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How SoC Integration Impacts SMT Assembly Yield

How SoC Integration Impacts SMT Assembly Yield

Learn how SoC integration impacts SMT assembly yield, from fine-pitch BGA challenges and package warpage to reflow profiling and inspection strategies.


HDLs Are Software (and It’s Crazy We’re Still Arguing About It)

HDLs Are Software (and It’s Crazy We’re Still Arguing About It)

HDLs are formal descriptions of behavior, making them software by definition. Modernizing these outdated tools is key to making FPGA development more accessible and productive for all engineers.


SoC Evaluation Boards Evolve to Meet New Design Complexities

SoC Evaluation Boards Evolve to Meet New Design Complexities

Modern SoC Evaluation Boards demand high-performance design, SI/PI, and system validation. Faraday offers 3 flexible service levels to meet these complexities.


Avoid Rework and Production Delays by Aligning Electrical and Mechanical Design

Avoid Rework and Production Delays by Aligning Electrical and Mechanical Design

Learn how to prevent costly assembly delays by synchronizing ECAD and MCAD workflows through continuous 3D validation. This also stabilizes production and eliminates mid-cycle re-spins.


Decisions Ahead for the Next Generation of Advanced Packaging

Decisions Ahead for the Next Generation of Advanced Packaging

Advanced packaging is at a crossroads due to AI demand. Learn the four emerging paths—CoWoS, CoPoS, glass-core, and CoWoP—and how to choose the right one for your multi-die system design.


Breaking Down 50 Million Pins: A Smarter Way to Design 3D IC Packages

Breaking Down 50 Million Pins: A Smarter Way to Design 3D IC Packages

The shift to 3D ICs and chiplets demands automated, hierarchical design planning to manage exploding pin counts. Learn how Siemens EDA's Innovator3D IC addresses these challenges.


Software-Defined Systems: Reshaping the Future of Modern Cars

Software-Defined Systems: Reshaping the Future of Modern Cars

This article explores how digital twins can help to reshape the design methodology of automotive semiconductors and systems, enabling truly software-defined vehicles.


FPGAs Need a New Future

FPGAs Need a New Future

FPGAs are limited by outdated proprietary software. Learn how embracing open-source tools is necessary to modernize FPGA development and unlock their full potential.


Why 90% of Component Compliance Issues Are Preventable (And How To Stop Them)

Why 90% of Component Compliance Issues Are Preventable (And How To Stop Them)

In today's rapidly evolving aerospace and defense landscape, component engineers face an unprecedented challenge: ensuring every part they specify meets stringent compliance requirements while maintaining mission readiness and program viability.


AI’s Appetite for Memory: Can Hardware Designs Keep Pace?

AI’s Appetite for Memory: Can Hardware Designs Keep Pace?

Memory selection has become a priority, as AI system designs demand more memory. Learn how to navigate hardware designs impacts and supply chain issues, and how BOM management tools help smooth the way.


An AI Revolution in Power Management Design for Embedded Systems

An AI Revolution in Power Management Design for Embedded Systems

Learn how PMIC.AI leverages custom LLM technology to transform how engineers design power supplies that meet the increasing complexity of multi-rail SoC systems.


Using Programmable Logic Devices for Systematic Power-Up Sequencing

Using Programmable Logic Devices for Systematic Power-Up Sequencing

Learn how single-chip programmable logic devices (PLDs) can replace multiple discrete components used in power-up sequencing circuits to save cost and PCB area.


The 150-Year-Old Principle at the Root of Secure Silicon and Software

The 150-Year-Old Principle at the Root of Secure Silicon and Software

Learn how open source silicon can provide better security than traditional measures like obscurity, but only if employed correctly, managed well, and backed with appropriate resources.


The Good and Bad of Grounded Copper Pour: The EMC Perspective

The Good and Bad of Grounded Copper Pour: The EMC Perspective

In PCB design, using grounded copper pour can be a double-edged sword. Learn how to make smart design decisions on balancing copper layers, preventing dead copper issues, and enhancing PCB performance.


Crafting a Silicon Lifecycle Management Strategy for HPC and Data Centers

Crafting a Silicon Lifecycle Management Strategy for HPC and Data Centers

As data center computing and HPC advances, the stakes for ensuring reliability are high. Learn how to develop a silicon lifecycle management (SLM) strategy that ensures a successful future for your designs.


Six Steps for Designing a Custom 3D Printed Electronics Enclosure

Six Steps for Designing a Custom 3D Printed Electronics Enclosure

Rich resources are available today for crafting an enclosure using 3D printing. But where to begin? In this article, learn—step by step—how to design your own custom 3D printed electronics enclosure.


The 10 Most Common EMC Challenges in a PCB Design

The 10 Most Common EMC Challenges in a PCB Design

Improve your PCB designs and avoid costly respins due to EMC test failures by learning some basic design techniques and applying modern EMC analysis software.


Performing Design for Manufacturing Checks on Gerber Files

Performing Design for Manufacturing Checks on Gerber Files

Avoid mistakes when exporting PCB files from your EDA tools into the Gerber format by understanding the translation process and using DFM tools.


Understanding Gerber Layers for PCBs and Stencils

Understanding Gerber Layers for PCBs and Stencils

Gerber layers don’t have to be a mystery. Knowing the names and purposes of each Gerber layer used in PCB manufacturing can improve your designs and ease communication with the board house.


Getting To Know the Gerber File Format and File Names

Getting To Know the Gerber File Format and File Names

Learn the details of the Gerber file format for PCB layout, including function, common layers, file names, extensions, and revisions to the Gerber standards.