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PCIe 7.0 Roundup: Test and Timing Tools Emerge as Ecosystem Takes Shape

PCIe 7.0 Roundup: Test and Timing Tools Emerge as Ecosystem Takes Shape

To support the transition to PCIe 7.0, three companies have introduced new automated testing applications, ultra-low-jitter clock generators, and protocol analysis platforms to bridge critical gaps in the existing market ecosystem.


News May 19, 2026 by Jake Hertz
Nuvoton Launches Easy-to-Use Tool to Build and Deploy AI on Its MCUs

Nuvoton Launches Easy-to-Use Tool to Build and Deploy AI on Its MCUs

The new GUI tool comes with features for automated AI development and deployment of Nuvotion MCU firmware.


News May 19, 2026 by Duane Benson
Rambus Introduces PCIe 7.0 Switch With Time-Division Multiplexing

Rambus Introduces PCIe 7.0 Switch With Time-Division Multiplexing

The new switch IP targets AI and data center SoCs that need to move data efficiently across CPUs, GPUs, accelerators, and NVMe storage without adding more physical lanes.


News May 15, 2026 by Luke James
Edge AI Development Is a Lifecycle Problem

Edge AI Development Is a Lifecycle Problem

Edge AI success is limited by memory and power. Fragmented tools cause failures. Learn how a cohesive, full-lifecycle approach unifying design and deployment is essential for scalable systems.


New Connectors Focus on AI Memory, Rugged Power, and Sealed USB Designs

New Connectors Focus on AI Memory, Rugged Power, and Sealed USB Designs

Attend, Samtec, and Same Sky have recently introduced new connectors that target modular AI memory integration, compact high-current interconnects, and environmentally sealed USB Type-C connectivity.


News May 13, 2026 by Joshua Tidwell
Altera Intros Upgrade of FPGA AI Suite Enabling Determinism for Physical AI

Altera Intros Upgrade of FPGA AI Suite Enabling Determinism for Physical AI

The new version of FPGA AI Suite is designed to accelerate trained AI models into FPGAs


News May 13, 2026 by Duane Benson
Europe’s Chip Ambitions: Why the EU’s Semi Strategy May Fall Short

Europe’s Chip Ambitions: Why the EU’s Semi Strategy May Fall Short

An audit finds that the European Chips Act is "very unlikely" to hit the 20% global market target by 2030, citing fragmented funding, slow progress on FOAKs, and fierce international competition.


News May 12, 2026 by Gordon Feller
SiTime Reveals MEMS Timing Device for AI Data Center GPU Optimization

SiTime Reveals MEMS Timing Device for AI Data Center GPU Optimization

The MEMS-based oscillator delivers less than 1 nanosecond of time synchronization accuracy for AI clusters.


News May 11, 2026 by Jake Hertz
Intel and US Semi Fabrication Gets Huge Boost on Rumors from SpaceX, Apple

Intel and US Semi Fabrication Gets Huge Boost on Rumors from SpaceX, Apple

SpaceX’s proposed Terafab and Apple's preliminary discussions indicate escalating pressure to expand domestic semiconductor production.


News May 11, 2026 by Jake Hertz
Arm Axion Heads Google’s 8th-Gen TPUs as Cloud Pivots to Agentic AI

Arm Axion Heads Google’s 8th-Gen TPUs as Cloud Pivots to Agentic AI

Google Cloud split the TPU line into training and inference variants, with Arm Neoverse-based Axion CPUs as the host across the stack. Arm also rolled out Performix, a free performance toolkit aimed at the silicon's growing developer base.


News May 05, 2026 by Luke James
TDK Unwraps Software Tools for Sensor Data and IMU Evaluation

TDK Unwraps Software Tools for Sensor Data and IMU Evaluation

Today, the company released two new AI software products at Sensors Converge, SensorGPT, for creating sensor data at scale, and SensorStage to accelerate development workflow for the company’s latest IMUs.


News May 05, 2026 by Duane Benson
The Hidden Cooling Bottleneck Inside Liquid-Cooled AI Data Centers

The Hidden Cooling Bottleneck Inside Liquid-Cooled AI Data Centers

Learn how liquid cooling eliminates system airflow, creating a hidden thermal bottleneck for 'left-behind' components like memory and SSDs. Targeted micro-cooling is required to restore system balance.


Congatec Module Adds NPU-Based AI to Entry-Level x86 Embedded Designs

Congatec Module Adds NPU-Based AI to Entry-Level x86 Embedded Designs

The module brings Intel's NPU-integrated processors to entry-level x86 systems, scaling edge AI performance and simplifying integration and long-term upgrades.


News May 04, 2026 by Joshua Tidwell
How Neuromorphic Chips are Revolutionizing the Edge

How Neuromorphic Chips are Revolutionizing the Edge

Neuromorphic Edge AI chips mark a fundamental departure from traditional silicon, utilizing brain-inspired, event-driven architectures to enable real-time inference within milliwatt-level power budgets.


Rebellions: The Korean Company to Watch in 2026?

Rebellions: The Korean Company to Watch in 2026?

Learn how Korean AI technology company Rebellions uses proprietary dataflow NPUs, chiplets, and HBM to deliver high-efficiency, scalable AI inference for modern data centers.


News Apr 27, 2026 by Gordon Feller
More Control, Less Chaos With Microchip’s New All-in-One DSCs

More Control, Less Chaos With Microchip’s New All-in-One DSCs

Microchip’s new digital signal controllers integrate high-resolution control, high-speed analog, and post-quantum cryptography.


News Apr 24, 2026 by Joshua Tidwell
Mesh AI: Node-Level Intelligence with Non-Cellular 5G/6G Connectivity

Mesh AI: Node-Level Intelligence with Non-Cellular 5G/6G Connectivity

Learn how LM Semi's Mesh AI platform delivers autonomous, secure, node-level intelligence via non-cellular NR+ mesh networks, addressing AI scalability for billions of devices.


News Apr 17, 2026 by Gordon Feller
Infineon Reveals End-to-End Upgrades of Its Power and Sensing Portfolio

Infineon Reveals End-to-End Upgrades of Its Power and Sensing Portfolio

The company’s latest silicon, silicon carbide, and gallium nitride solutions offer a complete power conversion chain from the grid to the processor for AI data centers.


News Apr 16, 2026 by Jake Hertz
Indie Semiconductor Releases First Commercial UV DFB Laser at 399 nm

Indie Semiconductor Releases First Commercial UV DFB Laser at 399 nm

Geared for quantum systems, Indie engineered the narrow-linewidth laser engineered for ytterbium atom cooling, which eliminates the need for external optical stacks.


News Apr 14, 2026 by Luke James
EW ‘26 Exclusive—Nuvoton Talks MCUs: Low-Power, Edge AI, Automotive, and More

EW ‘26 Exclusive—Nuvoton Talks MCUs: Low-Power, Edge AI, Automotive, and More

We spoke to Nuvoton’s Walter Tseng in this exclusive Embedded World 2026 interview. Our focus was all things microcontrollers, ranging from low power to Edge AI to automotive MCUs.


News Apr 13, 2026 by Jeff Child