This article provides an overview of access control topology in smart homes and industrial buildings by covering the various protection and sensing solutions engineers can use in their designs.
November 17, 2020 by Ryan Sheahen, Littelfuse
This article looks at semiconductor technologies that are driving EV chargers, including high-voltage semiconductor switches, power converters, and multi-level complex power stages.
October 06, 2020 by Jayanth Rangaraju, Texas Instruments
As automotive moves from domain to zonal networks, many different kinds of data end up sharing the same wires. This article looks at IEEE 802.1’s Time-Sensitive Networking (TSN) standards as a solution.
July 21, 2020 by Don Pannell, NXP Semiconductors
With the adoption of artificial intelligence and machine learning in a wide variety of applications, reliability verification of AI/ML processors is critical since failures can have major consequences for the validity and legitimacy of AI/ML technology.
January 21, 2020 by Neel Natekar, Mentor
This article looks at the safety standard that governs ADAS features and the challenge in designing power monitoring systems to comply with this standard while introducing an automotive power monitor that has been certified to meet this standard.
September 06, 2019 by Michael Jackson, Maxim Integrated
3GPP Release 16 holds the promise to make high precision location services cheaper and more reliable. Exploiting new signal properties in combination with a variety of non-cellular technologies could enable forms of hybrid positioning.
April 02, 2019 by Sylvia Lu, u-blox
This article shows how to implement an analog PID controller, including adjusting of the angular position of a DC motor shaft, editing the design to control its speed, and tuning PID parameters for reliable performance.
August 14, 2018 by Mahmoud Hamdy, Brightskies Technologies
This article looks at a solution to add additional USB charging ports to a vehicle using a single chip containing all the necessary parts and delivers 5V to the device.
July 10, 2018 by Nazzareno Rossetti, Maxim Integrated
Quad flat no-lead and discrete (or dual) flat no-lead packages provide a welcome increase in component density on a PCB area by eliminating leads. However, the solder connection quality cannot be tested by automated optical inspection. This article explores solutions to this often costly problem.
May 31, 2018 by Hans-Jürgen Funke, Nexperia
SoCs with programmable logic are an essential element of real-time embedded vision systems. Designers can capitalize on the power and efficiency of Xilinx's Zynq Ultrascale+ MPSoC devices to implement their designs using Avnet's Embedded Vision Kits and the Xilinx reVISION stack.
May 18, 2018 by Xilinx
This article provides an overview of access control topology in smart homes and industrial buildings by covering the various protection and sensing solutions engineers can use in their designs.
November 17, 2020 by Ryan Sheahen, Littelfuse
Designers must consider processing temperatures, producibility, and solder joint integrity of every component as well as higher I/O connectors. This article looks at ways to enable smaller component footprints for high-density PCBs.
November 03, 2020 by Brian Niehoff, Samtec
NXP’s i.MX 8M Plus applications processor enables machine learning and intelligent vision for consumer applications and the industrial edge. Learn about the features of this processor and how it can be used in embedded vision systems.
October 22, 2020 by Jeff Steinheider, NXP Semiconductors
This article looks at semiconductor technologies that are driving EV chargers, including high-voltage semiconductor switches, power converters, and multi-level complex power stages.
October 06, 2020 by Jayanth Rangaraju, Texas Instruments
This article looks at digit detection and recognition using MNIST eIQ as an example, which consists of several parts — the digit recognition is performed by a TensorFlow Lite model, and a GUI is used to increase the usability of the i.MX RT1060 device.
September 22, 2020 by David Piskula, NXP Semiconductors
In this article, we discuss some key security threats to be aware of when designing for the IoT, important security functions, and how protecting these designs is becoming easier with advances in security ICs.
September 15, 2020 by Scott Jones, Maxim Integrated
In this article, learn how to enable I2C by allowing the LPC55S69 MCU on the E1 board to communicate with a Bosch BME280 environmental sensor present on the Microe Weather click module.
September 10, 2020 by Mark Dunnett, on Behalf of NXP
Floating-gate Flash circuitry is only embedded in devices fabricated at 40nm or earlier nodes, so it is not embedded in the most advanced, highest-performance processors. For secure code and data storage, designers, therefore, have to specify an external device that contains secure memory capacity.
In partnership with Winbond
