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MediaTek Expands Genio SoC Line to Target AI to IoT, Robotics, and More

MediaTek Expands Genio SoC Line to Target AI to IoT, Robotics, and More

Announced at Embedded World, the new Genio lineup spans value to flagship tiers, with on-device GenAI acceleration ranging from 6 TOPS to over 50 TOPS.


News Mar 16, 2026 by Luke James
Synaptics Redefines Edge IoT with ‘First AI-Native Wi-Fi 7 Connectivity Solution for IoT’

Synaptics Redefines Edge IoT with ‘First AI-Native Wi-Fi 7 Connectivity Solution for IoT’

Announced today at Embedded World, Synaptics claims the SYN765x as the first industry's first AI Native Wi-Fi 7 solution developed specifically for the IoT. It provides Wi-Fi 7, Bluetooth 6.0, and 802.15.4 connectivity and features a Cortex-M52 and Ethos-U55 NPU.


News Mar 10, 2026 by Jake Hertz
ST Rolls Out Low-Power, Cost-Efficient Versions of STM32 MPUs

ST Rolls Out Low-Power, Cost-Efficient Versions of STM32 MPUs

ST says its new microprocessors balance application-class performance, real-time control, and power management.


News Feb 03, 2026 by Jake Hertz
Syslogic Reveals GNSS Expansion Board for Centimeter-Accurate Navigation

Syslogic Reveals GNSS Expansion Board for Centimeter-Accurate Navigation

The add-on board, based on U-blox's X20, brings all-band GNSS, RTK, and HAS-ready corrections to Syslogic's embedded platforms.


News Feb 02, 2026 by Luke James
SGeT Publishes oHFM, an Open, Vendor-Independent FPGA Module Standard

SGeT Publishes oHFM, an Open, Vendor-Independent FPGA Module Standard

The new oHFM specification defines a common, scalable module framework for FPGA and SoC-FPGA designs, targeting carrier-board reuse across vendors and deployment classes.


News Jan 26, 2026 by Luke James
Nordic’s Integrated SoC to Simplify Edge AI for Battery-Powered IoT

Nordic’s Integrated SoC to Simplify Edge AI for Battery-Powered IoT

Nordic's new SoC integrates an Axon NPU and Neuton models, delivering ultra-low-power, on-device AI with quick inference and easier developer workflows.


News Jan 22, 2026 by Joshua Tidwell
The Configurable Matrix Computer: A New Alternative to the von Neumann Architecture

The Configurable Matrix Computer: A New Alternative to the von Neumann Architecture

Learn how this new type of AI processor provides a 100x improvement in power and performance over conventional GPUs or MCUs.


Renesas Reveals First Wi-Fi 6 and Wi-Fi/BLE Combo MCUs for Smart Homes

Renesas Reveals First Wi-Fi 6 and Wi-Fi/BLE Combo MCUs for Smart Homes

RA6W1 is a dual-band Arm Cortex-M33 platform that targets low-power connected devices.


News Dec 16, 2025 by Jake Hertz
My Experience with the Zephyr RTOS—A Hands-On Review

My Experience with the Zephyr RTOS—A Hands-On Review

Robert recently tried the Zephyr RTOS and contributed back to the project in the form of a sensor driver for the MTCH9010 liquid leak detector. In this article, he shares his thoughts.


Analog Devices Rolls Out Rail-to-Rail Amplifier With Low Supply Current

Analog Devices Rolls Out Rail-to-Rail Amplifier With Low Supply Current

ADI built the new dual amplifier to improve low-power, single-supply designs.


News Nov 28, 2025 by Jake Hertz
Edge AI’s Next Battlefield: Development Tools

Edge AI’s Next Battlefield: Development Tools

Learn why the best silicon is useless without the right AI developer tools.


Infineon Serves Up New 60 GHz CMOS Radar Aimed at Low-Power IoT

Infineon Serves Up New 60 GHz CMOS Radar Aimed at Low-Power IoT

The compact 60 GHz radar sensor includes an antenna in package, affording ultra-wide bandwidth FMCW operation with a single-chip solution.


News Nov 17, 2025 by Arjun Nijhawan
Embedded World North America—Filled to the Brim With Innovations

Embedded World North America—Filled to the Brim With Innovations

In this article, we round up the news that leading companies announced last week at the Embedded World North America event in Anaheim, CA


News Nov 14, 2025 by Dale Wilson
Embedded World NA Showcases the Next Chapter of Embedded Intelligence

Embedded World NA Showcases the Next Chapter of Embedded Intelligence

From neuromorphic edge silicon to formal Rust verification, this year’s show revealed how embedded design is evolving at every level.


News Nov 12, 2025 by Luke James
Nuvoton’s New MCU Brings AI Muscle to Entry-Level Edge Devices

Nuvoton’s New MCU Brings AI Muscle to Entry-Level Edge Devices

Nuvoton’s new edgepoint AI microcontroller integrates an Arm Cortex-M55 core and Ethos U55 NPU for real-time AI tasks like voice and image recognition at the edge.


News Nov 11, 2025 by Joshua Tidwell
Analog Devices Brings AI Workflow and Platform Unification to CodeFusion

Analog Devices Brings AI Workflow and Platform Unification to CodeFusion

Announced today, the launch of CodeFusion Studio 2.0 adds AI workflow and improved multicore support along with modular framework and configuration tool unification.


News Nov 03, 2025 by Duane Benson
Security and Upgradeability: Key for Moving From Proof-of-Concept to Product

Security and Upgradeability: Key for Moving From Proof-of-Concept to Product

We examine the software used in a 2025 object detection demo and the lessons it holds for developing new edge AI products.


Synaptics Launches New Multimodal Gen AI Processors for Smart IoT Edge Designs

Synaptics Launches New Multimodal Gen AI Processors for Smart IoT Edge Designs

Leveraging Synaptics’ partnership with Google Research, the new SoC is positioned between microcontroller-class devices and high-end embedded MPUs.


News Oct 16, 2025 by Jake Hertz
Narrowband IoT: Power-Efficient Connectivity for IoT and Smart Cities

Narrowband IoT: Power-Efficient Connectivity for IoT and Smart Cities

Learn how Narrowband (NB)-IoT offers power-efficient, scalable connectivity for IoT and smart cities. It addresses challenges of power, coverage, and cost for massive device deployments.


Optimizing Signal Integrity with Amphenol FCI BergStak HS™ 0.5mm Mezzanine Connectors | Tech Guide

Optimizing Signal Integrity with Amphenol FCI BergStak HS™ 0.5mm Mezzanine Connectors | Tech Guide

Optimizing Signal Integrity with Amphenol FCI BergStak HS™ 0.5mm Mezzanine Connectors deliver high-speed, space-efficient board-to-board connectivity for advanced digital systems. Watch now to get started!