The single chip integrates 64-bit quad-core Arm Cortex-A53 and the dual-core Arm Cortex-R5 based processing system.
3 hours ago by Lisa Boneta
Going firmly against the grain, the new system will rely on Wi-Fi, and not 5G.
October 29, 2019 by Gary Elinoff
The AP22913 features slew-rate control and true reverse-current blocking for single-channel load switching.
October 25, 2019 by Gary Elinoff
The MLX90821 measures pressures that dip down to 50 mbars in the EVAP systems of internal combustion or hybrid engines.
October 23, 2019 by Gary Elinoff
Robust NVM (non-volatile memory) can now more easily co-exist with power functions on the same chip.
October 18, 2019 by Gary Elinoff
Renesas and StradVision are leveling up automotive camera solutions with deep learning for object recognition on low-power SoCs.
September 30, 2019 by Gary Elinoff
Cree is doubling down on SiC with new facility expansions and the creation of what it claims will be the largest silicon carbide device manufacturing facility in the world.
September 26, 2019 by Gary Elinoff
SiLabs wants to be the one-stop shop for designers of ADAS and infotainment systems, Ethernet switches, and 5G applications.
September 25, 2019 by Gary Elinoff
TDK's newest devices span applications in both liquid and air-based media.
September 20, 2019 by Gary Elinoff
The 40V-rated DMTH4008LFDFWQ and the 60V-rated DMTH6016LFDFWQ sport space-saving DFN2020 packages.
September 16, 2019 by Gary Elinoff
Silicon carbide (SiC) power devices have been singled out by automakers for high-speed charging in automotive applications.
September 13, 2019 by Gary Elinoff
Power Integrations' AEC-Q100-qualified LQ10N200CQ and LQ20N200CQ diodes target automotive audio systems.
NSITEXE utilizes Synopsys’ development tools and IP to build a SoC (system-on-a-chip) for autonomous driving.
September 09, 2019 by Gary Elinoff
The SPM-VT series meets the high thermal and current demands of the automotive LED headlight environment.
September 04, 2019 by Gary Elinoff
Composed of 35 billion transistors, the VU19P is the newest member of the 16 nm Virtex UltraScale+ family.
August 28, 2019 by Gary Elinoff
Learn the different ways companies are using time-of-flight 3D sensor technology to create products for facial recognition, smart cars, and manufacturing.
August 24, 2019 by Gary Elinoff
The ISL78714 provides voltage and temperature monitoring and meets critical international safety criteria.
August 12, 2019 by Gary Elinoff
Nissan has adopted Renesas's R-Car SOC and RH850 MCU for its ProPilot2 driver assistance system.
August 08, 2019 by Gary Elinoff
Today, Dialog Semiconductors announces a GreenPak configurable mixed-signal IC that has been cleared for use in the automotive industry.
August 07, 2019 by Robin Mitchell
Toshiba Memory has just announced a tiny, fast new memory form factor.
August 06, 2019 by Jennifer DeLaOsa
The ST8500 PLC chipset allows smart meters to communicate wirelessly through existing power cables or RF waves.
19 hours ago by Cabe Atwell
The three new members of Vishay's IHLP family feature inductances ranging from 0.10 to 3.3 µH and profiles as low as 1.0 mm.
one day ago by Gary Elinoff
The ADIN1300 is a low-latency, single-port Ethernet transceiver for gigabit-speed operation in harsh environments.
2 days ago by Gary Elinoff
Sized at only 1.5 mm2, members of the AS621x family offer a range of temperature accuracies for design flexibility.
3 days ago by Gary Elinoff
The I-CUBE-LRWAN Expansion Package allows developers to support the latest firmware updated over the air (FUOTA) specifications from the LoRa Alliance.
3 days ago by Lisa Boneta
The new evaluation board simplifies the process of evaluating gallium nitride-based, half-bridge or full-bridge power supplies.
4 days ago by Gary Elinoff
The ever-advancing field of artificial intelligence is opening new vistas for securing homes and public spaces alike.
November 09, 2019 by Gary Elinoff
The BMR4615001/001’s input ranges from 4.5 to 14 volts, while its output ranges from 0.6 to 3.3 volts.
November 08, 2019 by Gary Elinoff
Google’s OpenTitan is a collaborative venture with tech companies that offers multi-factor security keys and RoT technology, which will be baked into new chips.
November 08, 2019 by Cabe Atwell
The EVAL-M5-E1B1245N-SiC supports the design of industrial drive motor applications of up to 7.5 kW.
November 07, 2019 by Gary Elinoff
The new version of Simics provides a secure, shared platform aimed to help embedded developers virtually simulate a full target system.
November 06, 2019 by Lisa Boneta
The pre-engineered module aims to save developers the effort of finding and deploying separate sensing solutions.
November 06, 2019 by Gary Elinoff
The highly sensitive flicker sensor is designed to deliver distortion-free images and videos captured on a smartphone camera.
November 05, 2019 by Gary Elinoff
TI designed the new ADC to capture low-distortion audio recordings from far distances or in noisy environments.
November 05, 2019 by Lisa Boneta
Dialog Semiconductor today announced a new BLE SoC—one it claims is the smallest and least power-hungry on the market.
November 04, 2019 by Robin Mitchell
Are modules a convenient timesaver? Or a harbinger of changes to how modern engineers design?
November 02, 2019 by Kate Smith
Concord Pro allows each player in the design process to share up-to-date component information.
November 01, 2019 by Gary Elinoff
The die-to-die PHY IP enables extra-short reach connectivity in multi-chip modules (MCM) for hyper-scale data centers, AI, and networking applications.
November 01, 2019 by Lisa Boneta
Diode Incorporated’s 40V, 2.2MHz synchronous buck converters are designed for high efficiency across all loads.
October 31, 2019 by Gary Elinoff
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