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Infineon Serves Up GaN 40 V Switches Aimed at Portable Power Designs

Infineon Serves Up GaN 40 V Switches Aimed at Portable Power Designs

Two new CoolGaN BDS additions replace back-to-back silicon MOSFET pairs with chip-scale packages.


News Jun 09, 2026 by Jake Hertz
The Kilo Lamp: An Interactive Lamp Controller

The Kilo Lamp: An Interactive Lamp Controller

This project brief provides the instructions for building a weight-sensitive LED lamp with an Arduino Uno and a handful of commercially available parts.


How SoC Integration Impacts SMT Assembly Yield

How SoC Integration Impacts SMT Assembly Yield

Learn how SoC integration impacts SMT assembly yield, from fine-pitch BGA challenges and package warpage to reflow profiling and inspection strategies.


SoC Evaluation Boards Evolve to Meet New Design Complexities

SoC Evaluation Boards Evolve to Meet New Design Complexities

Modern SoC Evaluation Boards demand high-performance design, SI/PI, and system validation. Faraday offers 3 flexible service levels to meet these complexities.


Avoid Rework and Production Delays by Aligning Electrical and Mechanical Design

Avoid Rework and Production Delays by Aligning Electrical and Mechanical Design

Learn how to prevent costly assembly delays by synchronizing ECAD and MCAD workflows through continuous 3D validation. This also stabilizes production and eliminates mid-cycle re-spins.


Decisions Ahead for the Next Generation of Advanced Packaging

Decisions Ahead for the Next Generation of Advanced Packaging

Advanced packaging is at a crossroads due to AI demand. Learn the four emerging paths—CoWoS, CoPoS, glass-core, and CoWoP—and how to choose the right one for your multi-die system design.


At Embedded World, Renesas 365 Advances to General Availability Phase

At Embedded World, Renesas 365 Advances to General Availability Phase

The Renesas 365 Development platform unifies electronics design from MCU recommendation to validation.


News Mar 20, 2026 by Duane Benson
Constructing a Solar-Powered Snake Robot

Constructing a Solar-Powered Snake Robot

Learn how to create a batteryless crawling robot using basic electronic components and a 3D-printed chassis.


TE Connectivity AMPSEAL Robust Headers | Featured Product Spotlight

TE Connectivity AMPSEAL Robust Headers | Featured Product Spotlight

TE Connectivity AMPSEAL Robust Headers provide secure, high-reliability PCB connectivity designed for demanding industrial, commercial, and transportation applications. Watch and learn all about their features, specs, applications, and more!


Breaking Down 50 Million Pins: A Smarter Way to Design 3D IC Packages

Breaking Down 50 Million Pins: A Smarter Way to Design 3D IC Packages

The shift to 3D ICs and chiplets demands automated, hierarchical design planning to manage exploding pin counts. Learn how Siemens EDA's Innovator3D IC addresses these challenges.


Pickering Unwraps Free Toolset to Streamline ATE Signal Path Workflow

Pickering Unwraps Free Toolset to Streamline ATE Signal Path Workflow

Announced today, the free cloud-based toolset replaces spreadsheets with graphical signal path design for automated test engineers.


News Mar 05, 2026 by Luke James
Three Ways to Accelerate Cell Layout in DTCO

Three Ways to Accelerate Cell Layout in DTCO

The device technology co-optimization (DTCO) methodology requires generating large numbers of layouts. This article introduces a few ways of speeding up this time-consuming process using automation.


Same Sky Pogo Pins & PCB Pins | Featured Product Spotlight

Same Sky Pogo Pins & PCB Pins | Featured Product Spotlight

Same Sky Pogo Pins & PCB Pins offer a high-reliability interconnect solution featuring gold-plated contacts designed to withstand up to 100,000 mating cycles. Watch and learn all about their features, specs, applications, and more!


From 124-Layer PCBs to the 555 Timer: Our Favorite Content of the Year

From 124-Layer PCBs to the 555 Timer: Our Favorite Content of the Year

Explore our editors' top picks from 2025, featuring breakthrough AI hardware, legendary chip history, behind-the-scenes insights, and exclusive industry interviews.


News Dec 25, 2025 by Dale Wilson
Join the All About PCBs Virtual Summit, October 1st

Join the All About PCBs Virtual Summit, October 1st

Welcome to the first All About Circuits Summit Day of 2025! This guide will introduce the features of our first Wednesday schedule and help you plan your month-long participation.


News Sep 30, 2025 by Dale Wilson
SiTime Enters Resonator Market With Tiny MEMS-Based Devices

SiTime Enters Resonator Market With Tiny MEMS-Based Devices

Announced today, SiTime is expanding into a $4 billion resonator market with its Titan platform.


News Sep 17, 2025 by Jake Hertz
Stamp Turns Messy Breadboards Into Swappable PCB Blocks

Stamp Turns Messy Breadboards Into Swappable PCB Blocks

Kickstarter project Stamp aims to eliminate crowded breadboards using universal modular breakout PCBs.


News Sep 15, 2025 by Kristijan Nelkovski
Common Antenna Integration Challenges and How to Handle Them

Common Antenna Integration Challenges and How to Handle Them

The design of RF systems requires engineers to face complex challenges. Learn how automated tools augmented with AI are becoming available to help with this.


Why 90% of Component Compliance Issues Are Preventable (And How To Stop Them)

Why 90% of Component Compliance Issues Are Preventable (And How To Stop Them)

In today's rapidly evolving aerospace and defense landscape, component engineers face an unprecedented challenge: ensuring every part they specify meets stringent compliance requirements while maintaining mission readiness and program viability.


How Mature-Technology ASICs Can Give You the Edge

How Mature-Technology ASICs Can Give You the Edge

Learn how application-specific integrated circuits can enable companies to leverage their key IP and distinguish themselves from competitors who use off-the-shelf ICs.