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Altera Intros Upgrade of FPGA AI Suite Enabling Determinism for Physical AI

Altera Intros Upgrade of FPGA AI Suite Enabling Determinism for Physical AI

The new version of FPGA AI Suite is designed to accelerate trained AI models into FPGAs


News May 13, 2026 by Duane Benson
Europe’s Chip Ambitions: Why the EU’s Semi Strategy May Fall Short

Europe’s Chip Ambitions: Why the EU’s Semi Strategy May Fall Short

An audit finds that the European Chips Act is "very unlikely" to hit the 20% global market target by 2030, citing fragmented funding, slow progress on FOAKs, and fierce international competition.


News May 12, 2026 by Gordon Feller
SiTime Reveals MEMS Timing Device for AI Data Center GPU Optimization

SiTime Reveals MEMS Timing Device for AI Data Center GPU Optimization

The MEMS-based oscillator delivers less than 1 nanosecond of time synchronization accuracy for AI clusters.


News May 11, 2026 by Jake Hertz
Intel and US Semi Fabrication Gets Huge Boost on Rumors from SpaceX, Apple

Intel and US Semi Fabrication Gets Huge Boost on Rumors from SpaceX, Apple

SpaceX’s proposed Terafab and Apple's preliminary discussions indicate escalating pressure to expand domestic semiconductor production.


News May 11, 2026 by Jake Hertz
TDK Unwraps Software Tools for Sensor Data and IMU Evaluation

TDK Unwraps Software Tools for Sensor Data and IMU Evaluation

Today, the company released two new AI software products at Sensors Converge, SensorGPT, for creating sensor data at scale, and SensorStage to accelerate development workflow for the company’s latest IMUs.


News May 05, 2026 by Duane Benson
The Hidden Cooling Bottleneck Inside Liquid-Cooled AI Data Centers

The Hidden Cooling Bottleneck Inside Liquid-Cooled AI Data Centers

Learn how liquid cooling eliminates system airflow, creating a hidden thermal bottleneck for 'left-behind' components like memory and SSDs. Targeted micro-cooling is required to restore system balance.


How Neuromorphic Chips are Revolutionizing the Edge

How Neuromorphic Chips are Revolutionizing the Edge

Neuromorphic Edge AI chips mark a fundamental departure from traditional silicon, utilizing brain-inspired, event-driven architectures to enable real-time inference within milliwatt-level power budgets.


Rebellions: The Korean Company to Watch in 2026?

Rebellions: The Korean Company to Watch in 2026?

Learn how Korean AI technology company Rebellions uses proprietary dataflow NPUs, chiplets, and HBM to deliver high-efficiency, scalable AI inference for modern data centers.


News Apr 27, 2026 by Gordon Feller
Mesh AI: Node-Level Intelligence with Non-Cellular 5G/6G Connectivity

Mesh AI: Node-Level Intelligence with Non-Cellular 5G/6G Connectivity

Learn how LM Semi's Mesh AI platform delivers autonomous, secure, node-level intelligence via non-cellular NR+ mesh networks, addressing AI scalability for billions of devices.


News Apr 17, 2026 by Gordon Feller
EW ‘26 Exclusive—Nuvoton Talks MCUs: Low-Power, Edge AI, Automotive, and More

EW ‘26 Exclusive—Nuvoton Talks MCUs: Low-Power, Edge AI, Automotive, and More

We spoke to Nuvoton’s Walter Tseng in this exclusive Embedded World 2026 interview. Our focus was all things microcontrollers, ranging from low power to Edge AI to automotive MCUs.


News Apr 13, 2026 by Jeff Child
For the Netherlands, Photonics Initiatives Secure Global Leadership—Part 2

For the Netherlands, Photonics Initiatives Secure Global Leadership—Part 2

Learn how The Netherlands is leveraging billion-euro investments and European partnerships to scale integrated photonics from research into a world-leading, industrially mature production ecosystem.


News Apr 10, 2026 by Gordon Feller
Navitas Skips 48 V Bus in 800 V-to-6 V GaN PDB for AI Racks

Navitas Skips 48 V Bus in 800 V-to-6 V GaN PDB for AI Racks

GaN-based power delivery board targets 96.5% efficiency and 2,100 W/in3 for NVIDIA's next-generation 800 VDC data center architecture.


News Apr 09, 2026 by Luke James
Decisions Ahead for the Next Generation of Advanced Packaging

Decisions Ahead for the Next Generation of Advanced Packaging

Advanced packaging is at a crossroads due to AI demand. Learn the four emerging paths—CoWoS, CoPoS, glass-core, and CoWoP—and how to choose the right one for your multi-die system design.


EU’s European Investment Bank Meets the Unique Needs of Semiconductors

EU’s European Investment Bank Meets the Unique Needs of Semiconductors

Learn how the EU's premier lending institution is deploying billions in loans, equity, and blended finance to build a sovereign European chip ecosystem.


News Apr 07, 2026 by Gordon Feller
For the Netherlands, Photonics Initiatives Secure Global Leadership—Part 1

For the Netherlands, Photonics Initiatives Secure Global Leadership—Part 1

The Netherlands is securing global leadership in integrated photonics, a technology using light instead of electricity for faster, more energy-efficient data processing, essential for AI, healthcare, and mobility.


News Apr 02, 2026 by Gordon Feller
At Embedded World, Renesas 365 Advances to General Availability Phase

At Embedded World, Renesas 365 Advances to General Availability Phase

The Renesas 365 Development platform unifies electronics design from MCU recommendation to validation.


News Mar 20, 2026 by Duane Benson
MediaTek Expands Genio SoC Line to Target AI to IoT, Robotics, and More

MediaTek Expands Genio SoC Line to Target AI to IoT, Robotics, and More

Announced at Embedded World, the new Genio lineup spans value to flagship tiers, with on-device GenAI acceleration ranging from 6 TOPS to over 50 TOPS.


News Mar 16, 2026 by Luke James
Synaptics Redefines Edge IoT with ‘First AI-Native Wi-Fi 7 Connectivity Solution for IoT’

Synaptics Redefines Edge IoT with ‘First AI-Native Wi-Fi 7 Connectivity Solution for IoT’

Announced today at Embedded World, Synaptics claims the SYN765x as the first industry's first AI Native Wi-Fi 7 solution developed specifically for the IoT. It provides Wi-Fi 7, Bluetooth 6.0, and 802.15.4 connectivity and features a Cortex-M52 and Ethos-U55 NPU.


News Mar 10, 2026 by Jake Hertz
ElastixAI Emerges From Stealth With FPGA Approach to Gen AI Supercomputing

ElastixAI Emerges From Stealth With FPGA Approach to Gen AI Supercomputing

In this exclusive interview, the Seattle startup says its software-ML-hardware co-design—announced today—converts off-the-shelf FPGA servers into high-efficiency AI inference engines.


News Feb 25, 2026 by Luke James
Cadence Unwraps Agentic AI Super Agent for Chip Design and Verification

Cadence Unwraps Agentic AI Super Agent for Chip Design and Verification

Announced today, the new ChipStack AI Super Agent from Cadence automates front end silicon design and verification, delivering a 10X productivity increase.


News Feb 10, 2026 by Duane Benson