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New IEEE Standard Takes Aim at Easing Long-Reach SerDes Automotive Design

Direct physical interfaces between sensor and processor over long distances is a major challenge in automotive design. The IEEE 2977-2021 MIPI A-PHY specification might be the key to this challenge.

July 15, 2021 by Adrian Gibbons

TI’s Sitara AM2x Platform Blurs the Lines Between MCU and MPU

Recently, All About Circuits had the chance to talk with Texas Instruments about its newest MCU development, the Sitara AM2x.

July 12, 2021 by Jake Hertz

From Safety to Design Simplification: IoT Design Takes Another Leap Forward

Recently IoT has been at the forefront of everyone's mind, especially for Renesas, Silicon Labs, and Nordic Semiconductor. What IoT innovations have they come up with lately?

July 09, 2021 by Jake Hertz

Marvell’s OCTEON 10: The First DPU To Use Neoverse N2 ARMv9 Architecture

Marvell’s newest 5 nm data processing unit (DPU), the OCTEON 10, offers 3x improvement over the previous generation along with the newest ARMv9 Core.

July 07, 2021 by Adrian Gibbons

IBM Accelerates Germany as a Quantum Hub with EU’s First Quantum Computer

Quantum computing momentum just got faster with the EU's first quantum computer: IBM's "Quantum System One." What could this computer mean for the EU, quantum technology, and Germany?

June 24, 2021 by Tyler Charboneau

A “Shelf-life” for FinFETs? Samsung and TSMC Improve Node Density for RF

Single-digit node process is nothing new, but existing technology hampers RF performance due to parasitics. Samsung Foundry and TSMC seek to bring single-digit node performance to RF chips.

June 17, 2021 by Adrian Gibbons

Easing the Effort: Mipsology Accelerates ML with Zebra FPGA IP

Today, Mipsology is announcing its solution for FPGA programming: Zebra FPGA IP. This IP aims to ease FPGA programming, giving the designer more time to design.

June 09, 2021 by Sam Holland

“Smart” Power Lines? ST’s SoC and RF Chipset Get Industry-first Certification

The G3-PLC hybrid standard ensures interoperability and is key to STMicroelectronics delivering competitive market solutions for power line communications.

June 03, 2021 by Adrian Gibbons

Concrete Batteries: Cementing a New Foundation for Energy Storage?

In a newly published paper, researchers from Chalmers University describe how they were able to turn cement into a medium for electrical energy storage.

May 28, 2021 by Jake Hertz

Qualcomm Aims for a Wireless Industry with 5G IIoT Chipset

This week All About Circuits had the chance to sit down with Qualcomm and talk about its newest chipset for IIoT and how it is moving 5G to industrial settings.

May 21, 2021 by Jake Hertz

Google Hires Intel CPU Expert, Doubles Down on SoCs as the “New Motherboard”

Intel veteran Uri Frank has been hired by Google as its new VP of engineering for server chip design. What does this mean for Google's custom silicon?

March 24, 2021 by Jake Hertz

MIT Researchers Strike the Sweet Spot Between Fiber Optic and Copper Cabling

At just the width of a human hair, a new type of cable from MIT and Raytheon is said to be ten times faster than USB.

March 03, 2021 by Jake Hertz

Emerging DDR5 Technology Shows Promise in Securing Automotive Memory

While DDR5 is often hailed for its increased memory, processing reliability, and performance, an often-overlooked feature of this DRAM is its security capabilities—especially in automotive applications.

March 02, 2021 by Antonio Anzaldua Jr.

ROHM Module Casts Confidence on Wi-SUN FAN, the New Long-range Protocol on the Block

Wi-SUN FAN may be a worthwhile alternative to LoRaWAN and NB-IoT. Now, ROHM has developed a Wi-SUN FAN module with the promise of increased reliability and security in LPWA mesh networks.

March 02, 2021 by Jake Hertz

New Switch Families Aim to Break Down Complicated Network Infrastructure Walls

Microchip is seeking to cut through the fog of network complexity with two new families—one family of Ethernet switches and one family of PCIe 5.0 switches.

February 05, 2021 by Jake Hertz

As mmWave Tech Matures, T&M Equipment and Techniques are Shifting, Too

While millimeter wave technology is by no means new, test and measurement suppliers are releasing innovative tips and equipment to help test engineers address higher-frequency challenges.

January 29, 2021 by Antonio Anzaldua Jr.

On a Single Chip, ST Integrates ESD Protection and Network Matching for GNSS

While impedance-matching and electrostatic-discharge protection usually fall on the shoulders of discrete components, a new chipset is said to integrate both features in the same IC package.

January 25, 2021 by Adrian Gibbons

The Rollout of Wi-Fi 6E-Compatible Devices Has (Slowly) Begun

The CES 2021 stage has debuted the hardware of some of the first Wi-Fi 6E devices. What are the benefits and challenges of this new connectivity protocol?

January 15, 2021 by Tyler Charboneau

More Cells, More Range: TI’s Wireless Battery Management System Frees EV Space for More Design Innovation

We spoke with Texas Instruments to learn more about this new tech, which they feel can shake up the EV industry.

January 07, 2021 by Jake Hertz

Snapdragon 888: Qualcomm’s First High-End Chip with a Build-In Modem

Qualcomm recently unveiled Snapdragon 888, the company’s new high-end mobile platform built on the N5 process node.

December 08, 2020 by Luke James