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Intel Develops Glass Substrate for Next Gen Advanced Chip Packaging Needs

Intel has unveiled new glass substrate technology for large chiplet based system-in-package chips. Glass substrates allow for denser packing of chiplets—an important for applications like AI and others.

2 days ago by Duane Benson

Navitas Technology Takes GaN to New Power Heights

A new and improved GaN technology is moving from the cell phone charger market into higher power, high-reliability applications. EE Power spoke with Navitas’ Stephen Oliver to find out how, and we’ve got everything engineers need to know.

About 3 days ago by Barbara Vergetis Lundin

AI Networking Chip Startup, Enfabrica, Receives $125 Million in Series B Funding

With Nvidia now added to its list of strategic investors, Enfabrica has opened pre-orders on systems using its AI era fabric switch IC

September 15, 2023 by Duane Benson

At DAC 2023, EDA Tools Roll Aimed at Next-gen IC Design and Verification

A slew of new electronic design automation (EDA) tools and resources for IC design and verification were debuted at last week’s DAC 2023 event. Here’s a sampling.

July 17, 2023 by Darshil Patel

Eliyan Talks First Silicon on ‘Most Efficient’ Chiplet Interconnect

Claiming record time for its first silicon, chiplet interconnect specialist Eliyan lays out its case for how its Nulink UCIe interconnect offers advantages over silicon interposer approaches.

June 19, 2023 by Duane Benson

Photonic Chip Design Rethink Could Cut Data Center Energy Use

Leveraging novel photonic circuit designs, researchers hope to lower electricity consumption in data centers.

June 02, 2023 by Kristijan Nelkovski

Axelera AI Raises $50 Million to ‘Mainstream’ Edge AI

Leveraging its proprietary in-memory compute scheme and RISC-V dataflow technology, Axelera AI seeks to “democratize” artificial intelligence (AI).

May 31, 2023 by Jake Hertz

Broadcom to Supply Apple’s 5G Components in the US

Despite Apple’s internal efforts, the company still needs to rely on third parties for wireless chips.

May 24, 2023 by Jake Hertz

Semtech Unveils Chip That Eases 5G Mobile Device Compliance

A new IC from Semtech hopes to improve 5G device performance in the face of Specific Absorption Rate compliance.

April 17, 2023 by Jake Hertz

Synopsys Debuts Full-stack AI-based EDA Tool Suite for IC Engineers

At today’s Synopsys Users Group (SNUG) event, Synopsys has unveiled a full-stack suite of AI-based EDA tools.

March 29, 2023 by Jeff Child

Startup Enfabrica’s Accelerated Compute Fabric Addresses AI/ML in the Cloud

The networking silicon and software company emerged from stealth mode today at the inaugural MemCon, where it is introducing new Accelerated Compute Fabric (ACF) devices with the goal of addressing interface bottlenecks and scalability challenges in AI computing.

March 28, 2023 by Dale Wilson

Metasurface Research Could Usurp LCDs as Flat Screen Technology

New research hopes to pave a path towards using metasurfaces as a display technology.

February 27, 2023 by Jake Hertz

At ISSCC, IMEC Unveils Charge-pump PLL Design for Short Range Radars

At this week’s 70th annual ISSCC event, research firm IMEC is presenting a phase-locked loop (PLL) IC design aimed at automotive and industry radar systems.

February 20, 2023 by Jeff Child

Power ICs Debut as High-side and Low-side Smart Switch Solutions

A slew of high-side and low-side smart switch chips have emerged, offering interesting alternatives for a variety of automotive and industrial use cases.

February 10, 2023 by Jake Hertz

Rambus Spins 6.4 GT/s DDR5 Registering Clock Driver for Speedier Servers

The latest chip from Rambus raises the speed limit for DDR5, giving memory-hungry applications, such as data center servers, more room to run.

February 06, 2023 by Aaron Carman

Siemens Rolls Out IC Design Tool for Data-driven Verification

Seeking to leverage today’s data-rich engineering world, Siemens has released Questa Verification IQ, a software platform enabling data-driven IC verification.

February 03, 2023 by Jeff Child

IEEE RWW Keynotes: Future of RF Looks Rocky and That’s a Good Thing

At IEEE Radio and Wireless Week (RWW), keynote speakers highlighted the trends in RF and wireless technology, and how design engineers must adapt to meet the new challenges head on.

February 02, 2023 by Aaron Carman

Researchers Tap Origami as Basis for Reconfigurable Antenna Design

Aimed at improving sensing and imaging systems, Princeton University researchers have developed a reconfigurable antenna based on origami.

February 01, 2023 by Darshil Patel

IEEE Radio and Wireless Week Panel: Getting to D-Band is a Group Effort

At IEEE Radio and Wireless Week 2023, industry leaders in chip fabrication and measurement engaged in a panel discussion to give engineers their opinions on the future of D-band technology.

January 30, 2023 by Aaron Carman

Research Efforts Signal Next Steps for Quantum Processor Evolution

A trio of research papers offers new ideas that may solve some of the biggest hurdles to quantum processing technology.

January 14, 2023 by Kristijan Nelkovski