Angstrom-scale ICs will require innovation across the entire semiconductor ecosystem: This will include advances in both the hardware (transistors, power distribution, and connection of multi-die systems) and tools (EDA tools with AI/ML and silicon life-cycle management).
August 31, 2023 by Rob Aitken, Synopsys
The way your PCB’s layers are arranged has huge implications for the board’s efficiency. Learn the basics of PCB stackups, and how Fusion 360’s stackup tool helps manage your PCB’s layering strategy.
March 09, 2023 by Edwin Robledo, Fusion 360 Electronics
Computer-aided manufacturing (CAM) is a critical part of modern electronics production. It’s helpful to understand the process and how advanced CAM processing tools enable a smooth transition to the production phase.
January 26, 2023 by Edwin Robledo, Fusion 360 Electronics
There are several effective ways to manage the high temperatures of today’s discrete semiconductors in your design. Simulation techniques are vital for measuring how well each approach is working.
December 08, 2022 by Toshiaki Hosoya, Toshiba
Designing PCBs and enclosures in parallel is the best way to ensure high-quality system designs. Learn how to use Fusion 360 to marry the 2D domain of PCB design with the 3D domain of mechanical enclosure design.
November 03, 2022 by Edwin Robledo, Fusion 360 Electronics
One effective solution to the requirements of 5G technology is the use of HLC (High-layer Count) PCB boards that integrate key features such as skip vias, POVF manufacturing, advanced raw materials, and impedance control.
November 11, 2021 by Sarah Kuang, Kinwong
This article explores using PSpice for TI to simulate potential causes for parasitic effects in a motor-drive design and offers design tips to mitigate the negative effects common with high-power motor-drive systems.
February 04, 2021 by Matt Hein, Texas Instruments
Designers must consider processing temperatures, producibility, and solder joint integrity of every component as well as higher I/O connectors. This article looks at ways to enable smaller component footprints for high-density PCBs.
November 03, 2020 by Brian Niehoff, Samtec