In the past, we touched on the theoretical underpinnings of voltage-level translators. Now, we'll discuss some practical design tips for using these increasingly-common devices in your design.
December 11, 2020 by Nicholas St. John
U.S. Department of Defense-backed secure fab SkyWater is set to adopt Multibeam’s Multicolumn Electron-Beam Lithography system in its 45 nm process.
November 28, 2020 by Luke James
Depending on the project, designers have a number of options to either etch security at the silicon level or buy a pre-fabricated and pre-programmed security IC.
November 13, 2020 by Antonio Anzaldua Jr.
The new GaN FET family, which includes an integrated gate driver, is said to double power density in onboard chargers and industrial power supplies.
November 10, 2020 by Jake Hertz
Applied Materials and BE Semiconductor Industries announce that they are to develop the "industry’s first complete and proven equipment solution for die-based hybrid bonding."
October 31, 2020 by Luke James
As an EE, you might wonder how DDR5 can support blazing-fast transfer rates. One factor is an equalization technique called decision feedback equalization (DFE).
October 29, 2020 by Steve Arar
Automated optical inspections can only be so thorough with QFLN packages. Pairing QFLN packages with side-wettable flanks facilitate the PCB assembly process.
October 15, 2020 by Jake Hertz
"Master” and “slave” have been used for decades in engineering vernacular. Now, many tech companies are pushing for more neutral terms.
October 06, 2020 by Tyler Charboneau
5G will operate at frequencies significantly faster than those of 4G, forcing PCB designers to rethink how their boards are designed and manufactured.
October 05, 2020 by Jake Hertz
NXP Semiconductors has announced the opening of its new high-volume RF GaN fab in Chandler, Arizona, representing the United States’ most advanced fab dedicated to 5G RF power amplifiers.
October 02, 2020 by Luke James
Silicon Labs and STRATIS announced a collaboration to connect smart apartment complexes. What tech underlies this news?
September 29, 2020 by Jake Hertz
Engineers are finding ways to innovate face masks with electronics—whether for air filtration, an LED smile, or language translation.
September 26, 2020 by Adrian Gibbons
The researchers met the challenges of fabric-based sensors, combining the signal quality benefits of wet electrodes and the comfort benefits of dry electrodes.
September 21, 2020 by Luke James
Researchers at CEA-Leti have developed a novel X-ray photon-counting detector that has been integrated into an X-ray scanner with promising initial trial results.
September 19, 2020 by Luke James
Molded interconnect devices, when conditioned with laser direct imaging, could be a helpful 3D supplement to PCB design.
September 16, 2020 by Adrian Gibbons
Researchers have found that just a touch of gold can change the structure of a crystal and effectively turn it into a semiconductor.
September 16, 2020 by Luke James
Digi-Key says its Marketplace platform gives engineers access to millions of products from a variety of suppliers—all on one website.
August 18, 2020 by Luke James
When inkjet droplets dry in a "coffee stain" pattern, printed electronic devices can malfunction. A new formula spreads evenly to eliminate the issue.
August 17, 2020 by Antonio Anzaldua Jr.
All About Circuits is hosting its first digital expo—marked by 50+ interactive live sessions with industry experts, a flood of new educational content, and 100 giveaway prizes.
August 12, 2020 by Hannah DeTavis
A new laser direct imaging technology may significantly increase the speed of solder mask production at a low cost.
August 10, 2020 by Jake Hertz
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