Release 16 holds the promise to make high precision location services cheaper and more reliable. Exploiting new signal properties in combination with a variety of non-cellular technologies could enable forms of hybrid positioning.
April 02, 2019 by Sylvia Lu, u-blox
This article looks at a solution to add additional USB charging ports to a vehicle using a single chip containing all the necessary parts and delivers 5V to the device.
July 10, 2018 by Nazzareno Rossetti, Maxim Integrated
Part 5 of this 12-part series continues to explore effective noise bandwidth as it relates to delta-sigma ADCs and system-level design by stepping through a simple example using a two-stage filter to understand how to calculate the ENBW and how system changes affect the ENBW.
May 22, 2018 by Bryan Lizon, Texas Instruments
Part 4 of this “Resolving the Signal” article series covers noise in delta-sigma ADCs focuses on understanding basic effective noise bandwidth (ENBW) topics.
April 11, 2018 by Bryan Lizon, Texas Instruments
Connected industrial machines can sense a wide array of information used to make key decisions within the Industrial Internet of Things (IIoT). A sensor within an edge node can be spatially far removed from any data aggregation point. It must connect through a gateway that links edge data with a network.
January 09, 2018 by Ian Beavers, Analog Devices
This article describes the state of the semiconductor technology that is enabling new developments with shorter gate length GaAs and GaN transistors, circuit design considerations to achieve optimum performance, and examples of both GaAs and GaN wideband power amplifiers (PAs) that demonstrate today’s technology.
November 14, 2017 by Keith Benson, Analog Devices
The next step of wide-area wireless connection is to bring the power of wireless to machine type communications (MTC). This will drive a revolution in services that will span sectors as diverse as manufacturing, city management, transportation, and energy.
October 17, 2017 by Emmanuel Gresset, CEVA
Digital power supplies are widely employed in high-end servers, storage, telecom brick modules, and more. For these applications, isolation is often required. This article discusses the digital isolation techniques with Analog Devices’ iCoupler products in digital power supply design.
August 01, 2017 by Jason Duan, Analog Devices
Development is well underway on Gigabit LTE cellular communications systems that promise an order of magnitude increase in data transfer rates and 5G is close behind. Small cell access nodes will form an essential part of both systems but new communications processors are needed to make these a reality.
June 08, 2017 by Emmanuel Gresset, CEVA
Passive intermodulation represents the intermodulation products generated when two or more signals transit through a passive device with nonlinear properties. The interaction of mechanical components generally causes nonlinear elements.
May 09, 2017 by Frank Kearney, Analog Devices
In this article, we discuss some key security threats to be aware of when designing for the IoT, important security functions, and how protecting these designs is becoming easier with advances in security ICs.
September 15, 2020 by Scott Jones, Maxim Integrated
In this article, learn how to enable I2C by allowing the LPC55S69 MCU on the E1 board to communicate with a Bosch BME280 environmental sensor present on the Microe Weather click module.
September 10, 2020 by Mark Dunnett, on Behalf of NXP
Floating-gate Flash circuitry is only embedded in devices fabricated at 40nm or earlier nodes, so it is not embedded in the most advanced, highest-performance processors. For secure code and data storage, designers, therefore, have to specify an external device that contains secure memory capacity.
In partnership with Winbond
What are your assumptions about the reliability, longevity, and performance of NAND? This article proposes that embedded developers should open their minds to the potential benefits of replacing SPI NOR Flash with serial NAND Flash for storing mission-critical boot and application code.
In partnership with Winbond
MCAD and ECAD have inserted themselves into most design engineers' day-to-day work. Although familiar, both programs have come a long way and are continuing to evolve. In this article, learn the past and future of these design tools.
August 27, 2020 by Sam Sattel, Autodesk
Intel Enpirion PowerSoC modules are DC-DC step-down converters that integrate nearly all the components needed to build a power supply without sacrificing performance or efficiency. These solutions are designed to meet strict FPGA, ASIC, and processor power requirements.
August 25, 2020 by Tamara Lin, Intel
The OKdo E1 development board is only as wide as a coin but contains the LPC55S69 microcontroller, making it suitable for a variety of small production runs and prototypes. Here, get more familiar with the dev board and see how to use its evaluation kit.
August 20, 2020 by Mark Dunnett, on Behalf of NXP
Autonomous drones and robots utilize small motors. These fast-spinning mini motors require miniature encoders and IC package sizes. This article shows how an optical sinusoidal encoder provides a higher resolution and increased speeds with a 2x3 mm dual simultaneous-sampling SAR-ADC.
August 11, 2020 by Bonnie Baker, Maxim Integrated
Explore the LPC55S16, an MCU well-suited for industrial and professional applications, thanks to its fast clock speed of 150 MHz, out-of-the-box support for communicating over a CAN-FD bus network, and low current consumption.
August 06, 2020 by Mark Dunnett, on Behalf of NXP
The FixturFab DEV260 development fixture allows designers to debug or configure PCBAs during the development phase. See how it works in this example using the Sparkfun Power Delivery Board.
August 04, 2020 by Duncan Lowder, FixturFab
As automotive moves from domain to zonal networks, many different kinds of data end up sharing the same wires. This article looks at IEEE 802.1’s Time-Sensitive Networking (TSN) standards as a solution.
July 21, 2020 by Don Pannell, NXP Semiconductors
Intermediate Bus Architecture is an emerging method that power designers are using to conserve PCB space. This article discusses the solution benefits and tradeoffs of adopting this technique, and how it may be scaled to address application-specific requirements.
July 07, 2020 by Tamara Lin, Intel
