Thread Group and Broadband Forum are partnering to unify IoT mesh with broadband infrastructure. Also, the new Thread Tools app launches to provide real-world…
Thread Group and Broadband Forum are partnering to unify IoT mesh with broadband infrastructure. Also, the new Thread Tools app launches to provide real-world network diagnostics for engineers.
The new XpressConnect PCIe 6.0 and CXL 3.1 Retimers reign in signal integrity challenges in AI data centers and other…
The new XpressConnect PCIe 6.0 and CXL 3.1 Retimers reign in signal integrity challenges in AI data centers and other high-bandwidth installations.
Broadcom’s high-integration Wi-Fi 8 & NPU-accelerated 50G PON gateway SoCs aim to build a cohesive, 50 Gbps broadband…
Broadcom’s high-integration Wi-Fi 8 & NPU-accelerated 50G PON gateway SoCs aim to build a cohesive, 50 Gbps broadband access ecosystem for the AI-infused home.
A South Korean startup, KoolMicro, is betting that liquid cooling built into the chip package itself is the only way to…
A South Korean startup, KoolMicro, is betting that liquid cooling built into the chip package itself is the only way to handle the next generation of GPU heat loads.
The new version of FPGA AI Suite is designed to accelerate trained AI models into FPGAs
The new version of FPGA AI Suite is designed to accelerate trained AI models into FPGAs
Learn how The Netherlands is leveraging billion-euro investments and European partnerships to scale integrated photonics…
Learn how The Netherlands is leveraging billion-euro investments and European partnerships to scale integrated photonics from research into a world-leading, industrially mature production ecosystem.
GaN-based power delivery board targets 96.5% efficiency and 2,100 W/in3 for NVIDIA's next-generation 800 VDC data center…
GaN-based power delivery board targets 96.5% efficiency and 2,100 W/in3 for NVIDIA's next-generation 800 VDC data center architecture.
Gen5 QLC client SSDs, enterprise LPDDR5X with RAIDDR ECC, and HBM4-era AI memory concepts anchor a week of announcements.
Gen5 QLC client SSDs, enterprise LPDDR5X with RAIDDR ECC, and HBM4-era AI memory concepts anchor a week of announcements.
Look out, flash! With a resounding vote of confidence from Texas Instruments and Onsemi, ReRAM may be here to stay.
Look out, flash! With a resounding vote of confidence from Texas Instruments and Onsemi, ReRAM may be here to stay.
The company optimized the device's dual-voltage design for high-speed, low-power 1.2 V SoC applications.
The company optimized the device's dual-voltage design for high-speed, low-power 1.2 V SoC applications.
The new device is the first sixth-generation registered clock driver for DDR5 registered dual in-line memory modules.
The new device is the first sixth-generation registered clock driver for DDR5 registered dual in-line memory modules.
Announced today, Broadcom’s Gen 8 128G Fibre Channel switch portfolio is claimed as the first quantum-safe, SAN…
Announced today, Broadcom’s Gen 8 128G Fibre Channel switch portfolio is claimed as the first quantum-safe, SAN architecture with 128G speed, AI-powered SAN management, and quantum-safe cryptography.
Toshiba adds a new tier to its surveillance lineup with a hard disk drive built to handle AI-driven video systems at scale.
Toshiba adds a new tier to its surveillance lineup with a hard disk drive built to handle AI-driven video systems at scale.
Fresh from a $17.5M Series A, RAAAM’s novel embedded memory tech aims to reshape SoC design, pushing beyond the…
Fresh from a $17.5M Series A, RAAAM’s novel embedded memory tech aims to reshape SoC design, pushing beyond the SRAM-DRAM tradeoff.
Announced today, the new software works with SiTime hardware to create the most accurate and reliable data center,…
Announced today, the new software works with SiTime hardware to create the most accurate and reliable data center, networking, and communications timing system.
Micron’s 1γ LPDDR5X memory delivers record-breaking speed and efficiency for AI at the edge.
Micron’s 1γ LPDDR5X memory delivers record-breaking speed and efficiency for AI at the edge.
Announced today, the high-performance switch IC enables scale-up and scale-out for AI networks and supports co-packaged optics.
Announced today, the high-performance switch IC enables scale-up and scale-out for AI networks and supports co-packaged optics.
Structera CXL interoperability will drive memory performance increases for data centers operating both AMD EPYC CPUs and…
Structera CXL interoperability will drive memory performance increases for data centers operating both AMD EPYC CPUs and 5th Gen Intel Xeon CPUs.
JEDEC’s HBM4 standard delivers up to 2 TB/s bandwidth, higher capacity (up to 64 GB per stack), and improved…
JEDEC’s HBM4 standard delivers up to 2 TB/s bandwidth, higher capacity (up to 64 GB per stack), and improved efficiency for AI and HPC.
Unveiled today at Embedded World, Cisco and IBM have already adopted the CPUs with their “Zen 5” architecture, which…
Unveiled today at Embedded World, Cisco and IBM have already adopted the CPUs with their “Zen 5” architecture, which offers server-grade performance and efficiency.
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