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How SoC Integration Impacts SMT Assembly Yield

How SoC Integration Impacts SMT Assembly Yield

Learn how SoC integration impacts SMT assembly yield, from fine-pitch BGA challenges and package warpage to reflow profiling and inspection strategies.


SoC Evaluation Boards Evolve to Meet New Design Complexities

SoC Evaluation Boards Evolve to Meet New Design Complexities

Modern SoC Evaluation Boards demand high-performance design, SI/PI, and system validation. Faraday offers 3 flexible service levels to meet these complexities.


Avoid Rework and Production Delays by Aligning Electrical and Mechanical Design

Avoid Rework and Production Delays by Aligning Electrical and Mechanical Design

Learn how to prevent costly assembly delays by synchronizing ECAD and MCAD workflows through continuous 3D validation. This also stabilizes production and eliminates mid-cycle re-spins.


Decisions Ahead for the Next Generation of Advanced Packaging

Decisions Ahead for the Next Generation of Advanced Packaging

Advanced packaging is at a crossroads due to AI demand. Learn the four emerging paths—CoWoS, CoPoS, glass-core, and CoWoP—and how to choose the right one for your multi-die system design.


Breaking Down 50 Million Pins: A Smarter Way to Design 3D IC Packages

Breaking Down 50 Million Pins: A Smarter Way to Design 3D IC Packages

The shift to 3D ICs and chiplets demands automated, hierarchical design planning to manage exploding pin counts. Learn how Siemens EDA's Innovator3D IC addresses these challenges.


Common Antenna Integration Challenges and How to Handle Them

Common Antenna Integration Challenges and How to Handle Them

The design of RF systems requires engineers to face complex challenges. Learn how automated tools augmented with AI are becoming available to help with this.


Why 90% of Component Compliance Issues Are Preventable (And How To Stop Them)

Why 90% of Component Compliance Issues Are Preventable (And How To Stop Them)

In today's rapidly evolving aerospace and defense landscape, component engineers face an unprecedented challenge: ensuring every part they specify meets stringent compliance requirements while maintaining mission readiness and program viability.


How Mature-Technology ASICs Can Give You the Edge

How Mature-Technology ASICs Can Give You the Edge

Learn how application-specific integrated circuits can enable companies to leverage their key IP and distinguish themselves from competitors who use off-the-shelf ICs.


AI’s Appetite for Memory: Can Hardware Designs Keep Pace?

AI’s Appetite for Memory: Can Hardware Designs Keep Pace?

Memory selection has become a priority, as AI system designs demand more memory. Learn how to navigate hardware designs impacts and supply chain issues, and how BOM management tools help smooth the way.


Designing Wearable Injectors: Low Power Meets Circuit Protection

Designing Wearable Injectors: Low Power Meets Circuit Protection

Learn how to optimize performance, safety, and battery life in 24/7 drug delivery systems using smart sensing and protection components.


Sustainable PCB Manufacturing: Eco-Friendly Materials and Practices

Sustainable PCB Manufacturing: Eco-Friendly Materials and Practices

Current initiatives for sustainable PCB manufacturing often focus more on regulatory compliance than environmental responsibility. We will examine those initiatives plus newer ideas that could provide a better path forward for the PCB manufacturing industry.


Designing Next-Gen Smart Meters That Outsmart Electrical Hazards

Designing Next-Gen Smart Meters That Outsmart Electrical Hazards

Smart meters should be designed to avoid damaging electrical transients. Learn how to make use of the right circuit protection, sensing, and power control components to improve your meter design.


The Good and Bad of Grounded Copper Pour: The EMC Perspective

The Good and Bad of Grounded Copper Pour: The EMC Perspective

In PCB design, using grounded copper pour can be a double-edged sword. Learn how to make smart design decisions on balancing copper layers, preventing dead copper issues, and enhancing PCB performance.


How To Use SMT Adapter Modules for Advanced IC Package Transitioning

How To Use SMT Adapter Modules for Advanced IC Package Transitioning

Learn how surface-mount adapter evaluation modules (EVMs) help ease the transition to analog ICs with advanced package types.


The 10 Most Common EMC Challenges in a PCB Design

The 10 Most Common EMC Challenges in a PCB Design

Improve your PCB designs and avoid costly respins due to EMC test failures by learning some basic design techniques and applying modern EMC analysis software.


Performing Design for Manufacturing Checks on Gerber Files

Performing Design for Manufacturing Checks on Gerber Files

Avoid mistakes when exporting PCB files from your EDA tools into the Gerber format by understanding the translation process and using DFM tools.


Understanding Gerber Layers for PCBs and Stencils

Understanding Gerber Layers for PCBs and Stencils

Gerber layers don’t have to be a mystery. Knowing the names and purposes of each Gerber layer used in PCB manufacturing can improve your designs and ease communication with the board house.


Getting To Know the Gerber File Format and File Names

Getting To Know the Gerber File Format and File Names

Learn the details of the Gerber file format for PCB layout, including function, common layers, file names, extensions, and revisions to the Gerber standards.


Rigid-Flex vs. Traditional PCBs: Making the Right Choice

Rigid-Flex vs. Traditional PCBs: Making the Right Choice

The pros and cons of rigid-flex and traditional rigid PCBs will be compared to help you select the optimal technology for your next electronic system design.


How To Reduce EMI in Switching-Converters When Spread Spectrum Is Not an Option

How To Reduce EMI in Switching-Converters When Spread Spectrum Is Not an Option

Learn five alternatives to spread spectrum for EMI mitigation in switched-mode power supplies: passive and active EMI filtering, slew rate control, advanced packaging, and PCB layout optimization.