The ML100E series offers 41 standard models with varying VDC inputs and output ranges along with short circuit protection and a wide range of temperature tolerances.
January 15, 2020 by Cabe Atwell
Zuken’s eCADSTAR now includes design constraint management for length-, delay-, and skew-based routing.
December 28, 2019 by Gary Elinoff
A new polyphenylene sulfide (PPS) film from Toray Industries offers low dielectric losses as well as thermal and flame resistance.
December 25, 2019 by Gary Elinoff
ST’s STPMIC1 is both a general-purpose system power management device and a companion chip for the STM32MP1 microprocessor.
December 10, 2019 by Gary Elinoff
The NPIM_PE series are automotive-grade metal composite SMT power inductors with an operating temperature range of ‐55°C to +155°C.
November 20, 2019 by Cabe Atwell
Here are some connectors around the industry that can endure harsh environments, save PCB space, and withstand water exposure.
November 16, 2019 by Robin Mitchell
The new evaluation board simplifies the process of evaluating gallium nitride-based, half-bridge or full-bridge power supplies.
November 11, 2019 by Gary Elinoff
The BMR4615001/001’s input ranges from 4.5 to 14 volts, while its output ranges from 0.6 to 3.3 volts.
November 08, 2019 by Gary Elinoff
The EVAL-M5-E1B1245N-SiC supports the design of industrial drive motor applications of up to 7.5 kW.
November 07, 2019 by Gary Elinoff
Microchip's newest SoC and module feature a power amplifier and flash memory, enabling them to better support Sony’s LDAC technology.
October 08, 2019 by Gary Elinoff
Silicon carbide (SiC) power devices have been singled out by automakers for high-speed charging in automotive applications.
September 13, 2019 by Gary Elinoff
DragonFly LDM extends the scope of 3D printing to the unattended, low-volume manufacturing of electronic circuitry.
July 29, 2019 by Gary Elinoff
Ever wish you could see your design file layers overtop your spun board? Augmented reality may make that possible in real time.
July 22, 2019 by Mark Hughes
These new components debuted at Sensors Expo ahead of a new dev board for optical sensor development.
July 02, 2019 by Gary Elinoff
AAC had a chance to talk with Matt Berggren, Director of the EAGLE and Tinkercad teams at Autodesk.
June 22, 2019 by Mark Hughes
Ellison speaks on the importance of networking, giving to the EE community, and helping younger engineers.
June 19, 2019 by Mark Hughes
Learn about a new board that uses an FPGA for serial communication in avionics applications.
May 28, 2019 by Gary Elinoff
Wolfspeed doubles down on SiC with a $1 billion investment towards Wolfspeed Schottky diodes and MOSFETs.
May 14, 2019 by Gary Elinoff
A new tool from foundry group X-FAB aims to mitigate the negative effects of substrate coupling in IC design.
May 13, 2019 by Gary Elinoff
Single-stage architecture provides independently-regulated constant voltage and constant current outputs.
April 08, 2019 by Gary Elinoff
The size of a postage stamp, ChipSats form a sensor network to carry out tasks of larger satellites.
2 hours ago by Lisa Boneta
Just a few weeks into the new year, many companies are progressing 5G to make 2020 the "year of 5G."
7 hours ago by Gary Elinoff
The LM63635 is a wide-input-voltage-range buck regulator that is specifically intended for automotive applications.
one day ago by Robert Keim
While IoT and IIoT are based on similar hardware, their specific applications warrant different data processing, protocols, and security considerations.
one day ago by Lisa Boneta
The new LDMOS-based device is designed for efficient operations in the industrial, scientific, and medical (ISM) band.
one day ago by Gary Elinoff
Position trackers and position sensors are fundamentally different. Yet sometimes outside of engineering spaces, we hear the terms used interchangeably. Here's why the distinction matters.
3 days ago by Tyler Charboneau
Available in ultra-thin QFN (UQFN) packages, the new devices measure at 3mm x 3mm x 0.65mm.
4 days ago by Gary Elinoff
BOXiedge is a 24-core mini-server driven by an SoC clocked at 1GHz. What about this solution speaks to the trend toward edge computing?
5 days ago by Robin Mitchell
The SZ1101 (33W) and SZ1105 (65W) incorporate four key ACF subsystems to simply design and reduce BOM count.
5 days ago by Gary Elinoff
Based on familiar COTS devices, these two radiation-hardened devices are designed to facilitate space-based Ethernet connectivity.
January 15, 2020 by Gary Elinoff
Renesas’ ISL91301B PMIC is featured in Google’s Coral devices, including the Mini PCIe Accelerator, M.2 Accelerator, and SoM.
January 15, 2020 by Cabe Atwell
Qorvo claims that ACT475M is the industry’s first AEC-Q100-qualified PMIC DC-DC buck converter aimed at USB Type-C fast charging applications.
January 14, 2020 by Gary Elinoff
The TMC7300 can deliver two amps to drive either one or two DC motors, relays, and LEDs.
January 13, 2020 by Gary Elinoff
CES 2020 offered new insights and product announcements regarding 5G, automotive, IoT, and AI. But which of these trends should engineers pay attention to?
January 13, 2020 by Lisa Boneta
During CES 2020, Google announced new hardware editions and upgrades to the Coral ecosystem, including an Accelerator Module, the Dev Board Mini, and a System-on-Module.
January 13, 2020 by Cabe Atwell
Whether we like it or not, electrical engineers are deeply implicated in the world’s confusing and expensive quest for quality of life.
January 12, 2020 by Robert Keim
This article reviews how AI is making its way into education, which in turn may direct the future of Industry 4.0.
January 11, 2020 by Cabe Atwell
Maxim states that the MAX20340 shrinks the size of the power interface by 13mm2 and increases mechanical reliability.
January 10, 2020 by Gary Elinoff
The new power management IC is said to help designers build smaller, less intrusive automotive camera systems.
January 09, 2020 by Gary Elinoff
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