The demand for better connectivity has prompted the shift to 112G PAM4, though there are many challenges like signal integrity. Taking on these challenges, Microchip unveils its latest solution.
September 09, 2021 by Jake Hertz
Hoping to take the "edge" off of data center workloads comes two new additions to Semtech's Tri-Edge family. What are they and how do they help data centers keep up through data center interconnects?
September 03, 2021 by Antonio Anzaldua Jr.
Direct physical interfaces between sensor and processor over long distances is a major challenge in automotive design. The IEEE 2977-2021 MIPI A-PHY specification might be the key to this challenge.
July 15, 2021 by Adrian Gibbons
While DDR5 is often hailed for its increased memory, processing reliability, and performance, an often-overlooked feature of this DRAM is its security capabilities—especially in automotive applications.
March 02, 2021 by Antonio Anzaldua Jr.
Wi-SUN FAN may be a worthwhile alternative to LoRaWAN and NB-IoT. Now, ROHM has developed a Wi-SUN FAN module with the promise of increased reliability and security in LPWA mesh networks.
March 02, 2021 by Jake Hertz