3GPP Release 16 holds the promise to make high precision location services cheaper and more reliable. Exploiting new signal properties in combination with a variety of non-cellular technologies could enable forms of hybrid positioning.
April 02, 2019 by Sylvia Lu, u-blox
This article looks at a solution to add additional USB charging ports to a vehicle using a single chip containing all the necessary parts and delivers 5V to the device.
July 10, 2018 by Nazzareno Rossetti, Maxim Integrated
Part 5 of this 12-part series continues to explore effective noise bandwidth as it relates to delta-sigma ADCs and system-level design by stepping through a simple example using a two-stage filter to understand how to calculate the ENBW and how system changes affect the ENBW.
May 22, 2018 by Bryan Lizon, Texas Instruments
Part 4 of this “Resolving the Signal” article series covers noise in delta-sigma ADCs focuses on understanding basic effective noise bandwidth (ENBW) topics.
April 11, 2018 by Bryan Lizon, Texas Instruments
Connected industrial machines can sense a wide array of information used to make key decisions within the Industrial Internet of Things (IIoT). A sensor within an edge node can be spatially far removed from any data aggregation point. It must connect through a gateway that links edge data with a network.
January 09, 2018 by Ian Beavers, Analog Devices
This article describes the state of the semiconductor technology that is enabling new developments with shorter gate length GaAs and GaN transistors, circuit design considerations to achieve optimum performance, and examples of both GaAs and GaN wideband power amplifiers (PAs) that demonstrate today’s technology.
November 14, 2017 by Keith Benson, Analog Devices
The next step of wide-area wireless connection is to bring the power of wireless to machine type communications (MTC). This will drive a revolution in services that will span sectors as diverse as manufacturing, city management, transportation, and energy.
October 17, 2017 by Emmanuel Gresset, CEVA
Digital power supplies are widely employed in high-end servers, storage, telecom brick modules, and more. For these applications, isolation is often required. This article discusses the digital isolation techniques with Analog Devices’ iCoupler products in digital power supply design.
August 01, 2017 by Jason Duan, Analog Devices
Development is well underway on Gigabit LTE cellular communications systems that promise an order of magnitude increase in data transfer rates and 5G is close behind. Small cell access nodes will form an essential part of both systems but new communications processors are needed to make these a reality.
June 08, 2017 by Emmanuel Gresset, CEVA
Passive intermodulation represents the intermodulation products generated when two or more signals transit through a passive device with nonlinear properties. The interaction of mechanical components generally causes nonlinear elements.
May 09, 2017 by Frank Kearney, Analog Devices
This article discusses some concepts for ensuring motion detector designs will be robust to external disturbances by presenting an infrared detector assembly that can significantly reduce the parts count and improve product performance and reliability.
5 days ago by Ryan Sheahen, Littelfuse
Leveraging board-level cameras offer a variety of benefits. To help identify the right mix of features and design elements, here are some factors to consider when selecting and designing in an embedded machine vision camera.
February 11, 2021 by Brian Cha, FLIR
This article explores using PSpice for TI to simulate potential causes for parasitic effects in a motor-drive design and offers design tips to mitigate the negative effects common with high-power motor-drive systems.
February 04, 2021 by Matt Hein, Texas Instruments
Stepper motors work well in a wide range of applications but can struggle with torque ripple and current distortion issues. Learn about QuietStep, a proprietary algorithm from Allegro MicroSystems, as a possible solution.
February 02, 2021 by Dan Jacques, Allegro MicroSystems
This article provides designers with recommendations for protection and low-power control components for power outlet design that both prevent overloads from damaging sensitive circuitry and maximize device efficiency.
January 26, 2021 by Ryan Sheahen, Littelfuse
Learn about the benefits of time-sensitive networking (TSN) and how engineers use it to ensure that an industrial system is ready for the future. This article focuses on three members of the set of TSN standards.
January 19, 2021 by Jeff Steinheider, NXP Semiconductors
Redriver or retimer devices can extend the Peripheral Component Interface Express (PCIe®) protocol signal range. This article discusses how to select the best one for compute system and NVMe™ storage applications today and into the future.
January 12, 2021 by Tam Do, Microchip
This article explores components that protect and control their circuits in smart home security applications, specifically components for protecting wired and wireless security cameras and wired doorbell cameras.
December 22, 2020 by Ryan Sheahen, Littelfuse
This article discusses an algorithm to find the optimum adjusted point in a two-dimensional space with orthogonal input vectors. The algorithm solves equations for intersecting circles based on measured data points.
December 15, 2020 by Russell Hoppenstein, Texas Instruments
Learn about the widely used methods for filtering and processing data samples in the time domain while taking a closer look at the Dual Biquad IIR engine of the PowerQuad unit in the LPC55S69 MCU.
December 03, 2020 by Eli Hughes, NXP Semiconductors
This article explores the IEC 60730 Class B standard for functional safety to address both mechanical and electrical design in appliances. Learn what the standard entails and controllers to help meet these standards.
December 01, 2020 by Chad Solomon, Microchip Technology
This article provides an overview of access control topology in smart homes and industrial buildings by covering the various protection and sensing solutions engineers can use in their designs.
November 17, 2020 by Ryan Sheahen, Littelfuse
Designers must consider processing temperatures, producibility, and solder joint integrity of every component as well as higher I/O connectors. This article looks at ways to enable smaller component footprints for high-density PCBs.
November 03, 2020 by Brian Niehoff, Samtec
