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Nexperia Creates a New FET Category: the Application-Specific FET (ASFET)

FETs and MOSFETs don't always cut it for dynamic applications. Nexperia says it has created a new flavor of FETs designed to rise to the challenge.

October 26, 2020 by Antonio Anzaldua Jr.

As 5G Begins and Moore’s Law Ends, Multichip Packaging May Be a Memory Solution

As 5G speed and storage demands collide with the end of Moore's law, chipmakers are turning to multichip packaging to save space and power.

October 26, 2020 by Steve Arar

Reviewing the Broad Strokes of 5G Technology

With 5G closer than ever, it may be useful to brush up on the basics.

October 23, 2020 by John Koon

Why Thermal Management is a Hot Topic in 5G Design

As 5G barrels forward, engineers are increasingly talking about one of the major design challenges of this technology: thermal management.

October 21, 2020 by Steve Arar

While CPUs and GPUs Work Harder in Data Centers, DPUs Work Smarter

As next-gen data centers amp up processing and speed, they're going to need processing units that can handle the heft of AI and machine learning.

October 14, 2020 by Nicholas St. John

Applying the t-Test to Engineered Systems

This article provides an example of how we can use t-testing to determine if an experiment has produced a statistically significant change in system performance.

October 12, 2020 by Robert Keim

Molex LTE and 5G External Cellular Antennas | Digital Datasheet

AAC’s Digital Datasheet video series introduces the specs and applications of components—both new and familiar—straight from their datasheets.

October 09, 2020 by Heilind Electronics

How Will 5G’s High-Frequency Band Affect Signal Integrity?

5G will operate at frequencies significantly faster than those of 4G, forcing PCB designers to rethink how their boards are designed and manufactured.

October 05, 2020 by Jake Hertz

NXP Pushes 5G With New Arizona Fab Focused on GaN Power Amplifiers

NXP Semiconductors has announced the opening of its new high-volume RF GaN fab in Chandler, Arizona, representing the United States’ most advanced fab dedicated to 5G RF power amplifiers.

October 02, 2020 by Luke James

What is DrMOS—the IC Powering Next-Gen Processors?

Integrated powertrain devices go back at least as far as 2004 when Intel wrote the specification for DrMOS, a high-efficiency high-current IC for powering next-gen processors.

September 30, 2020 by Adrian Gibbons

Xilinx Hardware Accelerators Link Up With O-RAN to Push 5G Server Performance

Hardware acceleration is said to create a new 5G throughput reality with 42x encoding and 24x decoding improvements for FEC and HARQ line coding.

September 21, 2020 by Adrian Gibbons

Determining Which PoE Transformer Is Best: Flyback or Forward?

With IoT on the rise, engineers are increasingly faced with options of transformer topologies in Power-over-Ethernet (PoE)-based designs.

September 15, 2020 by Antonio Anzaldua Jr.

Four Telecom Players Team Up for 5G “Network Functions Virtualization” Platform

Samsung, Hewlett Packard, Intel, and SK Telecom have recently announced their partnership to develop an NFV platform aimed at democratizing 5G.

September 12, 2020 by Jake Hertz

App Note: ST’s New Generation of 650 V SiC Diodes

Learn about ST's second-gen silicon carbide diodes, which feature improvements to current capability and peak reverse voltage while keeping the switching-off behavior that makes SiC so attractive.

In partnership with STMicroelectronics

TO-LL and MDmesh M6: The Latest Breakthrough in High-Level Telecom SMPS

This paper presents the ST’s new SMD package TO-LL (TO-LeadLess) and its benefits in terms of thermal management, PCB area, switching performance, and parasitic inductance on the leads.

In partnership with STMicroelectronics

Infineon`s new OPTIGA™ Connect IoT eSIM solution

Learn more about our new eSIM turnkey solution with pre-integrated connectivity for cellular-connected IoT devices.

In partnership with Infineon

Long-Range Wireless STM32WL Microcontrollers

Complementing the STM32 RF connectivity portfolio, the STM32WL System-On-Chip integrates both a general-purpose microcontroller and a sub-GHz radio on the same chip.

In partnership with STMicroelectronics

Room Temperature Liquid-Metal Battery Could Provide More Power Than Li-ion

Texas researchers realize the strengths of both solid-state and liquid-state batteries in the first room-temperature liquid-metal battery.

August 29, 2020 by Luke James

Intel’s 10nm “SuperFin” Makes 18% Leap in Performance—Without Transitioning Nodes

The SuperFin is an enhanced FinFET combined with a super MIM capacitor and an interconnect metal stack. What doors will this 10nm transistor open?

August 19, 2020 by Rushi Patel

Highest Efficiency with Infineon’s 3.3 kW CCM Bidirectional Totem-Pole PFC

This bridgeless totem-pole power factor correction board is intended for applications that require high efficiency and high power density such as high-end server and telecom. In addition, the bidirectional power flow capability allows this design to be used in battery chargers or battery formation applications.

In partnership with Infineon