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Design for the Future: How UALink Interconnects Empower Next-Gen AI Systems

Design for the Future: How UALink Interconnects Empower Next-Gen AI Systems

Learn how UALink offers an open, high-speed interconnect for AI accelerators, that enables scalable, low-latency, and energy-efficient AI systems for next-gen workloads.


Understanding How CXL 3.0 Links the Data Center Fabric

Understanding How CXL 3.0 Links the Data Center Fabric

The CXL data protocol is essential for meeting the interconnect needs of today’s data centers. Learn the key elements and benefits of this protocol, along with what’s new in CXL version 3.0.


Understanding ADAS Limitations and V2X Communication Technology

Understanding ADAS Limitations and V2X Communication Technology

In today's data-driven world, devices are constantly striving to connect with one another, especially in the automotive industry. How can vehicle-to-everything (V2V) communication change the world of vehicle communication?


High-Layer Count (HLC) PCB Technology for the 5G Era

High-Layer Count (HLC) PCB Technology for the 5G Era

One effective solution to the requirements of 5G technology is the use of HLC (High-layer Count) PCB boards that integrate key features such as skip vias, POVF manufacturing, advanced raw materials, and impedance control.


Design and Development of 5G Devices: 5G Performance Ranges

Design and Development of 5G Devices: 5G Performance Ranges

How can engineers choose the correct performance range for their 5G application?


How Will 5G Networks Improve Location Awareness?

How Will 5G Networks Improve Location Awareness?

3GPP Release 16 holds the promise to make high precision location services cheaper and more reliable. Exploiting new signal properties in combination with a variety of non-cellular technologies could enable forms of hybrid positioning.


Utilizing the Different Types of Common IoT Connection Methods

Utilizing the Different Types of Common IoT Connection Methods

This article explores the pros and cons of connectivity options for IoT edge device design.


Ultrawideband DPD: The Rewards and Challenges of Implementation in Cable Distribution Systems

Ultrawideband DPD: The Rewards and Challenges of Implementation in Cable Distribution Systems

This article looks at new technologies regarding the existing cable network, in particular, power amplifier digital predistortion.


Passive Intermodulation (PIM) Effects in Base Stations: Understanding the Challenges and Solutions

Passive Intermodulation (PIM) Effects in Base Stations: Understanding the Challenges and Solutions

Passive intermodulation represents the intermodulation products generated when two or more signals transit through a passive device with nonlinear properties. The interaction of mechanical components generally causes nonlinear elements.