Intel has unveiled new glass substrate technology for large chiplet based system-in-package chips. Glass substrates allow for denser packing of chiplets—an important for applications like AI and others.
2 days ago by Duane Benson
A new and improved GaN technology is moving from the cell phone charger market into higher power, high-reliability applications. EE Power spoke with Navitas’ Stephen Oliver to find out how, and we’ve got everything engineers need to know.
About 3 days ago by Barbara Vergetis Lundin
The networking silicon and software company emerged from stealth mode today at the inaugural MemCon, where it is introducing new Accelerated Compute Fabric (ACF) devices with the goal of addressing interface bottlenecks and scalability challenges in AI computing.
March 28, 2023 by Dale Wilson