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Your 2023 Back-to-School Guide to All About Circuits’ Educational Resources

Your 2023 Back-to-School Guide to All About Circuits’ Educational Resources

Whether you are just starting your first year as an engineering student, working on a second or third degree, or simply want to brush up on key topics, All About Circuits has the resources you need: awesome textbooks, technical articles, calculators, and more for your EE studies.


News Oct 11, 2023 by Jeff Child
Intel Develops Glass Substrate for Next Gen Advanced Chip Packaging Needs

Intel Develops Glass Substrate for Next Gen Advanced Chip Packaging Needs

Intel has unveiled new glass substrate technology for large chiplet based system-in-package chips. Glass substrates allow for denser packing of chiplets—an important for applications like AI and others.


News Sep 25, 2023 by Duane Benson
Navitas Technology Takes GaN to New Power Heights

Navitas Technology Takes GaN to New Power Heights

A new and improved GaN technology is moving from the cell phone charger market into higher power, high-reliability applications. EE Power spoke with Navitas’ Stephen Oliver to find out how, and we’ve got everything engineers need to know.


AI Networking Chip Startup, Enfabrica, Receives $125 Million in Series B Funding

AI Networking Chip Startup, Enfabrica, Receives $125 Million in Series B Funding

With Nvidia now added to its list of strategic investors, Enfabrica has opened pre-orders on systems using its AI era fabric switch IC


News Sep 15, 2023 by Duane Benson
At DAC 2023, EDA Tools Roll Aimed at Next-gen IC Design and Verification

At DAC 2023, EDA Tools Roll Aimed at Next-gen IC Design and Verification

A slew of new electronic design automation (EDA) tools and resources for IC design and verification were debuted at last week’s DAC 2023 event. Here’s a sampling.


News Jul 17, 2023 by Darshil Patel
Eliyan Talks First Silicon on ‘Most Efficient’ Chiplet Interconnect

Eliyan Talks First Silicon on ‘Most Efficient’ Chiplet Interconnect

Claiming record time for its first silicon, chiplet interconnect specialist Eliyan lays out its case for how its Nulink UCIe interconnect offers advantages over silicon interposer approaches.


News Jun 19, 2023 by Duane Benson
Photonic Chip Design Rethink Could Cut Data Center Energy Use

Photonic Chip Design Rethink Could Cut Data Center Energy Use

Leveraging novel photonic circuit designs, researchers hope to lower electricity consumption in data centers.


News Jun 02, 2023 by Kristijan Nelkovski
Axelera AI Raises $50 Million to ‘Mainstream’ Edge AI

Axelera AI Raises $50 Million to ‘Mainstream’ Edge AI

Leveraging its proprietary in-memory compute scheme and RISC-V dataflow technology, Axelera AI seeks to “democratize” artificial intelligence (AI).


News May 31, 2023 by Jake Hertz
Broadcom to Supply Apple’s 5G Components in the US

Broadcom to Supply Apple’s 5G Components in the US

Despite Apple’s internal efforts, the company still needs to rely on third parties for wireless chips.


News May 24, 2023 by Jake Hertz
Semtech Unveils Chip That Eases 5G Mobile Device Compliance

Semtech Unveils Chip That Eases 5G Mobile Device Compliance

A new IC from Semtech hopes to improve 5G device performance in the face of Specific Absorption Rate compliance.


News Apr 17, 2023 by Jake Hertz
Synopsys Debuts Full-stack AI-based EDA Tool Suite for IC Engineers

Synopsys Debuts Full-stack AI-based EDA Tool Suite for IC Engineers

At today’s Synopsys Users Group (SNUG) event, Synopsys has unveiled a full-stack suite of AI-based EDA tools.


News Mar 29, 2023 by Jeff Child
Startup Enfabrica’s Accelerated Compute Fabric Addresses AI/ML in the Cloud

Startup Enfabrica’s Accelerated Compute Fabric Addresses AI/ML in the Cloud

The networking silicon and software company emerged from stealth mode today at the inaugural MemCon, where it is introducing new Accelerated Compute Fabric (ACF) devices with the goal of addressing interface bottlenecks and scalability challenges in AI computing.


News Mar 28, 2023 by Dale Wilson
Metasurface Research Could Usurp LCDs as Flat Screen Technology

Metasurface Research Could Usurp LCDs as Flat Screen Technology

New research hopes to pave a path towards using metasurfaces as a display technology.


News Feb 27, 2023 by Jake Hertz
At ISSCC, IMEC Unveils Charge-pump PLL Design for Short Range Radars

At ISSCC, IMEC Unveils Charge-pump PLL Design for Short Range Radars

At this week’s 70th annual ISSCC event, research firm IMEC is presenting a phase-locked loop (PLL) IC design aimed at automotive and industry radar systems.


News Feb 20, 2023 by Jeff Child
Power ICs Debut as High-side and Low-side Smart Switch Solutions

Power ICs Debut as High-side and Low-side Smart Switch Solutions

A slew of high-side and low-side smart switch chips have emerged, offering interesting alternatives for a variety of automotive and industrial use cases.


News Feb 10, 2023 by Jake Hertz
Rambus Spins 6.4 GT/s DDR5 Registering Clock Driver for Speedier Servers

Rambus Spins 6.4 GT/s DDR5 Registering Clock Driver for Speedier Servers

The latest chip from Rambus raises the speed limit for DDR5, giving memory-hungry applications, such as data center servers, more room to run.


News Feb 06, 2023 by Aaron Carman
Siemens Rolls Out IC Design Tool for Data-driven Verification

Siemens Rolls Out IC Design Tool for Data-driven Verification

Seeking to leverage today’s data-rich engineering world, Siemens has released Questa Verification IQ, a software platform enabling data-driven IC verification.


News Feb 03, 2023 by Jeff Child
IEEE RWW Keynotes: Future of RF Looks Rocky and That’s a Good Thing

IEEE RWW Keynotes: Future of RF Looks Rocky and That’s a Good Thing

At IEEE Radio and Wireless Week (RWW), keynote speakers highlighted the trends in RF and wireless technology, and how design engineers must adapt to meet the new challenges head on.


News Feb 02, 2023 by Aaron Carman
Researchers Tap Origami as Basis for Reconfigurable Antenna Design

Researchers Tap Origami as Basis for Reconfigurable Antenna Design

Aimed at improving sensing and imaging systems, Princeton University researchers have developed a reconfigurable antenna based on origami.


News Feb 01, 2023 by Darshil Patel
IEEE Radio and Wireless Week Panel: Getting to D-Band is a Group Effort

IEEE Radio and Wireless Week Panel: Getting to D-Band is a Group Effort

At IEEE Radio and Wireless Week 2023, industry leaders in chip fabrication and measurement engaged in a panel discussion to give engineers their opinions on the future of D-band technology.


News Jan 30, 2023 by Aaron Carman