In this article, learn how to enable I2C by allowing the LPC55S69 MCU on the E1 board to communicate with a Bosch BME280 environmental sensor present on the Microe Weather click module.
September 10, 2020 by Mark Dunnett, on Behalf of NXP
As automotive moves from domain to zonal networks, many different kinds of data end up sharing the same wires. This article looks at IEEE 802.1’s Time-Sensitive Networking (TSN) standards as a solution.
July 21, 2020 by Don Pannell, NXP Semiconductors
Novel approaches to end node power supply design using switched-mode converters can enable a wireless end node to operate from a CR2032 lithium coin cell with up to +20 dBm transmit power.
June 25, 2019 by Josh Norem, Silicon Labs
This article explores how RISC-V, combined with open-source collaboration and standards, is enabling innovation and purpose-built technologies among software engineers, system architects, CTOs, and board designers. It also touches on the possible impact that RISC-V and open source trends could have on the future of data-centric application experiences.
March 20, 2019 by Ted Marena, Western Digital
This article shows how to implement an analog PID controller, including adjusting of the angular position of a DC motor shaft, editing the design to control its speed, and tuning PID parameters for reliable performance.
August 14, 2018 by Mahmoud Hamdy, Brightskies Technologies
This app note implements a binary parity generator and checker with two data input variants, a parallel data input, and a serial data input. It describes the implemented logic, GreenPAKs implementation, and the obtained results.
June 12, 2018 by Dialog Semiconductor
Historically, FPGAs have been challenging to work with. To combat that reputation, Xilinx developed programmable devices that simplify—and accelerate—the implementation of customized hardware development.
June 08, 2018 by Xilinx
Quad flat no-lead and discrete (or dual) flat no-lead packages provide a welcome increase in component density on a PCB area by eliminating leads. However, the solder connection quality cannot be tested by automated optical inspection. This article explores solutions to this often costly problem.
May 31, 2018 by Hans-Jürgen Funke, Nexperia