The ML100E series offers 41 standard models with varying VDC inputs and output ranges along with short circuit protection and a wide range of temperature tolerances.
January 15, 2020 by Cabe Atwell
Zuken’s eCADSTAR now includes design constraint management for length-, delay-, and skew-based routing.
December 28, 2019 by Gary Elinoff
A new polyphenylene sulfide (PPS) film from Toray Industries offers low dielectric losses as well as thermal and flame resistance.
December 25, 2019 by Gary Elinoff
ST’s STPMIC1 is both a general-purpose system power management device and a companion chip for the STM32MP1 microprocessor.
December 10, 2019 by Gary Elinoff
The NPIM_PE series are automotive-grade metal composite SMT power inductors with an operating temperature range of ‐55°C to +155°C.
November 20, 2019 by Cabe Atwell
Here are some connectors around the industry that can endure harsh environments, save PCB space, and withstand water exposure.
November 16, 2019 by Robin Mitchell
The new evaluation board simplifies the process of evaluating gallium nitride-based, half-bridge or full-bridge power supplies.
November 11, 2019 by Gary Elinoff
The BMR4615001/001’s input ranges from 4.5 to 14 volts, while its output ranges from 0.6 to 3.3 volts.
November 08, 2019 by Gary Elinoff
The EVAL-M5-E1B1245N-SiC supports the design of industrial drive motor applications of up to 7.5 kW.
November 07, 2019 by Gary Elinoff
Microchip's newest SoC and module feature a power amplifier and flash memory, enabling them to better support Sony’s LDAC technology.
October 08, 2019 by Gary Elinoff
Silicon carbide (SiC) power devices have been singled out by automakers for high-speed charging in automotive applications.
September 13, 2019 by Gary Elinoff
DragonFly LDM extends the scope of 3D printing to the unattended, low-volume manufacturing of electronic circuitry.
July 29, 2019 by Gary Elinoff
Ever wish you could see your design file layers overtop your spun board? Augmented reality may make that possible in real time.
July 22, 2019 by Mark Hughes
These new components debuted at Sensors Expo ahead of a new dev board for optical sensor development.
July 02, 2019 by Gary Elinoff
AAC had a chance to talk with Matt Berggren, Director of the EAGLE and Tinkercad teams at Autodesk.
June 22, 2019 by Mark Hughes
Ellison speaks on the importance of networking, giving to the EE community, and helping younger engineers.
June 19, 2019 by Mark Hughes
Learn about a new board that uses an FPGA for serial communication in avionics applications.
May 28, 2019 by Gary Elinoff
Wolfspeed doubles down on SiC with a $1 billion investment towards Wolfspeed Schottky diodes and MOSFETs.
May 14, 2019 by Gary Elinoff
A new tool from foundry group X-FAB aims to mitigate the negative effects of substrate coupling in IC design.
May 13, 2019 by Gary Elinoff
Single-stage architecture provides independently-regulated constant voltage and constant current outputs.
April 08, 2019 by Gary Elinoff
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