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A Deep Dive on Winbond’s Memory Technology for Edge AI

A Deep Dive on Winbond’s Memory Technology for Edge AI

In this deep dive, we take a look at how Winbond’s CUBE technology solves memory challenges for edge AI designs.


News Nov 13, 2024 by Jeff Child
Global Efforts Heat Up to Boost Semiconductor Production

Global Efforts Heat Up to Boost Semiconductor Production

Investments in semiconductor manufacturing have been on the rise in recent years. Here are a few new examples.


News Aug 22, 2024 by Jake Hertz
Rethinking MCU Architectures for the AI Era

Rethinking MCU Architectures for the AI Era

MCUs that only do control tasks are one thing. But in today’s AI age, a truly AI-enabled MCU needs to offer more. Learn the important factors—from optimized neural processing units (NPUs) to power efficient architectures to clever memory topologies.


SureCore Balances Power and Cooling Costs With Cryogenic Memory

SureCore Balances Power and Cooling Costs With Cryogenic Memory

SureCore has announced a low-power, cryogenic SRAM to reduce the energy demands of AI workloads on data centers.


News Jun 11, 2024 by Arjun Nijhawan
Applying IP Customization to Improve AI Chips: A Case Study

Applying IP Customization to Improve AI Chips: A Case Study

For your next chip design, should you select a design-services provider with the ability to create custom fundamental IP blocks, including standard cells and libraries? This article will help you answer this question.


Eyeing Replacing SODIMMs in Laptops, Micron Debuts Its LPCAMM2 Module

Eyeing Replacing SODIMMs in Laptops, Micron Debuts Its LPCAMM2 Module

Today at CES in Las Vegas, Micron unveiled its 16 GB to 64 GB LPCAMM2, the first new mobile PC memory module form factor since the SODIMM in 1997.


News Jan 09, 2024 by Duane Benson
Kinara Aims Its Tiny Ara-2 Processor at Big Generative Edge AI Workloads

Kinara Aims Its Tiny Ara-2 Processor at Big Generative Edge AI Workloads

Boasting a cost-effective approach, today Kinara is rolling out its new edge AI processor designed to take on the demanding workloads brought on by generative AI.


News Dec 12, 2023 by Jake Hertz
Your 2023 Back-to-School Guide to All About Circuits’ Educational Resources

Your 2023 Back-to-School Guide to All About Circuits’ Educational Resources

Whether you are just starting your first year as an engineering student, working on a second or third degree, or simply want to brush up on key topics, All About Circuits has the resources you need: awesome textbooks, technical articles, calculators, and more for your EE studies.


News Oct 11, 2023 by Jeff Child
MIPI Alliance Reports Successful Plugfest of Three I3C Specifications

MIPI Alliance Reports Successful Plugfest of Three I3C Specifications

This year’s Plugfest helped validate I3C and build out its ecosystem amongst some of the industry’s leaders.


News Sep 28, 2023 by Jake Hertz
System Challenges of Generative AI Inference Acceleration

System Challenges of Generative AI Inference Acceleration

When you look under the hood of generative AI processing, the system design challenges are many. Learn how efficiency, power consumption, and memory issues all come into play.


AI Networking Chip Startup, Enfabrica, Receives $125 Million in Series B Funding

AI Networking Chip Startup, Enfabrica, Receives $125 Million in Series B Funding

With Nvidia now added to its list of strategic investors, Enfabrica has opened pre-orders on systems using its AI era fabric switch IC


News Sep 15, 2023 by Duane Benson
Understanding the Compute Hardware Behind Generative AI

Understanding the Compute Hardware Behind Generative AI

Generative AI tools like ChatGPT have had a huge impact in numerous sectors of society. As engineers, it’s helpful for us to understand the computing technology that makes it possible.


DRAM Innovation Treks On as Samsung and Others Scale Production

DRAM Innovation Treks On as Samsung and Others Scale Production

Semiconductor companies are driving advancements in DRAM, pushing the boundaries of performance, density, and efficiency. Here's some recent examples.


News Jun 12, 2023 by Darshil Patel
Axelera AI Raises $50 Million to ‘Mainstream’ Edge AI

Axelera AI Raises $50 Million to ‘Mainstream’ Edge AI

Leveraging its proprietary in-memory compute scheme and RISC-V dataflow technology, Axelera AI seeks to “democratize” artificial intelligence (AI).


News May 31, 2023 by Jake Hertz
Touting Energy Efficiency, AMD Announces 4th-gen EPYC Embedded Processors

Touting Energy Efficiency, AMD Announces 4th-gen EPYC Embedded Processors

At Embedded World this week, AMD has unveiled its 4th-gen EPYX Embedded processors. The chips offer energy efficiency along with some embedded-specific features.


News Mar 15, 2023 by Jeff Child
sureCore’s Low-power Memory IP to Expedite Power-critical Designs

sureCore’s Low-power Memory IP to Expedite Power-critical Designs

sureCore’s off-the-shelf memory products integrate power-saving features for battery-critical designs like wearables and hearables.


News Mar 10, 2023 by Jake Hertz
Rambus Spins 6.4 GT/s DDR5 Registering Clock Driver for Speedier Servers

Rambus Spins 6.4 GT/s DDR5 Registering Clock Driver for Speedier Servers

The latest chip from Rambus raises the speed limit for DDR5, giving memory-hungry applications, such as data center servers, more room to run.


News Feb 06, 2023 by Aaron Carman
Happy 75th Birthday to the Transistor—the Device That Changed the World

Happy 75th Birthday to the Transistor—the Device That Changed the World

75 years ago, the transistor was born. Its invention launched modern electronics as it moved from the building block of ICs, then microprocessors, and beyond.


News Dec 23, 2022 by Jeff Child
TSMC to Make 3nm Semiconductors at Arizona Fab

TSMC to Make 3nm Semiconductors at Arizona Fab

To meet worldwide demands, the largest semiconductor manufacturers are ramping up capacity. Among them, TSMC plans to build 3nm chips at its Arizona fab.


News Nov 28, 2022 by Lianne Frith
Startup Knocks Down Chiplet Hurdles with High-performance Link

Startup Knocks Down Chiplet Hurdles with High-performance Link

Eliyan is emerging from stealth mode, unveiling the successful tapeout of its high-performance UCIe-compliant die-to-die interconnect technology in 5 nm process.


News Nov 08, 2022 by Jake Hertz