Summit 2026 - CoolSiC™ JFET and Its Benefits in Solid-State Power Distribution
Learn how Infineon devices enable safer, efficient protection by combining ultra-low RDS(on), bidirectional operation, and Q DPAK packaging to reduce losses, enhance reliability, and scale current.
This session explores how Infineon’s CoolSiC™ JFETs enable safer, more efficient solid-state power distribution and protection by combining ultra-low RDS(on), robust turn-off and avalanche capability, bidirectional operation, and top-side-cooled Q DPAK packaging.XT thermal interconnection. By the end of the session, participants will understand the basics of JFETs, key performance elements, and how to integrate CoolSiC™ JFETs in solid-state protection to reduce losses, enhance reliability, and scale current with easy paralleling.
Key Takeaways
- Introduction to the CoolSiC™ JFET family and its variants
- Fundamentals of normally-on JFETs for protection circuits
- JFET vs MOSFET principles: conduction losses, robustness, and thermal behavior
- Packaging and thermal considerations: Q-DPAK top-side cooled and .XT for higher power density and reliability
- Real-world examples of CoolSiC™ JFETs in action
