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Ousting 1900s-era Tech? Solid-state Circuit Breakers Extract DC from AC without Magnetics

Extracting DC from AC without any magnetics at all? A new solid-state circuit breaker put forth by Amber Solutions in partnership with Infineon Technologies stands to cause some pretty intense waves by displacing the nearly century-old technology upon which our electrical infrastructure is built.

July 06, 2021 by Kate Smith

Simplifying Power IC Designs: 3 Companies Tackle Power Conversion Systems

Simplifying designs are never easy, especially with power. So how did these three companies tackle simplifying power conversion systems?

July 02, 2021 by Antonio Anzaldua Jr.

Moving Space to Earth: Perseverance Tech for Earth Applications

Space technology is a testbed for promising, new technologies, not only for space but for Earth applications as well. How are recent advances in space affecting Earth?

May 21, 2021 by Tyler Charboneau

Samsung Shoots for High-performance Computing with 2.5D High-bandwidth Memory

Die stacking is becoming more commonplace with Samsung Electronics' next-generation 2.5D advanced package technology.

May 10, 2021 by Adrian Gibbons

Single-chip Controllers Fuel the Ultra-wide Touchscreens Taking Over Dashboards

While capacitive touch sensors attract the spotlight in automotive touchscreen technology (and rightly so), single-chip controllers also warrant consideration for the ever-popular ultra-wide touchscreens in vehicles today.

April 22, 2021 by Adrian Gibbons

Cadence’s Recent Acquisitions Reveal Focus on Computational Fluid Dynamics

This year alone, Cadence has acquired both Pointwise and NUMECA, two companies specializing in multi-physics simulations and specifically computational fluid dynamics. How might this focus reflect Cadence's EDA strategy?

April 18, 2021 by Jake Hertz

Why Physical Verification Is Only Getting Tougher With Advanced Nodes

In the nanometer era, IC complexity grows faster than die areas. EDA companies are stepping up with tools to streamline physical verification.

April 14, 2021 by Antonio Anzaldua Jr.

Chip vs. PIFA: Selecting the Right Antenna for a Booming IoT Medical Industry

Amidst a burgeoning medical device market, choosing the correct IoT antenna means balancing competing requirements, including frequency of operation, PCB space, and cost.

April 05, 2021 by Adrian Gibbons

Texas Power Outages Illustrate the State’s Importance to the Semi Industry

The outages last month marked yet another setback to an industry that was already having serious trouble with meeting demand from automakers.

March 28, 2021 by Luke James

MIT Researchers Strike the Sweet Spot Between Fiber Optic and Copper Cabling

At just the width of a human hair, a new type of cable from MIT and Raytheon is said to be ten times faster than USB.

March 03, 2021 by Jake Hertz

The Race Toward Room-temperature Superconductors Heats Up

This month alone, multiple research institutions have flooded the press with news of a singular goal: to create room-temperature superconductors.

February 25, 2021 by Jake Hertz

Increased Funds Could Catalyze TSMC’s 3D IC Research

The world’s biggest contract chipmaker recently reported its best-ever quarterly financials along with its goals for delving into 3D IC research.

February 22, 2021 by Luke James

iRel40: The European Initiative Determined to Improve Component Reliability

Europe-wide research initiative Intelligent Reliability 4.0 (iRel40), coordinated by Infineon, brings together 75 science, tech, and engineering partners from across 13 countries who are sharing resources to achieve this goal.

February 17, 2021 by Luke James

As GaN Adoption Accelerates, an Industry Expert Offers Three Design Tips

GaN FETs aren't a perfect drop-in for their silicon counterparts—without board-level modifications, that is. We spoke with Alex Lidow, CEO of Efficient Power Conversion, to get his advice on how to make the transition.

February 01, 2021 by Jake Hertz

PCB Design Considerations When Using Bi-Directional Translators

In the past, we touched on the theoretical underpinnings of voltage-level translators. Now, we'll discuss some practical design tips for using these increasingly-common devices in your design.

December 11, 2020 by Nicholas St. John

Department of Defense Backs New Secure Electron Beam Lithography Initiative

U.S. Department of Defense-backed secure fab SkyWater is set to adopt Multibeam’s Multicolumn Electron-Beam Lithography system in its 45 nm process.

November 28, 2020 by Luke James

Security IC Solutions: Build or Buy?

Depending on the project, designers have a number of options to either etch security at the silicon level or buy a pre-fabricated and pre-programmed security IC.

November 13, 2020 by Antonio Anzaldua Jr.

TI Turns to GaN FETs to Cut Board Space and Boost Power Density in EVs

The new GaN FET family, which includes an integrated gate driver, is said to double power density in onboard chargers and industrial power supplies.

November 10, 2020 by Jake Hertz

Applied Materials and BE Semiconductor Partner to Develop Chip Integration Technology

Applied Materials and BE Semiconductor Industries announce that they are to develop the "industry’s first complete and proven equipment solution for die-based hybrid bonding."

October 31, 2020 by Luke James

Decision Feedback Equalization: the Technique Driving DDR5’s Blazing-Fast Transfer Rates

As an EE, you might wonder how DDR5 can support blazing-fast transfer rates. One factor is an equalization technique called decision feedback equalization (DFE).

October 29, 2020 by Steve Arar