Leveraging board-level cameras offer a variety of benefits. To help identify the right mix of features and design elements, here are some factors to consider when selecting and designing in an embedded machine vision camera.
February 11, 2021 by Brian Cha, FLIR
This article provides an overview of access control topology in smart homes and industrial buildings by covering the various protection and sensing solutions engineers can use in their designs.
November 17, 2020 by Ryan Sheahen, Littelfuse
This article looks at semiconductor technologies that are driving EV chargers, including high-voltage semiconductor switches, power converters, and multi-level complex power stages.
October 06, 2020 by Jayanth Rangaraju, Texas Instruments
As automotive moves from domain to zonal networks, many different kinds of data end up sharing the same wires. This article looks at IEEE 802.1’s Time-Sensitive Networking (TSN) standards as a solution.
July 21, 2020 by Don Pannell, NXP Semiconductors
With the adoption of artificial intelligence and machine learning in a wide variety of applications, reliability verification of AI/ML processors is critical since failures can have major consequences for the validity and legitimacy of AI/ML technology.
January 21, 2020 by Neel Natekar, Mentor
This article looks at the safety standard that governs ADAS features and the challenge in designing power monitoring systems to comply with this standard while introducing an automotive power monitor that has been certified to meet this standard.
September 06, 2019 by Michael Jackson, Maxim Integrated
3GPP Release 16 holds the promise to make high precision location services cheaper and more reliable. Exploiting new signal properties in combination with a variety of non-cellular technologies could enable forms of hybrid positioning.
April 02, 2019 by Sylvia Lu, u-blox
This article shows how to implement an analog PID controller, including adjusting of the angular position of a DC motor shaft, editing the design to control its speed, and tuning PID parameters for reliable performance.
August 14, 2018 by Mahmoud Hamdy, Brightskies Technologies
This article looks at a solution to add additional USB charging ports to a vehicle using a single chip containing all the necessary parts and delivers 5V to the device.
July 10, 2018 by Nazzareno Rossetti, Maxim Integrated
Quad flat no-lead and discrete (or dual) flat no-lead packages provide a welcome increase in component density on a PCB area by eliminating leads. However, the solder connection quality cannot be tested by automated optical inspection. This article explores solutions to this often costly problem.
May 31, 2018 by Hans-Jürgen Funke, Nexperia
This article discusses some concepts for ensuring motion detector designs will be robust to external disturbances by presenting an infrared detector assembly that can significantly reduce the parts count and improve product performance and reliability.
About 6 days ago by Ryan Sheahen, Littelfuse
Leveraging board-level cameras offer a variety of benefits. To help identify the right mix of features and design elements, here are some factors to consider when selecting and designing in an embedded machine vision camera.
February 11, 2021 by Brian Cha, FLIR
This article explores using PSpice for TI to simulate potential causes for parasitic effects in a motor-drive design and offers design tips to mitigate the negative effects common with high-power motor-drive systems.
February 04, 2021 by Matt Hein, Texas Instruments
Stepper motors work well in a wide range of applications but can struggle with torque ripple and current distortion issues. Learn about QuietStep, a proprietary algorithm from Allegro MicroSystems, as a possible solution.
February 02, 2021 by Dan Jacques, Allegro MicroSystems
This article provides designers with recommendations for protection and low-power control components for power outlet design that both prevent overloads from damaging sensitive circuitry and maximize device efficiency.
January 26, 2021 by Ryan Sheahen, Littelfuse
Learn about the benefits of time-sensitive networking (TSN) and how engineers use it to ensure that an industrial system is ready for the future. This article focuses on three members of the set of TSN standards.
January 19, 2021 by Jeff Steinheider, NXP Semiconductors
Redriver or retimer devices can extend the Peripheral Component Interface Express (PCIe®) protocol signal range. This article discusses how to select the best one for compute system and NVMe™ storage applications today and into the future.
January 12, 2021 by Tam Do, Microchip
This article explores components that protect and control their circuits in smart home security applications, specifically components for protecting wired and wireless security cameras and wired doorbell cameras.
December 22, 2020 by Ryan Sheahen, Littelfuse
This article discusses an algorithm to find the optimum adjusted point in a two-dimensional space with orthogonal input vectors. The algorithm solves equations for intersecting circles based on measured data points.
December 15, 2020 by Russell Hoppenstein, Texas Instruments
Learn about the widely used methods for filtering and processing data samples in the time domain while taking a closer look at the Dual Biquad IIR engine of the PowerQuad unit in the LPC55S69 MCU.
December 03, 2020 by Eli Hughes, NXP Semiconductors
This article explores the IEC 60730 Class B standard for functional safety to address both mechanical and electrical design in appliances. Learn what the standard entails and controllers to help meet these standards.
December 01, 2020 by Chad Solomon, Microchip Technology
This article provides an overview of access control topology in smart homes and industrial buildings by covering the various protection and sensing solutions engineers can use in their designs.
November 17, 2020 by Ryan Sheahen, Littelfuse
Designers must consider processing temperatures, producibility, and solder joint integrity of every component as well as higher I/O connectors. This article looks at ways to enable smaller component footprints for high-density PCBs.
November 03, 2020 by Brian Niehoff, Samtec
