As automotive moves from domain to zonal networks, many different kinds of data end up sharing the same wires. This article looks at IEEE 802.1’s Time-Sensitive Networking (TSN) standards as a solution.
July 21, 2020 by Don Pannell, NXP Semiconductors
With the adoption of artificial intelligence and machine learning in a wide variety of applications, reliability verification of AI/ML processors is critical since failures can have major consequences for the validity and legitimacy of AI/ML technology.
January 21, 2020 by Neel Natekar, Mentor
This article looks at the safety standard that governs ADAS features and the challenge in designing power monitoring systems to comply with this standard while introducing an automotive power monitor that has been certified to meet this standard.
September 06, 2019 by Michael Jackson, Maxim Integrated
3GPP Release 16 holds the promise to make high precision location services cheaper and more reliable. Exploiting new signal properties in combination with a variety of non-cellular technologies could enable forms of hybrid positioning.
April 02, 2019 by Sylvia Lu, u-blox
This article shows how to implement an analog PID controller, including adjusting of the angular position of a DC motor shaft, editing the design to control its speed, and tuning PID parameters for reliable performance.
August 14, 2018 by Mahmoud Hamdy, Brightskies Technologies
This article looks at a solution to add additional USB charging ports to a vehicle using a single chip containing all the necessary parts and delivers 5V to the device.
July 10, 2018 by Nazzareno Rossetti, Maxim Integrated
Quad flat no-lead and discrete (or dual) flat no-lead packages provide a welcome increase in component density on a PCB area by eliminating leads. However, the solder connection quality cannot be tested by automated optical inspection. This article explores solutions to this often costly problem.
May 31, 2018 by Hans-Jürgen Funke, Nexperia
SoCs with programmable logic are an essential element of real-time embedded vision systems. Designers can capitalize on the power and efficiency of Xilinx's Zynq Ultrascale+ MPSoC devices to implement their designs using Avnet's Embedded Vision Kits and the Xilinx reVISION stack.
May 18, 2018 by Xilinx
Looking at the electrification of the powertrain, this article explores why 48-volt architecture makes sense and then takes a look at some of the different mounting options for 48-volt starter generators.
April 24, 2018 by Ivan Petrov, Nexperia
This article looks at digit detection and recognition using MNIST eIQ as an example, which consists of several parts — the digit recognition is performed by a TensorFlow Lite model, and a GUI is used to increase the usability of the i.MX RT1060 device.
3 days ago by David Piskula, NXP Semiconductors
In this article, we discuss some key security threats to be aware of when designing for the IoT, important security functions, and how protecting these designs is becoming easier with advances in security ICs.
September 15, 2020 by Scott Jones, Maxim Integrated
In this article, learn how to enable I2C by allowing the LPC55S69 MCU on the E1 board to communicate with a Bosch BME280 environmental sensor present on the Microe Weather click module.
September 10, 2020 by Mark Dunnett, on Behalf of NXP
Floating-gate Flash circuitry is only embedded in devices fabricated at 40nm or earlier nodes, so it is not embedded in the most advanced, highest-performance processors. For secure code and data storage, designers, therefore, have to specify an external device that contains secure memory capacity.
In partnership with Winbond
What are your assumptions about the reliability, longevity, and performance of NAND? This article proposes that embedded developers should open their minds to the potential benefits of replacing SPI NOR Flash with serial NAND Flash for storing mission-critical boot and application code.
In partnership with Winbond
MCAD and ECAD have inserted themselves into most design engineers' day-to-day work. Although familiar, both programs have come a long way and are continuing to evolve. In this article, learn the past and future of these design tools.
August 27, 2020 by Sam Sattel, Autodesk
Intel Enpirion PowerSoC modules are DC-DC step-down converters that integrate nearly all the components needed to build a power supply without sacrificing performance or efficiency. These solutions are designed to meet strict FPGA, ASIC, and processor power requirements.
August 25, 2020 by Tamara Lin, Intel
The OKdo E1 development board is only as wide as a coin but contains the LPC55S69 microcontroller, making it suitable for a variety of small production runs and prototypes. Here, get more familiar with the dev board and see how to use its evaluation kit.
August 20, 2020 by Mark Dunnett, on Behalf of NXP
Autonomous drones and robots utilize small motors. These fast-spinning mini motors require miniature encoders and IC package sizes. This article shows how an optical sinusoidal encoder provides a higher resolution and increased speeds with a 2x3 mm dual simultaneous-sampling SAR-ADC.
August 11, 2020 by Bonnie Baker, Maxim Integrated
Explore the LPC55S16, an MCU well-suited for industrial and professional applications, thanks to its fast clock speed of 150 MHz, out-of-the-box support for communicating over a CAN-FD bus network, and low current consumption.
August 06, 2020 by Mark Dunnett, on Behalf of NXP
The FixturFab DEV260 development fixture allows designers to debug or configure PCBAs during the development phase. See how it works in this example using the Sparkfun Power Delivery Board.
August 04, 2020 by Duncan Lowder, FixturFab
As automotive moves from domain to zonal networks, many different kinds of data end up sharing the same wires. This article looks at IEEE 802.1’s Time-Sensitive Networking (TSN) standards as a solution.
July 21, 2020 by Don Pannell, NXP Semiconductors
