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Cadence’s Recent Acquisitions Reveal Focus on Computational Fluid Dynamics

This year alone, Cadence has acquired both Pointwise and NUMECA, two companies specializing in multi-physics simulations and specifically computational fluid dynamics. How might this focus reflect Cadence's EDA strategy?

one day ago by Jake Hertz

Why Physical Verification Is Only Getting Tougher With Advanced Nodes

In the nanometer era, IC complexity grows faster than die areas. EDA companies are stepping up with tools to streamline physical verification.

5 days ago by Antonio Anzaldua Jr.

Chip vs. PIFA: Selecting the Right Antenna for a Booming IoT Medical Industry

Amidst a burgeoning medical device market, choosing the correct IoT antenna means balancing competing requirements, including frequency of operation, PCB space, and cost.

April 05, 2021 by Adrian Gibbons

Texas Power Outages Illustrate the State’s Importance to the Semi Industry

The outages last month marked yet another setback to an industry that was already having serious trouble with meeting demand from automakers.

March 28, 2021 by Luke James

MIT Researchers Strike the Sweet Spot Between Fiber Optic and Copper Cabling

At just the width of a human hair, a new type of cable from MIT and Raytheon is said to be ten times faster than USB.

March 03, 2021 by Jake Hertz

The Race Toward Room-temperature Superconductors Heats Up

This month alone, multiple research institutions have flooded the press with news of a singular goal: to create room-temperature superconductors.

February 25, 2021 by Jake Hertz

Increased Funds Could Catalyze TSMC’s 3D IC Research

The world’s biggest contract chipmaker recently reported its best-ever quarterly financials along with its goals for delving into 3D IC research.

February 22, 2021 by Luke James

iRel40: The European Initiative Determined to Improve Component Reliability

Europe-wide research initiative Intelligent Reliability 4.0 (iRel40), coordinated by Infineon, brings together 75 science, tech, and engineering partners from across 13 countries who are sharing resources to achieve this goal.

February 17, 2021 by Luke James

As GaN Adoption Accelerates, an Industry Expert Offers Three Design Tips

GaN FETs aren't a perfect drop-in for their silicon counterparts—without board-level modifications, that is. We spoke with Alex Lidow, CEO of Efficient Power Conversion, to get his advice on how to make the transition.

February 01, 2021 by Jake Hertz

PCB Design Considerations When Using Bi-Directional Translators

In the past, we touched on the theoretical underpinnings of voltage-level translators. Now, we'll discuss some practical design tips for using these increasingly-common devices in your design.

December 11, 2020 by Nicholas St. John

Department of Defense Backs New Secure Electron Beam Lithography Initiative

U.S. Department of Defense-backed secure fab SkyWater is set to adopt Multibeam’s Multicolumn Electron-Beam Lithography system in its 45 nm process.

November 28, 2020 by Luke James

Security IC Solutions: Build or Buy?

Depending on the project, designers have a number of options to either etch security at the silicon level or buy a pre-fabricated and pre-programmed security IC.

November 13, 2020 by Antonio Anzaldua Jr.

TI Turns to GaN FETs to Cut Board Space and Boost Power Density in EVs

The new GaN FET family, which includes an integrated gate driver, is said to double power density in onboard chargers and industrial power supplies.

November 10, 2020 by Jake Hertz

Applied Materials and BE Semiconductor Partner to Develop Chip Integration Technology

Applied Materials and BE Semiconductor Industries announce that they are to develop the "industry’s first complete and proven equipment solution for die-based hybrid bonding."

October 31, 2020 by Luke James

Decision Feedback Equalization: the Technique Driving DDR5’s Blazing-Fast Transfer Rates

As an EE, you might wonder how DDR5 can support blazing-fast transfer rates. One factor is an equalization technique called decision feedback equalization (DFE).

October 29, 2020 by Steve Arar

QFLN Packages and Automated Optical Inspections are Incompatible. Side-Wettable Flanks Bridge the Gap

Automated optical inspections can only be so thorough with QFLN packages. Pairing QFLN packages with side-wettable flanks facilitate the PCB assembly process.

October 15, 2020 by Jake Hertz

How “Master” and “Slave” Terminology is Being Reexamined in Electrical Engineering

"Master” and “slave” have been used for decades in engineering vernacular. Now, many tech companies are pushing for more neutral terms.

October 06, 2020 by Tyler Charboneau

How Will 5G’s High-Frequency Band Affect Signal Integrity?

5G will operate at frequencies significantly faster than those of 4G, forcing PCB designers to rethink how their boards are designed and manufactured.

October 05, 2020 by Jake Hertz

NXP Pushes 5G With New Arizona Fab Focused on GaN Power Amplifiers

NXP Semiconductors has announced the opening of its new high-volume RF GaN fab in Chandler, Arizona, representing the United States’ most advanced fab dedicated to 5G RF power amplifiers.

October 02, 2020 by Luke James

Double the Protocols, Cut the Board Space: How Multi-Protocol SoCs are Simplifying IoT Design

Silicon Labs and STRATIS announced a collaboration to connect smart apartment complexes. What tech underlies this news?

September 29, 2020 by Jake Hertz