Advanced packaging is at a crossroads due to AI demand. Learn the four emerging paths—CoWoS, CoPoS, glass-core, and CoWoP—and how to choose the right one for…
Advanced packaging is at a crossroads due to AI demand. Learn the four emerging paths—CoWoS, CoPoS, glass-core, and CoWoP—and how to choose the right one for your multi-die system design.
The Renesas 365 Development platform unifies electronics design from MCU recommendation to validation.
The Renesas 365 Development platform unifies electronics design from MCU recommendation to validation.
A new human-centered toolkit includes goal-driven autonomous agents within established verification environments.
A new human-centered toolkit includes goal-driven autonomous agents within established verification environments.
The shift to 3D ICs and chiplets demands automated, hierarchical design planning to manage exploding pin counts. Learn…
The shift to 3D ICs and chiplets demands automated, hierarchical design planning to manage exploding pin counts. Learn how Siemens EDA's Innovator3D IC addresses these challenges.
Announced today, the free cloud-based toolset replaces spreadsheets with graphical signal path design for automated test…
Announced today, the free cloud-based toolset replaces spreadsheets with graphical signal path design for automated test engineers.
The W3510E workflow targets pre-layout modeling, EM analysis, and early UCIe and BoW validation for advanced AI…
The W3510E workflow targets pre-layout modeling, EM analysis, and early UCIe and BoW validation for advanced AI infrastructure designs.
The device technology co-optimization (DTCO) methodology requires generating large numbers of layouts. This article…
The device technology co-optimization (DTCO) methodology requires generating large numbers of layouts. This article introduces a few ways of speeding up this time-consuming process using automation.
A cluster of early February deals pulled wireless MCUs, clocking IP, analog sensors, and AI-driven inspection software…
A cluster of early February deals pulled wireless MCUs, clocking IP, analog sensors, and AI-driven inspection software into larger platforms spanning IoT, automotive, industrial, and semiconductor manufacturing.
Same Sky Pogo Pins & PCB Pins offer a high-reliability interconnect solution featuring gold-plated contacts designed to…
Same Sky Pogo Pins & PCB Pins offer a high-reliability interconnect solution featuring gold-plated contacts designed to withstand up to 100,000 mating cycles. Watch and learn all about their features, specs, applications, and more!
Announced today, the new ChipStack AI Super Agent from Cadence automates front end silicon design and verification,…
Announced today, the new ChipStack AI Super Agent from Cadence automates front end silicon design and verification, delivering a 10X productivity increase.
The research program aims to improve heat-prediction accuracy at the nanoscale while reducing simulation time for…
The research program aims to improve heat-prediction accuracy at the nanoscale while reducing simulation time for advanced semiconductor design.
The new toolkit integrates with Keysight’s device modeling software to automate parameter extraction and shorten…
The new toolkit integrates with Keysight’s device modeling software to automate parameter extraction and shorten compact-model and PDK development cycles.
In this article, we'll walk through the steps of generating a Process Design Kit (PDK) for digital standard cell libraries.
In this article, we'll walk through the steps of generating a Process Design Kit (PDK) for digital standard cell libraries.
Siemens says it can reduce setup time from months to days with the off-the-shelf, cloud-based, digital twin offering.
Siemens says it can reduce setup time from months to days with the off-the-shelf, cloud-based, digital twin offering.
This article explores how digital twins can help to reshape the design methodology of automotive semiconductors and…
This article explores how digital twins can help to reshape the design methodology of automotive semiconductors and systems, enabling truly software-defined vehicles.
Quilter has designed a fully functional Unix computer using AI, compressing a quarter's worth of PCB design time into a…
Quilter has designed a fully functional Unix computer using AI, compressing a quarter's worth of PCB design time into a single week.
Rebellions employed Synopsys' VCS, ZeBu, Virtualizer, and the Verification Continuum to achieve full bring-up and live…
Rebellions employed Synopsys' VCS, ZeBu, Virtualizer, and the Verification Continuum to achieve full bring-up and live demo just five weeks after first silicon.
FPGAs are limited by outdated proprietary software. Learn how embracing open-source tools is necessary to modernize FPGA…
FPGAs are limited by outdated proprietary software. Learn how embracing open-source tools is necessary to modernize FPGA development and unlock their full potential.
Taoglas has rolled out a major update to its Antenna Integrator tool, adding AI-enhanced modeling, realistic PCB-shape…
Taoglas has rolled out a major update to its Antenna Integrator tool, adding AI-enhanced modeling, realistic PCB-shape templates, and new export features aimed at tightening collaboration between electrical and mechanical teams.
Synopsys recently announced expanded generative AI capabilities through offerings such as Ansys Engineering Copilot and…
Synopsys recently announced expanded generative AI capabilities through offerings such as Ansys Engineering Copilot and AgentEngineer technology.
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